HCT SERIES, DUAL 1-BIT DRIVER, TRUE OUTPUT, PDSO8, 3 X 2 MM, 0.50 MM HEIGHT, 0.50 MM PITCH, PLASTIC, SOT996-2, SON-8
| 参数名称 | 属性值 |
| 厂商名称 | NXP(恩智浦) |
| 包装说明 | VSON, |
| Reach Compliance Code | unknow |
| 系列 | HCT |
| JESD-30 代码 | R-PDSO-N8 |
| JESD-609代码 | e4 |
| 长度 | 3 mm |
| 逻辑集成电路类型 | BUS DRIVER |
| 位数 | 1 |
| 功能数量 | 2 |
| 端口数量 | 2 |
| 端子数量 | 8 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | VSON |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, VERY THIN PROFILE |
| 传播延迟（tpd） | 36 ns |
| 座面最大高度 | 0.5 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子面层 | NICKEL PALLADIUM GOLD |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | DUAL |
| 宽度 | 2 mm |
| 935288578125 | 74HCT2G126DP,125 | 74HC2G126GD,125 | 74HCT2G126GD,125 | 74HC2G126DC,125 | |
|---|---|---|---|---|---|
| 描述 | HCT SERIES, DUAL 1-BIT DRIVER, TRUE OUTPUT, PDSO8, 3 X 2 MM, 0.50 MM HEIGHT, 0.50 MM PITCH, PLASTIC, SOT996-2, SON-8 | IC BUF NON-INVERT 5.5V 8TSSOP | IC BUFFER NON-INVERT 6V 8XSON | IC BUFFER NON-INVERT 5.5V 8XSON | IC BUFFER NON-INVERT 6V 8VSSOP |
| 厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
| 包装说明 | VSON, | 3 MM, PLASTIC, SOT505-2, TSSOP-8 | VSON, SOLCC8,.12,20 | 3 X 2 MM, 0.50 MM HEIGHT, 0.50 MM PITCH, PLASTIC, SOT996-2, SON-8 | 2.30 MM, PLASTIC, MO-187, SOT-765-1, VSSOP-8 |
| Reach Compliance Code | unknow | compliant | compliant | compliant | compliant |
| 系列 | HCT | - | HC/UH | - | HC/UH |
| JESD-30 代码 | R-PDSO-N8 | - | R-PDSO-N8 | - | R-PDSO-G8 |
| JESD-609代码 | e4 | - | e4 | - | e4 |
| 长度 | 3 mm | - | 3 mm | - | 2.3 mm |
| 逻辑集成电路类型 | BUS DRIVER | - | BUS DRIVER | - | BUS DRIVER |
| 位数 | 1 | - | 1 | - | 1 |
| 功能数量 | 2 | - | 2 | - | 2 |
| 端口数量 | 2 | - | 2 | - | 2 |
| 端子数量 | 8 | - | 8 | - | 8 |
| 最高工作温度 | 125 °C | - | 125 °C | - | 125 °C |
| 最低工作温度 | -40 °C | - | -40 °C | - | -40 °C |
| 输出特性 | 3-STATE | - | 3-STATE | - | 3-STATE |
| 输出极性 | TRUE | - | TRUE | - | TRUE |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
| 封装代码 | VSON | - | VSON | - | VSSOP |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | - | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, VERY THIN PROFILE | - | SMALL OUTLINE, VERY THIN PROFILE | - | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
| 传播延迟（tpd） | 36 ns | - | 135 ns | - | 135 ns |
| 座面最大高度 | 0.5 mm | - | 0.5 mm | - | 1 mm |
| 最大供电电压 (Vsup) | 5.5 V | - | 6 V | - | 6 V |
| 最小供电电压 (Vsup) | 4.5 V | - | 2 V | - | 2 V |
| 标称供电电压 (Vsup) | 5 V | - | 5 V | - | 5 V |
| 表面贴装 | YES | - | YES | - | YES |
| 技术 | CMOS | - | CMOS | - | CMOS |
| 温度等级 | AUTOMOTIVE | - | AUTOMOTIVE | - | AUTOMOTIVE |
| 端子面层 | NICKEL PALLADIUM GOLD | - | Nickel/Palladium/Gold (Ni/Pd/Au) | - | NICKEL PALLADIUM GOLD |
| 端子形式 | NO LEAD | - | NO LEAD | - | GULL WING |
| 端子节距 | 0.5 mm | - | 0.5 mm | - | 0.5 mm |
| 端子位置 | DUAL | - | DUAL | - | DUAL |
| 宽度 | 2 mm | - | 2 mm | - | 2 mm |
| Source Url Status Check Date | - | 2013-06-14 00:00:00 | 2013-06-14 00:00:00 | 2013-06-14 00:00:00 | - |
| Brand Name | - | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor |
| 是否Rohs认证 | - | 符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | - | TSSOP | SON | SON | SSOP |
| 针数 | - | 8 | 8 | 8 | 8 |
| 制造商包装代码 | - | SOT505-2 | SOT996-2 | SOT996-2 | SOT765-1 |
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