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Datasheet> 器件分类 > 可编程逻辑器件> 可编程逻辑> TIBPAL16R8-12MWB

TIBPAL16R8-12MWB: 产品描述OT PLD, 10ns, TTL, CDFP20, CERAMIC, FP-20; 产品类别可编程逻辑器件可编程逻辑; 文件大小561KB，共30页; 制造商Rochester Electronics; 官网地址https://www.rocelec.com/

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TIBPAL16R8-12MWB概述

OT PLD, 10ns, TTL, CDFP20, CERAMIC, FP-20

TIBPAL16R8-12MWB规格参数

参数名称	属性值
厂商名称	Rochester Electronics
包装说明	DFP,
Reach Compliance Code	unknown
ECCN代码	3A001.A.2.C
最大时钟频率	48 MHz
JESD-30 代码	R-GDFP-F20
专用输入次数	8
I/O 线路数量
端子数量	20
最高工作温度	125 °C
最低工作温度	-55 °C
组织	8 DEDICATED INPUTS, 0 I/O
输出函数	REGISTERED
封装主体材料	CERAMIC, GLASS-SEALED
封装代码	DFP
封装形状	RECTANGULAR
封装形式	FLATPACK
可编程逻辑类型	OT PLD
传播延迟	10 ns
筛选级别	MIL-PRF-38535
座面最大高度	2.45 mm
最大供电电压	5.5 V
最小供电电压	4.5 V
标称供电电压	5 V
表面贴装	YES
技术	TTL
温度等级	MILITARY
端子形式	FLAT
端子节距	1.27 mm
端子位置	DUAL
宽度	6.92 mm
Base Number Matches	1

TIBPAL16R8-12MWB相似产品对比

	TIBPAL16R8-12MWB	TIBPAL16L8-12MWB	TIBPAL16L8-12MJ	TIBPAL16R4-12MWB	TIBPAL16R6-12MWB	TIBPAL16R8-12MJB	TIBPAL16R8-10CFN	TIBPAL16R8-10CN
描述	OT PLD, 10ns, TTL, CDFP20, CERAMIC, FP-20	OT PLD, 14ns, TTL, CDFP20, CERAMIC, FP-20	OT PLD, 14ns, TTL, CDIP20, CERAMIC, DIP-20	OT PLD, 14ns, TTL, CDFP20, CERAMIC, FP-20	OT PLD, 14ns, TTL, CDFP20, CERAMIC, FP-20	OT PLD, 10ns, TTL, CDIP20, CERAMIC, DIP-20	OT PLD, 10ns, TTL, PQCC20, PLASTIC, CC-20	OT PLD, 10ns, TTL, PDIP20, PLASTIC, DIP-20
包装说明	DFP,	DFP,	CERAMIC, DIP-20	CERAMIC, FP-20	CERAMIC, FP-20	CERAMIC, DIP-20	QCCJ,	DIP,
Reach Compliance Code	unknown	unknow	unknown	unknown	unknown	unknown	unknow	unknow
最大时钟频率	48 MHz	48 MHz	48 MHz	48 MHz	48 MHz	48 MHz	55.5 MHz	55.5 MHz
JESD-30 代码	R-GDFP-F20	R-GDFP-F20	R-GDIP-T20	R-GDFP-F20	R-GDFP-F20	R-GDIP-T20	S-PQCC-J20	R-PDIP-T20
专用输入次数	8	10	10	8	8	8	8	8
端子数量	20	20	20	20	20	20	20	20
最高工作温度	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	75 °C	75 °C
最低工作温度	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-	-
组织	8 DEDICATED INPUTS, 0 I/O	10 DEDICATED INPUTS, 6 I/O	10 DEDICATED INPUTS, 6 I/O	8 DEDICATED INPUTS, 4 I/O	8 DEDICATED INPUTS, 2 I/O	8 DEDICATED INPUTS, 0 I/O	8 DEDICATED INPUTS, 0 I/O	8 DEDICATED INPUTS, 0 I/O
输出函数	REGISTERED	COMBINATORIAL	COMBINATORIAL	MIXED	MIXED	REGISTERED	REGISTERED	REGISTERED
封装主体材料	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	DFP	DFP	DIP	DFP	DFP	DIP	QCCJ	DIP
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR
封装形式	FLATPACK	FLATPACK	IN-LINE	FLATPACK	FLATPACK	IN-LINE	CHIP CARRIER	IN-LINE
可编程逻辑类型	OT PLD	OT PLD	OT PLD	OT PLD	OT PLD	OT PLD	OT PLD	OT PLD
传播延迟	10 ns	14 ns	14 ns	14 ns	14 ns	10 ns	10 ns	10 ns
座面最大高度	2.45 mm	2.45 mm	5.08 mm	2.45 mm	2.45 mm	5.08 mm	4.57 mm	5.08 mm
最大供电电压	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.25 V	5.25 V
最小供电电压	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.75 V	4.75 V
标称供电电压	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
表面贴装	YES	YES	NO	YES	YES	NO	YES	NO
技术	TTL	TTL	TTL	TTL	TTL	TTL	TTL	TTL
温度等级	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	COMMERCIAL EXTENDED	COMMERCIAL EXTENDED
端子形式	FLAT	FLAT	THROUGH-HOLE	FLAT	FLAT	THROUGH-HOLE	J BEND	THROUGH-HOLE
端子节距	1.27 mm	1.27 mm	2.54 mm	1.27 mm	1.27 mm	2.54 mm	1.27 mm	2.54 mm
端子位置	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	QUAD	DUAL
宽度	6.92 mm	6.92 mm	7.62 mm	6.92 mm	6.92 mm	7.62 mm	8.9662 mm	7.62 mm
厂商名称	Rochester Electronics	-	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics
ECCN代码	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	-	-
筛选级别	MIL-PRF-38535	MIL-PRF-38535	-	MIL-PRF-38535	MIL-PRF-38535	MIL-PRF-38535	-	-

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