1KX8 SPI BUS SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SO-8
参数名称 | 属性值 |
厂商名称 | ST(意法半导体) |
零件包装代码 | SOIC |
包装说明 | SOP, |
针数 | 8 |
Reach Compliance Code | unknow |
ECCN代码 | EAR99 |
其他特性 | 100000 ERASE/WRITE CYCLES; 10 YEARS DATA RETENTION; SPI BUS INTERFACE; 16 BYTE PAGE WRITE |
最大时钟频率 (fCLK) | 2 MHz |
数据保留时间-最小值 | 10 |
JESD-30 代码 | R-PDSO-G8 |
长度 | 4.9 mm |
内存密度 | 8192 bi |
内存集成电路类型 | EEPROM |
内存宽度 | 8 |
功能数量 | 1 |
端子数量 | 8 |
字数 | 1024 words |
字数代码 | 1000 |
工作模式 | SYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 1KX8 |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOP |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
并行/串行 | SERIAL |
认证状态 | Not Qualified |
座面最大高度 | 1.75 mm |
串行总线类型 | SPI |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子形式 | GULL WING |
端子节距 | 1.27 mm |
端子位置 | DUAL |
宽度 | 3.9 mm |
最长写入周期时间 (tWC) | 10 ms |
ST95080M1TR | ST95080B6 | ST95080B3 | ST95080M6TR | ST95080M3TR | ST95080B1 | ST95080M1 | ST95080M3 | ST95080M6 | |
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描述 | 1KX8 SPI BUS SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SO-8 | 1KX8 SPI BUS SERIAL EEPROM, PDIP8, 0.25 MM LEAD FRAME, SKINNY, PLASTIC, DIP-8 | 1KX8 SPI BUS SERIAL EEPROM, PDIP8, 0.25 MM LEAD FRAME, SKINNY, PLASTIC, DIP-8 | 1KX8 SPI BUS SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SO-8 | 1KX8 SPI BUS SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SO-8 | 1KX8 SPI BUS SERIAL EEPROM, PDIP8, 0.25 MM LEAD FRAME, SKINNY, PLASTIC, DIP-8 | IC,SERIAL EEPROM,1KX8,CMOS,SOP,8PIN,PLASTIC | IC,SERIAL EEPROM,1KX8,CMOS,SOP,8PIN,PLASTIC | IC,SERIAL EEPROM,1KX8,CMOS,SOP,8PIN,PLASTIC |
Reach Compliance Code | unknow | not_compliant | not_compliant | unknown | unknown | not_compliant | not_compliant | not_compliant | not_compliant |
数据保留时间-最小值 | 10 | 10 | 10 | 10 | 10 | 10 | 10 | 10 | 10 |
JESD-30 代码 | R-PDSO-G8 | R-PDIP-T8 | R-PDIP-T8 | R-PDSO-G8 | R-PDSO-G8 | R-PDIP-T8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 |
内存密度 | 8192 bi | 8192 bit | 8192 bit | 8192 bit | 8192 bit | 8192 bit | 8192 bit | 8192 bit | 8192 bit |
内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
字数 | 1024 words | 1024 words | 1024 words | 1024 words | 1024 words | 1024 words | 1024 words | 1024 words | 1024 words |
字数代码 | 1000 | 1000 | 1000 | 1000 | 1000 | 1000 | 1000 | 1000 | 1000 |
最高工作温度 | 70 °C | 85 °C | 125 °C | 85 °C | 125 °C | 70 °C | 70 °C | 125 °C | 85 °C |
最低工作温度 | - | -40 °C | -40 °C | -40 °C | -40 °C | - | - | -40 °C | -40 °C |
组织 | 1KX8 | 1KX8 | 1KX8 | 1KX8 | 1KX8 | 1KX8 | 1KX8 | 1KX8 | 1KX8 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SOP | DIP | DIP | SOP | SOP | DIP | SOP | SOP | SOP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
串行总线类型 | SPI | SPI | SPI | SPI | SPI | SPI | SPI | SPI | SPI |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | NO | NO | YES | YES | NO | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | INDUSTRIAL | AUTOMOTIVE | INDUSTRIAL | AUTOMOTIVE | COMMERCIAL | COMMERCIAL | AUTOMOTIVE | INDUSTRIAL |
端子形式 | GULL WING | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | GULL WING |
端子节距 | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
厂商名称 | ST(意法半导体) | - | - | - | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) |
零件包装代码 | SOIC | DIP | DIP | SOIC | SOIC | DIP | - | - | - |
包装说明 | SOP, | DIP, DIP8,.3 | DIP, DIP8,.3 | SOP, | SOP, | DIP, DIP8,.3 | - | - | - |
针数 | 8 | 8 | 8 | 8 | 8 | 8 | - | - | - |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | - | - | - |
其他特性 | 100000 ERASE/WRITE CYCLES; 10 YEARS DATA RETENTION; SPI BUS INTERFACE; 16 BYTE PAGE WRITE | 100000 ERASE/WRITE CYCLES; 10 YEARS DATA RETENTION; SPI BUS INTERFACE; 16 BYTE PAGE WRITE | 100000 ERASE/WRITE CYCLES; 10 YEARS DATA RETENTION; SPI BUS INTERFACE; 16 BYTE PAGE WRITE | 100000 ERASE/WRITE CYCLES; 10 YEARS DATA RETENTION; SPI BUS INTERFACE; 16 BYTE PAGE WRITE | 100000 ERASE/WRITE CYCLES; 10 YEARS DATA RETENTION; SPI BUS INTERFACE; 16 BYTE PAGE WRITE | 100000 ERASE/WRITE CYCLES; 10 YEARS DATA RETENTION; SPI BUS INTERFACE; 16 BYTE PAGE WRITE | - | - | - |
最大时钟频率 (fCLK) | 2 MHz | 2 MHz | 2 MHz | 2 MHz | 2 MHz | 2 MHz | - | - | - |
长度 | 4.9 mm | 9.55 mm | 9.55 mm | 4.9 mm | 4.9 mm | 9.55 mm | - | - | - |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | - | - | - |
工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | - | - | - |
座面最大高度 | 1.75 mm | 5.9 mm | 5.9 mm | 1.75 mm | 1.75 mm | 5.9 mm | - | - | - |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | - | - | - |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | - | - | - |
宽度 | 3.9 mm | 7.62 mm | 7.62 mm | 3.9 mm | 3.9 mm | 7.62 mm | - | - | - |
最长写入周期时间 (tWC) | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | - | - | - |
是否Rohs认证 | - | 不符合 | 不符合 | - | - | 不符合 | 不符合 | 不符合 | 不符合 |
耐久性 | - | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | - | - | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles |
JESD-609代码 | - | e0 | e0 | - | - | e0 | e0 | e0 | e0 |
封装等效代码 | - | DIP8,.3 | DIP8,.3 | - | - | DIP8,.3 | SOP8,.25 | SOP8,.25 | SOP8,.25 |
电源 | - | 5 V | 5 V | - | - | 5 V | 5 V | 5 V | 5 V |
最大待机电流 | - | 0.00005 A | 0.00005 A | - | - | 0.00005 A | 0.00005 A | 0.00005 A | 0.00005 A |
最大压摆率 | - | 0.002 mA | 0.002 mA | - | - | 0.002 mA | 0.002 mA | 0.002 mA | 0.002 mA |
端子面层 | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
写保护 | - | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | - | - | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE |
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