8-BIT, MROM, 2.1MHz, MICROCONTROLLER, PQFP44, PLASTIC, QFP-44
参数名称 | 属性值 |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | NXP(恩智浦) |
零件包装代码 | QFP |
包装说明 | QFP, |
针数 | 44 |
Reach Compliance Code | compli |
ECCN代码 | EAR99 |
具有ADC | NO |
其他特性 | ALSO OPERATES AT 3.3V SUPPLY AT 1 MHZ |
地址总线宽度 | |
位大小 | 8 |
最大时钟频率 | 4.2 MHz |
DAC 通道 | NO |
DMA 通道 | NO |
外部数据总线宽度 | |
JESD-30 代码 | S-PQFP-G44 |
JESD-609代码 | e3 |
长度 | 10 mm |
湿度敏感等级 | 3 |
I/O 线路数量 | 31 |
端子数量 | 44 |
最高工作温度 | 70 °C |
最低工作温度 | |
PWM 通道 | NO |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | QFP |
封装形状 | SQUARE |
封装形式 | FLATPACK |
峰值回流温度(摄氏度) | 260 |
认证状态 | Not Qualified |
ROM可编程性 | MROM |
座面最大高度 | 2.45 mm |
速度 | 2.1 MHz |
最大供电电压 | 5.5 V |
最小供电电压 | 4.5 V |
标称供电电压 | 5 V |
表面贴装 | YES |
技术 | HCMOS |
温度等级 | COMMERCIAL |
端子面层 | Matte Tin (Sn) |
端子形式 | GULL WING |
端子节距 | 0.8 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | 40 |
宽度 | 10 mm |
uPs/uCs/外围集成电路类型 | MICROCONTROLLER |
MC68HC05C9AFBE | MC68HC05C9AP | MC68HC05C9AFB | MC68HC05C9AFN | MC68HC05C9AFNE | |
---|---|---|---|---|---|
描述 | 8-BIT, MROM, 2.1MHz, MICROCONTROLLER, PQFP44, PLASTIC, QFP-44 | 8-BIT, MROM, 2.1MHz, MICROCONTROLLER, PDIP40, PLASTIC, DIP-40 | 8-BIT, MROM, 2.1MHz, MICROCONTROLLER, PQFP44, PLASTIC, QFP-44 | 8-BIT, MROM, 2.1MHz, MICROCONTROLLER, PQCC44, PLASTIC, LCC-44 | 8-BIT, MROM, 2.1MHz, MICROCONTROLLER, PQCC44, PLASTIC, LCC-44 |
是否无铅 | 不含铅 | 含铅 | 含铅 | 含铅 | 不含铅 |
是否Rohs认证 | 符合 | 不符合 | 不符合 | 不符合 | 符合 |
厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
零件包装代码 | QFP | DIP | QFP | LCC | LCC |
包装说明 | QFP, | DIP, DIP40,.6 | QFP, QFP44,.5SQ,32 | QCCJ, LDCC44,.7SQ | PLASTIC, LCC-44 |
针数 | 44 | 40 | 44 | 44 | 44 |
Reach Compliance Code | compli | unknown | not_compliant | not_compliant | unknown |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
具有ADC | NO | NO | NO | NO | NO |
其他特性 | ALSO OPERATES AT 3.3V SUPPLY AT 1 MHZ | ALSO OPERATES AT 3.3V SUPPLY AT 1 MHZ | ALSO OPERATES AT 3.3V SUPPLY AT 1 MHZ | ALSO OPERATES AT 3.3V SUPPLY AT 1 MHZ | ALSO OPERATES AT 3.3V SUPPLY AT 1 MHZ |
位大小 | 8 | 8 | 8 | 8 | 8 |
最大时钟频率 | 4.2 MHz | 4.2 MHz | 4.2 MHz | 4.2 MHz | 4.2 MHz |
DAC 通道 | NO | NO | NO | NO | NO |
DMA 通道 | NO | NO | NO | NO | NO |
JESD-30 代码 | S-PQFP-G44 | R-PDIP-T40 | S-PQFP-G44 | S-PQCC-J44 | S-PQCC-J44 |
JESD-609代码 | e3 | e0 | e0 | e0 | e3 |
长度 | 10 mm | 52.07 mm | 10 mm | 16.585 mm | 16.585 mm |
I/O 线路数量 | 31 | 31 | 31 | 31 | 31 |
端子数量 | 44 | 40 | 44 | 44 | 44 |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
PWM 通道 | NO | NO | NO | NO | NO |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | QFP | DIP | QFP | QCCJ | QCCJ |
封装形状 | SQUARE | RECTANGULAR | SQUARE | SQUARE | SQUARE |
封装形式 | FLATPACK | IN-LINE | FLATPACK | CHIP CARRIER | CHIP CARRIER |
峰值回流温度(摄氏度) | 260 | NOT SPECIFIED | 220 | 220 | 250 |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
ROM可编程性 | MROM | MROM | MROM | MROM | MROM |
座面最大高度 | 2.45 mm | 5.08 mm | 2.45 mm | 4.57 mm | 4.57 mm |
速度 | 2.1 MHz | 2.1 MHz | 2.1 MHz | 2.1 MHz | 2.1 MHz |
最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | NO | YES | YES | YES |
技术 | HCMOS | HCMOS | HCMOS | HCMOS | HCMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子面层 | Matte Tin (Sn) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Matte Tin (Sn) |
端子形式 | GULL WING | THROUGH-HOLE | GULL WING | J BEND | J BEND |
端子节距 | 0.8 mm | 2.54 mm | 0.8 mm | 1.27 mm | 1.27 mm |
端子位置 | QUAD | DUAL | QUAD | QUAD | QUAD |
处于峰值回流温度下的最长时间 | 40 | NOT SPECIFIED | 30 | 30 | 30 |
宽度 | 10 mm | 15.24 mm | 10 mm | 16.585 mm | 16.585 mm |
uPs/uCs/外围集成电路类型 | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER |
湿度敏感等级 | 3 | - | 1 | 1 | 3 |
CPU系列 | - | 6805 | 6805 | 6805 | - |
封装等效代码 | - | DIP40,.6 | QFP44,.5SQ,32 | LDCC44,.7SQ | - |
电源 | - | 3.3/5 V | 3.3/5 V | 3.3/5 V | - |
RAM(字节) | - | 352 | 352 | 352 | - |
ROM(单词) | - | 15936 | 15936 | 15936 | - |
最大压摆率 | - | 5.25 mA | 5.25 mA | 5.25 mA | - |
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