DUAL BUFFER AMPLIFIER, CDIP16
LH2110 | LH2110D | LH2210D | LH2310D | |
---|---|---|---|---|
描述 | DUAL BUFFER AMPLIFIER, CDIP16 | DUAL BUFFER AMPLIFIER, CDIP16 | DUAL BUFFER AMPLIFIER, CDIP16 | DUAL BUFFER AMPLIFIER, CDIP16 |
是否Rohs认证 | - | 不符合 | 不符合 | 不符合 |
零件包装代码 | - | DIP | DIP | DIP |
包装说明 | - | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 |
针数 | - | 16 | 16 | 16 |
Reach Compliance Code | - | unknow | unknow | unknow |
ECCN代码 | - | EAR99 | EAR99 | EAR99 |
放大器类型 | - | BUFFER | BUFFER | BUFFER |
最大平均偏置电流 (IIB) | - | 0.01 µA | 0.01 µA | 0.01 µA |
标称带宽 (3dB) | - | 20 MHz | 20 MHz | 20 MHz |
25C 时的最大偏置电流 (IIB) | - | 0.003 µA | 0.003 µA | 0.007 µA |
最大输入失调电压 | - | 6000 µV | 6000 µV | 10000 µV |
JESD-30 代码 | - | R-CDIP-T16 | R-CDIP-T16 | R-CDIP-T16 |
JESD-609代码 | - | e0 | e0 | e0 |
负供电电压上限 | - | -18 V | -18 V | -18 V |
标称负供电电压 (Vsup) | - | -15 V | -15 V | -15 V |
功能数量 | - | 2 | 2 | 2 |
端子数量 | - | 16 | 16 | 16 |
最高工作温度 | - | 125 °C | 85 °C | 70 °C |
封装主体材料 | - | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
封装代码 | - | DIP | DIP | DIP |
封装等效代码 | - | DIP16,.3 | DIP16,.3 | DIP16,.3 |
封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | - | IN-LINE | IN-LINE | IN-LINE |
峰值回流温度(摄氏度) | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
电源 | - | +-15 V | +-15 V | +-15 V |
认证状态 | - | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | - | 4.672 mm | 4.672 mm | 4.672 mm |
标称压摆率 | - | 30 V/us | 30 V/us | 30 V/us |
最大压摆率 | - | 11 mA | 11 mA | 11 mA |
供电电压上限 | - | 18 V | 18 V | 18 V |
标称供电电压 (Vsup) | - | 15 V | 15 V | 15 V |
表面贴装 | - | NO | NO | NO |
技术 | - | HYBRID | HYBRID | HYBRID |
温度等级 | - | MILITARY | OTHER | COMMERCIAL |
端子面层 | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | - | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | - | 2.54 mm | 2.54 mm | 2.54 mm |
端子位置 | - | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | - | 7.62 mm | 7.62 mm | 7.62 mm |
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