128KX8 OTPROM, 70ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
厂商名称 | Rochester Electronics |
零件包装代码 | DIP |
包装说明 | 0.600 INCH, PLASTIC, DIP-32 |
针数 | 32 |
Reach Compliance Code | unknow |
最长访问时间 | 70 ns |
JESD-30 代码 | R-PDIP-T32 |
内存密度 | 1048576 bi |
内存集成电路类型 | OTP ROM |
内存宽度 | 8 |
湿度敏感等级 | 1 |
功能数量 | 1 |
端子数量 | 32 |
字数 | 131072 words |
字数代码 | 128000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 128KX8 |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | DIP |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
并行/串行 | PARALLEL |
峰值回流温度(摄氏度) | 225 |
认证状态 | COMMERCIAL |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | NOT SPECIFIED |
端子形式 | THROUGH-HOLE |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
CY27H010-70PC | CY27H010-55WC | CY27H010-70WC | CY27H010-45ZC | CY27H010-45PC | CY27H010-45WMB | CY27H010-55PC | |
---|---|---|---|---|---|---|---|
描述 | 128KX8 OTPROM, 70ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | 128KX8 UVPROM, 55ns, CDIP32, 0.600 INCH, WINDOWED, HERMETIC SEALED, CERDIP-32 | 128KX8 UVPROM, 70ns, CDIP32, 0.600 INCH, WINDOWED, HERMETIC SEALED, CERDIP-32 | 128KX8 OTPROM, 45ns, PDSO32, TSOP1-32 | 128KX8 OTPROM, 45ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | 128KX8 UVPROM, 45ns, CDIP32, 0.600 INCH, WINDOWED, HERMETIC SEALED, CERDIP-32 | 128KX8 OTPROM, 55ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32 |
是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
零件包装代码 | DIP | DIP | DIP | TSOP1 | DIP | DIP | DIP |
包装说明 | 0.600 INCH, PLASTIC, DIP-32 | 0.600 INCH, WINDOWED, HERMETIC SEALED, CERDIP-32 | 0.600 INCH, WINDOWED, HERMETIC SEALED, CERDIP-32 | TSOP1-32 | 0.600 INCH, PLASTIC, DIP-32 | 0.600 INCH, WINDOWED, HERMETIC SEALED, CERDIP-32 | 0.600 INCH, PLASTIC, DIP-32 |
针数 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
Reach Compliance Code | unknow | unknown | unknown | unknown | unknown | unknown | unknown |
最长访问时间 | 70 ns | 55 ns | 70 ns | 45 ns | 45 ns | 45 ns | 55 ns |
JESD-30 代码 | R-PDIP-T32 | R-GDIP-T32 | R-GDIP-T32 | R-PDSO-G32 | R-PDIP-T32 | R-GDIP-T32 | R-PDIP-T32 |
内存密度 | 1048576 bi | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit |
内存集成电路类型 | OTP ROM | UVPROM | UVPROM | OTP ROM | OTP ROM | UVPROM | OTP ROM |
内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
字数 | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words |
字数代码 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 125 °C | 70 °C |
组织 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 |
封装主体材料 | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY |
封装代码 | DIP | DIP | DIP | SOP | DIP | DIP | DIP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE | IN-LINE | IN-LINE | IN-LINE |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
峰值回流温度(摄氏度) | 225 | 225 | 225 | 225 | 225 | 225 | 225 |
认证状态 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | NO | YES | NO | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | MILITARY | COMMERCIAL |
端子面层 | NOT SPECIFIED | NOT SPECIFIED | TIN LEAD | NOT SPECIFIED | NOT SPECIFIED | TIN LEAD | NOT SPECIFIED |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved