电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

74HC244DB

产品描述Bus Driver
产品类别逻辑    逻辑   
文件大小327KB,共18页
制造商Nexperia
官网地址https://www.nexperia.com
标准
下载文档 详细参数 选型对比 全文预览

74HC244DB在线购买

供应商 器件名称 价格 最低购买 库存  
74HC244DB - - 点击查看 点击购买

74HC244DB概述

Bus Driver

74HC244DB规格参数

参数名称属性值
是否Rohs认证符合
厂商名称Nexperia
包装说明SSOP,
Reach Compliance Codecompliant
Date Of Intro2017-02-01
系列HC/UH
JESD-30 代码R-PDSO-G20
JESD-609代码e4
长度7.2 mm
逻辑集成电路类型BUS DRIVER
湿度敏感等级1
位数4
功能数量2
端口数量2
端子数量20
最高工作温度125 °C
最低工作温度-40 °C
输出特性3-STATE
输出极性TRUE
封装主体材料PLASTIC/EPOXY
封装代码SSOP
封装形状RECTANGULAR
封装形式SMALL OUTLINE, SHRINK PITCH
峰值回流温度(摄氏度)260
传播延迟(tpd)165 ns
座面最大高度2 mm
最大供电电压 (Vsup)6 V
最小供电电压 (Vsup)2 V
标称供电电压 (Vsup)5 V
表面贴装YES
技术CMOS
温度等级AUTOMOTIVE
端子面层Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式GULL WING
端子节距0.65 mm
端子位置DUAL
处于峰值回流温度下的最长时间30
宽度5.3 mm

74HC244DB文档预览

Important notice
Dear Customer,
On 7 February 2017 the former NXP Standard Product business became a new company with the
tradename
Nexperia.
Nexperia is an industry leading supplier of Discrete, Logic and PowerMOS
semiconductors with its focus on the automotive, industrial, computing, consumer and wearable
application markets
In data sheets and application notes which still contain NXP or Philips Semiconductors references, use
the references to Nexperia, as shown below.
Instead of http://www.nxp.com, http://www.philips.com/ or http://www.semiconductors.philips.com/,
use
http://www.nexperia.com
Instead of sales.addresses@www.nxp.com or sales.addresses@www.semiconductors.philips.com, use
salesaddresses@nexperia.com
(email)
Replace the copyright notice at the bottom of each page or elsewhere in the document, depending on
the version, as shown below:
- © NXP N.V. (year). All rights reserved or © Koninklijke Philips Electronics N.V. (year). All rights
reserved
Should be replaced with:
-
© Nexperia B.V. (year). All rights reserved.
If you have any questions related to the data sheet, please contact our nearest sales office via e-mail
or telephone (details via
salesaddresses@nexperia.com).
Thank you for your cooperation and
understanding,
Kind regards,
Team Nexperia
74HC244; 74HCT244
Octal buffer/line driver; 3-state
Rev. 5 — 26 February 2016
Product data sheet
1. General description
The 74HC244; 74HCT244 is an 8-bit buffer/line driver with 3-state outputs. The device
can be used as two 4-bit buffers or one 8-bit buffer. The device features two output
enables (1OE and 2OE), each controlling four of the 3-state outputs. A HIGH on nOE
causes the outputs to assume a high-impedance OFF-state. Inputs include clamp diodes
that enable the use of current limiting resistors to interface inputs to voltages in excess of
V
CC
.
2. Features and benefits
Input levels:
For 74HC244: CMOS level
For 74HCT244: TTL level
Octal bus interface
Non-inverting 3-state outputs
Complies with JEDEC standard no. 7 A
ESD protection:
HBM JESD22-A114F exceeds 2000 V
MM JESD22-A115-A exceeds 200 V
Multiple package options
Specified from
40 C
to +85
C
and
40 C
to +125
C
3. Ordering information
Table 1.
Ordering information
Package
Temperature range
74HC244D
74HCT244D
74HC244DB
74HCT244DB
74HC244PW
74HCT244PW
74HC244BQ
74HCT244BQ
40 C
to +125
C
40 C
to +125
C
TSSOP20
40 C
to +125
C
SSOP20
40 C
to +125
C
Name
SO20
Description
plastic small outline package; 20 leads;
body width 7.5 mm
plastic shrink small outline package; 20 leads;
body width 5.3 mm
plastic thin shrink small outline package; 20 leads;
body width 4.4 mm
Version
SOT163-1
SOT339-1
SOT360-1
Type number
DHVQFN20 plastic dual-in-line compatible thermal enhanced
SOT764-1
very thin quad flat package; no leads; 20 terminals;
body 2.5
4.5
0.85 mm
NXP Semiconductors
74HC244; 74HCT244
Octal buffer/line driver; 3-state
4. Functional diagram
Fig 1.
Functional diagram
Fig 2.
Logic symbol
Fig 3.
IEC logic symbol
74HC_HCT244
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2016. All rights reserved.
Product data sheet
Rev. 5 — 26 February 2016
2 of 17
NXP Semiconductors
74HC244; 74HCT244
Octal buffer/line driver; 3-state
5. Pinning information
5.1 Pinning
(1) This is not a supply pin. The substrate is attached to this
pad using conductive die attach material. There is no
electrical or mechanical requirement to solder this pad.
However, if it is soldered, the solder land should remain
floating or be connected to GND.
Fig 4.
Pin configuration SO20, (T)SSOP20
Fig 5.
Pin configuration DHVQFN20
5.2 Pin description
Table 2.
Symbol
1OE, 2OE
1A0, 1A1, 1A2, 1A3
2Y0, 2Y1, 2Y2, 2Y3
GND
2A0, 2A1, 2A2, 2A3
1Y0, 1Y1, 1Y2, 1Y3
V
CC
Pin description
Pin
1, 19
2, 4, 6, 8
3, 5, 7, 9
10
17, 15, 13, 11
18, 16, 14, 12
20
Description
output enable input (active LOW)
data input
bus output
ground (0 V)
data input
bus output
supply voltage
74HC_HCT244
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2016. All rights reserved.
Product data sheet
Rev. 5 — 26 February 2016
3 of 17
NXP Semiconductors
74HC244; 74HCT244
Octal buffer/line driver; 3-state
6. Functional description
Table 3.
Input
nOE
L
L
H
[1]
Function table
[1]
Output
nAn
L
H
X
nYn
L
H
Z
H = HIGH voltage level; L = LOW voltage level; X = don’t care; Z = high-impedance OFF-state.
7. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol
V
CC
I
IK
I
OK
I
O
I
CC
I
GND
T
stg
P
tot
Parameter
supply voltage
input clamping current
output clamping current
output current
supply current
ground current
storage temperature
total power dissipation
SO20, SSOP20, TSSOP20 and
DHVQFN20 packages
[1]
Conditions
V
I
<
0.5
V or V
I
> V
CC
+ 0.5 V
V
O
<
0.5
V or V
O
> V
CC
+ 0.5 V
0.5
V < V
O
< V
CC
+ 0.5 V
Min
0.5
-
-
-
-
70
65
-
Max
+7
20
20
35
70
-
+150
500
Unit
V
mA
mA
mA
mA
mA
C
mW
[1]
For SO20 packages: P
tot
derates linearly with 8 mW/K above 70
C.
For SSOP20 and TSSOP20 packages: P
tot
derates linearly with 5.5 mW/K above 60
C.
For DHVQFN20 packages: above 60
C,
P
tot
derates linearly with 4.5 mW/K.
8. Recommended operating conditions
Table 5.
Symbol
74HC244
V
CC
V
I
V
O
t/V
supply voltage
input voltage
output voltage
input transition rise and fall rate V
CC
= 2.0 V
V
CC
= 4.5 V
V
CC
= 6.0 V
T
amb
ambient temperature
2.0
0
0
-
-
-
40
5.0
-
-
-
1.67
-
-
6.0
V
CC
V
CC
625
139
83
+125
V
V
V
ns/V
ns/V
ns/V
C
Recommended operating conditions
Parameter
Conditions
Min
Typ
Max
Unit
74HC_HCT244
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2016. All rights reserved.
Product data sheet
Rev. 5 — 26 February 2016
4 of 17

74HC244DB相似产品对比

74HC244DB 74HCT244D 74HCT244PW 74HC244PW 74HC244BQ 74HCT244DB
描述 Bus Driver Bus Driver Bus Driver Bus Driver Bus Driver Bus Driver
是否Rohs认证 符合 符合 符合 符合 符合 符合
厂商名称 Nexperia Nexperia Nexperia Nexperia Nexperia Nexperia
包装说明 SSOP, SOP, TSSOP, TSSOP, HVQCCN, SSOP,
Reach Compliance Code compliant compliant compliant compliant compliant compliant
系列 HC/UH HCT HCT HC/UH HC/UH HCT
JESD-30 代码 R-PDSO-G20 R-PDSO-G20 R-PDSO-G20 R-PDSO-G20 R-PQCC-N20 R-PDSO-G20
JESD-609代码 e4 e4 e4 e4 e4 e4
长度 7.2 mm 12.8 mm 6.5 mm 6.5 mm 4.5 mm 7.2 mm
逻辑集成电路类型 BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER
湿度敏感等级 1 1 1 1 1 1
位数 4 4 4 4 4 4
功能数量 2 2 2 2 2 2
端口数量 2 2 2 2 2 2
端子数量 20 20 20 20 20 20
最高工作温度 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
输出特性 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
输出极性 TRUE TRUE TRUE TRUE TRUE TRUE
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 SSOP SOP TSSOP TSSOP HVQCCN SSOP
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, SHRINK PITCH
峰值回流温度(摄氏度) 260 260 260 260 260 260
传播延迟(tpd) 165 ns 33 ns 33 ns 165 ns 165 ns 33 ns
座面最大高度 2 mm 2.65 mm 1.1 mm 1.1 mm 1 mm 2 mm
最大供电电压 (Vsup) 6 V 5.5 V 5.5 V 6 V 6 V 5.5 V
最小供电电压 (Vsup) 2 V 4.5 V 4.5 V 2 V 2 V 4.5 V
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
端子面层 Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式 GULL WING GULL WING GULL WING GULL WING NO LEAD GULL WING
端子节距 0.65 mm 1.27 mm 0.65 mm 0.65 mm 0.5 mm 0.65 mm
端子位置 DUAL DUAL DUAL DUAL QUAD DUAL
处于峰值回流温度下的最长时间 30 30 30 30 30 30
宽度 5.3 mm 7.5 mm 4.4 mm 4.4 mm 2.5 mm 5.3 mm

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 801  1390  2646  2683  200  17  28  54  55  5 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved