UVPROM, 64KX8, 270ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Atmel (Microchip) |
| 零件包装代码 | DIP |
| 包装说明 | WDIP, DIP28,.6 |
| 针数 | 28 |
| Reach Compliance Code | unknow |
| ECCN代码 | EAR99 |
| 最长访问时间 | 270 ns |
| I/O 类型 | COMMON |
| JESD-30 代码 | R-GDIP-T28 |
| JESD-609代码 | e0 |
| 长度 | 37.25 mm |
| 内存密度 | 524288 bi |
| 内存集成电路类型 | UVPROM |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 28 |
| 字数 | 65536 words |
| 字数代码 | 64000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 64KX8 |
| 输出特性 | 3-STATE |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | WDIP |
| 封装等效代码 | DIP28,.6 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE, WINDOW |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 3.3/5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.72 mm |
| 最大待机电流 | 0.00002 A |
| 最大压摆率 | 0.1 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 3 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 15.24 mm |
| AT27LV512R-30DC | AT27LV512R-30JCT/R | AT27LV512R-30DI | AT27LV512R-30JC | AT27LV512R-30LC | AT27LV512R-30LI | AT27LV512R-30RC | AT27LV512R-30RCT/R | AT27LV512R-30PC | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | UVPROM, 64KX8, 270ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | OTP ROM, 64KX8, 270ns, CMOS, PQCC32, PLASTIC, LCC-32 | UVPROM, 64KX8, 270ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | OTP ROM, 64KX8, 270ns, CMOS, PQCC32, PLASTIC, LCC-32 | UVPROM, 64KX8, 270ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 | UVPROM, 64KX8, 270ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 | OTP ROM, 64KX8, 270ns, CMOS, PDSO28, 0.330 INCH, PLASTIC, SOIC-28 | OTP ROM, 64KX8, 270ns, CMOS, PDSO28, 0.330 INCH, PLASTIC, SOIC-28 | OTP ROM, 64KX8, 270ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 |
| 零件包装代码 | DIP | QFJ | DIP | QFJ | QFJ | QFJ | SOIC | SOIC | DIP |
| 包装说明 | WDIP, DIP28,.6 | QCCJ, | WDIP, DIP28,.6 | QCCJ, LDCC32,.5X.6 | WQCCN, LCC32,.45X.55 | WQCCN, LCC32,.45X.55 | SOP, SOP28,.5 | SOP, | DIP, DIP28,.6 |
| 针数 | 28 | 32 | 28 | 32 | 32 | 32 | 28 | 28 | 28 |
| Reach Compliance Code | unknow | unknown | unknown | compliant | unknown | unknown | compliant | unknown | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 270 ns | 270 ns | 270 ns | 270 ns | 270 ns | 270 ns | 270 ns | 270 ns | 270 ns |
| JESD-30 代码 | R-GDIP-T28 | R-PQCC-J32 | R-GDIP-T28 | R-PQCC-J32 | R-CQCC-N32 | R-CQCC-N32 | R-PDSO-G28 | R-PDSO-G28 | R-PDIP-T28 |
| 长度 | 37.25 mm | 13.97 mm | 37.25 mm | 13.97 mm | 13.97 mm | 13.97 mm | 18.25 mm | 18.25 mm | 36.95 mm |
| 内存密度 | 524288 bi | 524288 bit | 524288 bit | 524288 bit | 524288 bit | 524288 bit | 524288 bit | 524288 bit | 524288 bit |
| 内存集成电路类型 | UVPROM | OTP ROM | UVPROM | OTP ROM | UVPROM | UVPROM | OTP ROM | OTP ROM | OTP ROM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 28 | 32 | 28 | 32 | 32 | 32 | 28 | 28 | 28 |
| 字数 | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words |
| 字数代码 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 85 °C | 70 °C | 70 °C | 85 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | WDIP | QCCJ | WDIP | QCCJ | WQCCN | WQCCN | SOP | SOP | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE, WINDOW | CHIP CARRIER | IN-LINE, WINDOW | CHIP CARRIER | CHIP CARRIER, WINDOW | CHIP CARRIER, WINDOW | SMALL OUTLINE | SMALL OUTLINE | IN-LINE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.72 mm | 3.55 mm | 5.72 mm | 3.55 mm | 3.25 mm | 3.25 mm | 2.79 mm | 2.79 mm | 5.59 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | NO | YES | YES | YES | YES | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | THROUGH-HOLE | J BEND | THROUGH-HOLE | J BEND | NO LEAD | NO LEAD | GULL WING | GULL WING | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | QUAD | DUAL | QUAD | QUAD | QUAD | DUAL | DUAL | DUAL |
| 宽度 | 15.24 mm | 11.43 mm | 15.24 mm | 11.43 mm | 11.43 mm | 11.43 mm | 8.74 mm | 8.74 mm | 15.24 mm |
| 是否无铅 | 含铅 | - | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | - | 含铅 |
| 是否Rohs认证 | 不符合 | - | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | - | 不符合 |
| 厂商名称 | Atmel (Microchip) | - | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) |
| I/O 类型 | COMMON | - | COMMON | COMMON | COMMON | COMMON | COMMON | - | COMMON |
| JESD-609代码 | e0 | - | e0 | e0 | e0 | e0 | e0 | - | e0 |
| 封装等效代码 | DIP28,.6 | - | DIP28,.6 | LDCC32,.5X.6 | LCC32,.45X.55 | LCC32,.45X.55 | SOP28,.5 | - | DIP28,.6 |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | - | NOT SPECIFIED | 225 | NOT SPECIFIED | NOT SPECIFIED | 225 | - | NOT SPECIFIED |
| 电源 | 3.3/5 V | - | 3.3/5 V | 3.3/5 V | 3.3/5 V | 3.3/5 V | 3.3/5 V | - | 3.3/5 V |
| 最大待机电流 | 0.00002 A | - | 0.000025 A | 0.00002 A | 0.00002 A | 0.000025 A | 0.00002 A | - | 0.00002 A |
| 最大压摆率 | 0.1 mA | - | 0.1 mA | 0.1 mA | 0.1 mA | 0.1 mA | 0.1 mA | - | 0.1 mA |
| 端子面层 | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED |
嵌入式系统
stm32/stm8
单片机
电子竞赛
单片机
微控制器 MCU
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
