GlobalOptoisolator™
6-Pin DIP Random-Phase
Optoisolators Triac Driver Output
(250 Volts Peak)
The MOC3010 Series consists of gallium arsenide infrared emitting diodes,
optically coupled to silicon bilateral switch and are designed for applications
requiring isolated triac triggering, low–current isolated ac switching, high
electrical isolation (to 7500 Vac peak), high detector standoff voltage, small
size, and low cost.
•
To order devices that are tested and marked per VDE 0884 requirements, the
suffix ”V” must be included at end of part number. VDE 0884 is a test option.
Recommended for 115 Vac(rms) Applications:
•
Solenoid/Valve Controls
•
Lamp Ballasts
•
Interfacing Microprocessors to 115 Vac Peripherals
•
Motor Controls
•
Static ac Power Switch
•
Solid State Relays
•
Incandescent Lamp Dimmers
MAXIMUM RATINGS
(TA = 25°C unless otherwise noted)
Rating
INFRARED EMITTING DIODE
Reverse Voltage
Forward Current — Continuous
Total Power Dissipation @ TA = 25°C
Negligible Power in Transistor
Derate above 25°C
OUTPUT DRIVER
Off–State Output Terminal Voltage
Peak Repetitive Surge Current
(PW = 1 ms, 120 pps)
Total Power Dissipation @ TA = 25°C
Derate above 25°C
TOTAL DEVICE
Isolation Surge Voltage(1)
(Peak ac Voltage, 60 Hz, 1 Second Duration)
Total Power Dissipation @ TA = 25°C
Derate above 25°C
Junction Temperature Range
Ambient Operating Temperature Range
Storage Temperature Range
Soldering Temperature (10 s)
VISO
PD
TJ
TA
Tstg
TL
7500
330
4.4
– 40 to +100
– 40 to +85
– 40 to +150
260
Vac(pk)
mW
mW/°C
°C
°C
°C
°C
VDRM
ITSM
PD
250
1
300
4
Volts
A
mW
mW/°C
VR
IF
PD
3
60
100
1.33
Volts
mA
mW
mW/°C
MOC3010
MOC3011
MOC3012
6
1
STANDARD THRU HOLE
COUPLER SCHEMATIC
1
2
6
5
4
Symbol
Value
Unit
3
1.
2.
3.
4.
5.
ANODE
CATHODE
NC
MAIN TERMINAL
SUBSTRATE
DO NOT CONNECT
6. MAIN TERMINAL
1. Isolation surge voltage, VISO, is an internal device dielectric breakdown rating.
1.
For this test, Pins 1 and 2 are common, and Pins 4, 5 and 6 are common.
MOC3010, MOC3011, MOC3012
ELECTRICAL CHARACTERISTICS
(TA = 25°C unless otherwise noted)
Characteristic
INPUT LED
Reverse Leakage Current
(VR = 3 V)
Forward Voltage
(IF = 10 mA)
OUTPUT DETECTOR
(IF = 0 unless otherwise noted)
Peak Blocking Current, Either Direction
(Rated VDRM(1))
Peak On–State Voltage, Either Direction
(ITM = 100 mA Peak)
Critical Rate of Rise of Off–State Voltage (Figure 7, Note 2)
COUPLED
LED Trigger Current, Current Required to Latch Output
(Main Terminal Voltage = 3 V(3))
MOC3010
MOC3011
MOC3012
Holding Current, Either Direction
1.
2.
3.
3.
IFT
—
—
—
IH
—
8
5
3
100
15
10
5
—
µA
mA
IDRM
VTM
dv/dt
—
—
—
10
1.8
10
100
3
—
nA
Volts
V/µs
IR
VF
—
—
0.05
1.15
100
1.5
µA
Volts
Symbol
Min
Typ
Max
Unit
Test voltage must be applied within dv/dt rating.
This is static dv/dt. See Figure 7 for test circuit. Commutating dv/dt is a function of the load–driving thyristor(s) only.
All devices are guaranteed to trigger at an IF value less than or equal to max IFT. Therefore, recommended operating IF lies between max
IFT (15 mA for MOC3010, 10 mA for MOC3011, 5 mA for MOC3012) and absolute max IF (60 mA).
TYPICAL ELECTRICAL CHARACTERISTICS
TA = 25°C
2
VF, FORWARD VOLTAGE (VOLTS)
1.8
PULSE ONLY
PULSE OR DC
1.6
1.4
1.2
1
1
TA = –40°C
25°C
85°C
10
100
IF, LED FORWARD CURRENT (mA)
1000
ITM , ON-STATE CURRENT (mA)
+800
+400
0
–400
–800
–3
–2
–1
0
1
2
VTM, ON–STATE VOLTAGE (VOLTS)
3
Figure 1. LED Forward Voltage versus Forward Current
Figure 2. On–State Characteristics
MOC3010, MOC3011, MOC3012
IFT, NORMALIZED LED TRIGGER CURRENT
1.5
1.3
NORMALIZED IFT
25
20
NORMALIZED TO:
PWin 100
µs
q
1.1
15
0.9
10
0.7
0.5
–40
5
0
1
–20
0
20
40
60
TA, AMBIENT TEMPERATURE (°C)
80
100
2
5
10
20
PWin, LED TRIGGER WIDTH (µs)
50
100
Figure 3. Trigger Current versus Temperature
Figure 4. LED Current Required to Trigger versus
LED Pulse Width
12
10
dv/dt, STATIC (V/
µ
s)
8
6
4
2
0
25 30
STATIC dv/dt
CIRCUIT IN FIGURE 6
40
50
60
70
80
TA, AMBIENT TEMPERATURE (°C)
90
100
Figure 5. dv/dt versus Temperature
+250
Vdc
RTEST
R = 10 kΩ
PULSE
INPUT
CTEST
MERCURY
WETTED
RELAY
X100
SCOPE
PROBE
D.U.T.
1. The mercury wetted relay provides a high speed repeated
pulse to the D.U.T.
2. 100x scope probes are used, to allow high speeds and
voltages.
3. The worst–case condition for static dv/dt is established by
triggering the D.U.T. with a normal LED input current, then
removing the current. The variable RTEST allows the dv/dt to be
gradually increased until the D.U.T. continues to trigger in
response to the applied voltage pulse, even after the LED
current has been removed. The dv/dt is then decreased until
the D.U.T. stops triggering.
t
RC is measured at this point and
recorded.
Vmax = 250 V
APPLIED VOLTAGE
WAVEFORM
158 V
dv dt
t
RC
0 VOLTS
V
+
0.63 RCmax
+
158
RC
t
t
Figure 6. Static dv/dt Test Circuit
MOC3010, MOC3011, MOC3012
TYPICAL APPLICATION CIRCUITS
NOTE: This optoisolator should not be used to drive a load directly.
It is intended to be a trigger device only. Additional
information on the use of the MOC3010/3011/3012 is
available in Application Note AN–780A.
RL
VCC Rin
1
2
MOC3010
MOC3011
MOC3012
6
180
120 V
60 Hz
ZL
VCC Rin
1
2
MOC3010
MOC3011
MOC3012
6
180
0.1
µF
4
2.4 k
C1
120 V
60 Hz
4
Figure 7. Resistive Load
Figure 8. Inductive Load with Sensitive Gate Triac
(IGT
15 mA)
p
ZL
VCC Rin
1
2
MOC3010
MOC3011
MOC3012
6
180
0.2
µF
4
1.2 k
C1
120 V
60 Hz
Figure 9. Inductive Load with Non–Sensitive Gate Triac
(15 mA
IGT
50 mA)
t
t
MOC3010, MOC3011, MOC3012
PACKAGE DIMENSIONS
–A–
6
4
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
DIM
A
B
C
D
E
F
G
J
K
L
M
N
INCHES
MIN
MAX
0.320
0.350
0.240
0.260
0.115
0.200
0.016
0.020
0.040
0.070
0.010
0.014
0.100 BSC
0.008
0.012
0.100
0.150
0.300 BSC
0
_
15
_
0.015
0.100
STYLE 6:
PIN 1.
2.
3.
4.
5.
6.
MILLIMETERS
MIN
MAX
8.13
8.89
6.10
6.60
2.93
5.08
0.41
0.50
1.02
1.77
0.25
0.36
2.54 BSC
0.21
0.30
2.54
3.81
7.62 BSC
0
_
15
_
0.38
2.54
–B–
1
3
F
4 PL
N
C
L
–T–
SEATING
PLANE
K
G
J
6 PL
0.13 (0.005)
T A
M
M
E
6 PL
D
6 PL
0.13 (0.005)
M
M
T B
M
A
M
B
M
ANODE
CATHODE
NC
MAIN TERMINAL
SUBSTRATE
MAIN TERMINAL
THRU HOLE
–A–
6
1
4
–B–
3
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
INCHES
MIN
MAX
0.320
0.350
0.240
0.260
0.115
0.200
0.016
0.020
0.040
0.070
0.010
0.014
0.100 BSC
0.020
0.025
0.008
0.012
0.006
0.035
0.320 BSC
0.332
0.390
MILLIMETERS
MIN
MAX
8.13
8.89
6.10
6.60
2.93
5.08
0.41
0.50
1.02
1.77
0.25
0.36
2.54 BSC
0.51
0.63
0.20
0.30
0.16
0.88
8.13 BSC
8.43
9.90
F
4 PL
H
C
L
–T–
G
E
6 PL
D
6 PL
0.13 (0.005)
M
J
K
6 PL
0.13 (0.005)
T A
M
M
SEATING
PLANE
T B
M
A
M
B
M
DIM
A
B
C
D
E
F
G
H
J
K
L
S
SURFACE MOUNT
微控制器 MCU
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