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Datasheet> 器件分类 > 可编程逻辑器件> 可编程逻辑> TIBPAL16R8-10CN

TIBPAL16R8-10CN: 产品描述OT PLD, 10ns, TTL, PDIP20, PLASTIC, DIP-20; 产品类别可编程逻辑器件可编程逻辑; 文件大小561KB，共30页; 制造商Rochester Electronics; 官网地址https://www.rocelec.com/

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TIBPAL16R8-10CN概述

OT PLD, 10ns, TTL, PDIP20, PLASTIC, DIP-20

TIBPAL16R8-10CN规格参数

参数名称	属性值
厂商名称	Rochester Electronics
包装说明	DIP,
Reach Compliance Code	unknow
其他特性	POWER-UP RESET; REGISTER PRELOAD
最大时钟频率	55.5 MHz
JESD-30 代码	R-PDIP-T20
JESD-609代码	e0
长度	24.325 mm
专用输入次数	8
I/O 线路数量
端子数量	20
最高工作温度	75 °C
最低工作温度
组织	8 DEDICATED INPUTS, 0 I/O
输出函数	REGISTERED
封装主体材料	PLASTIC/EPOXY
封装代码	DIP
封装形状	RECTANGULAR
封装形式	IN-LINE
可编程逻辑类型	OT PLD
传播延迟	10 ns
座面最大高度	5.08 mm
最大供电电压	5.25 V
最小供电电压	4.75 V
标称供电电压	5 V
表面贴装	NO
技术	TTL
温度等级	COMMERCIAL EXTENDED
端子面层	TIN LEAD
端子形式	THROUGH-HOLE
端子节距	2.54 mm
端子位置	DUAL
宽度	7.62 mm

TIBPAL16R8-10CN相似产品对比

	TIBPAL16R8-10CN	TIBPAL16L8-12MWB	TIBPAL16L8-12MJ	TIBPAL16R8-12MWB	TIBPAL16R4-12MWB	TIBPAL16R6-12MWB	TIBPAL16R8-12MJB	TIBPAL16R8-10CFN
描述	OT PLD, 10ns, TTL, PDIP20, PLASTIC, DIP-20	OT PLD, 14ns, TTL, CDFP20, CERAMIC, FP-20	OT PLD, 14ns, TTL, CDIP20, CERAMIC, DIP-20	OT PLD, 10ns, TTL, CDFP20, CERAMIC, FP-20	OT PLD, 14ns, TTL, CDFP20, CERAMIC, FP-20	OT PLD, 14ns, TTL, CDFP20, CERAMIC, FP-20	OT PLD, 10ns, TTL, CDIP20, CERAMIC, DIP-20	OT PLD, 10ns, TTL, PQCC20, PLASTIC, CC-20
包装说明	DIP,	DFP,	CERAMIC, DIP-20	DFP,	CERAMIC, FP-20	CERAMIC, FP-20	CERAMIC, DIP-20	QCCJ,
Reach Compliance Code	unknow	unknow	unknown	unknown	unknown	unknown	unknown	unknow
最大时钟频率	55.5 MHz	48 MHz	48 MHz	48 MHz	48 MHz	48 MHz	48 MHz	55.5 MHz
JESD-30 代码	R-PDIP-T20	R-GDFP-F20	R-GDIP-T20	R-GDFP-F20	R-GDFP-F20	R-GDFP-F20	R-GDIP-T20	S-PQCC-J20
专用输入次数	8	10	10	8	8	8	8	8
端子数量	20	20	20	20	20	20	20	20
最高工作温度	75 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	75 °C
最低工作温度	-	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-
组织	8 DEDICATED INPUTS, 0 I/O	10 DEDICATED INPUTS, 6 I/O	10 DEDICATED INPUTS, 6 I/O	8 DEDICATED INPUTS, 0 I/O	8 DEDICATED INPUTS, 4 I/O	8 DEDICATED INPUTS, 2 I/O	8 DEDICATED INPUTS, 0 I/O	8 DEDICATED INPUTS, 0 I/O
输出函数	REGISTERED	COMBINATORIAL	COMBINATORIAL	REGISTERED	MIXED	MIXED	REGISTERED	REGISTERED
封装主体材料	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY
封装代码	DIP	DFP	DIP	DFP	DFP	DFP	DIP	QCCJ
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE
封装形式	IN-LINE	FLATPACK	IN-LINE	FLATPACK	FLATPACK	FLATPACK	IN-LINE	CHIP CARRIER
可编程逻辑类型	OT PLD	OT PLD	OT PLD	OT PLD	OT PLD	OT PLD	OT PLD	OT PLD
传播延迟	10 ns	14 ns	14 ns	10 ns	14 ns	14 ns	10 ns	10 ns
座面最大高度	5.08 mm	2.45 mm	5.08 mm	2.45 mm	2.45 mm	2.45 mm	5.08 mm	4.57 mm
最大供电电压	5.25 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.25 V
最小供电电压	4.75 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.75 V
标称供电电压	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
表面贴装	NO	YES	NO	YES	YES	YES	NO	YES
技术	TTL	TTL	TTL	TTL	TTL	TTL	TTL	TTL
温度等级	COMMERCIAL EXTENDED	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	COMMERCIAL EXTENDED
端子形式	THROUGH-HOLE	FLAT	THROUGH-HOLE	FLAT	FLAT	FLAT	THROUGH-HOLE	J BEND
端子节距	2.54 mm	1.27 mm	2.54 mm	1.27 mm	1.27 mm	1.27 mm	2.54 mm	1.27 mm
端子位置	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	QUAD
宽度	7.62 mm	6.92 mm	7.62 mm	6.92 mm	6.92 mm	6.92 mm	7.62 mm	8.9662 mm
厂商名称	Rochester Electronics	-	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics
ECCN代码	-	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	-
筛选级别	-	MIL-PRF-38535	-	MIL-PRF-38535	MIL-PRF-38535	MIL-PRF-38535	MIL-PRF-38535	-

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