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74AHCT08PW-Q100

产品描述AHCT/VHCT/VT SERIES, QUAD 2-INPUT AND GATE, PDSO14, 4.40 MM, PLASTIC, MO-153, SOT402-1, TSSOP-14
产品类别逻辑    逻辑   
文件大小128KB,共14页
制造商NXP(恩智浦)
官网地址https://www.nxp.com
标准
下载文档 详细参数 选型对比 全文预览

74AHCT08PW-Q100概述

AHCT/VHCT/VT SERIES, QUAD 2-INPUT AND GATE, PDSO14, 4.40 MM, PLASTIC, MO-153, SOT402-1, TSSOP-14

74AHCT08PW-Q100规格参数

参数名称属性值
是否Rohs认证符合
厂商名称NXP(恩智浦)
零件包装代码TSSOP
包装说明4.40 MM, PLASTIC, MO-153, SOT402-1, TSSOP-14
针数14
Reach Compliance Codeunknow
系列AHCT/VHCT/VT
JESD-30 代码R-PDSO-G14
长度5 mm
逻辑集成电路类型AND GATE
湿度敏感等级1
功能数量4
输入次数2
端子数量14
最高工作温度125 °C
最低工作温度-40 °C
封装主体材料PLASTIC/EPOXY
封装代码TSSOP
封装形状RECTANGULAR
封装形式SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度(摄氏度)260
传播延迟(tpd)10 ns
筛选级别AEC-Q100
座面最大高度1.1 mm
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装YES
技术CMOS
温度等级AUTOMOTIVE
端子形式GULL WING
端子节距0.65 mm
端子位置DUAL
处于峰值回流温度下的最长时间30
宽度4.4 mm

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74AHC08-Q100; 74AHCT08-Q100
Quad 2-input AND gate
Rev. 1 — 16 April 2013
Product data sheet
1. General description
The 74AHC08-Q100; 74AHCT08-Q100 is a high-speed Si-gate CMOS device and is pin
compatible with Low-power Schottky TTL (LSTTL). They are specified in compliance with
JEDEC standard JESD7-A.
The 74AHC08-Q100; 74AHCT08-Q100 provides the quad 2-input AND function.
This product has been qualified to the Automotive Electronics Council (AEC) standard
Q100 (Grade 1) and is suitable for use in automotive applications.
2. Features and benefits
Automotive product qualification in accordance with AEC-Q100 (Grade 1)
Specified from
40 C
to +85
C
and from
40 C
to +125
C
Balanced propagation delays
All inputs have a Schmitt-trigger action
Inputs accept voltages higher than V
CC
For 74AHC08-Q100 only: operates with CMOS input levels
For 74AHCT08-Q100 only: operates with TTL input levels
ESD protection:
MIL-STD-883, method 3015 exceeds 2000 V
HBM JESD22-A114F exceeds 2000 V
MM JESD22-A115-A exceeds 200 V (C = 200 pF, R = 0
)
Multiple package options
3. Ordering information
Table 1.
Ordering information
Package
Temperature range Name
74AHC08D-Q100
74AHCT08D-Q100
74AHC08PW-Q100
74AHCT08PW-Q100
74AHC08BQ-Q100
74AHCT08BQ-Q100
40 C
to +125
C
40 C
to +125
C
TSSOP14
40 C
to +125
C
SO14
Description
plastic small outline package; 14 leads;
body width 3.9 mm
plastic thin shrink small outline package; 14 leads;
body width 4.4 mm
Version
SOT108-1
SOT402-1
SOT762-1
Type number
DHVQFN14 plastic dual in-line compatible thermal enhanced
very thin quad flat package; no leads; 14 terminals;
body 2.5
3
0.85 mm

74AHCT08PW-Q100相似产品对比

74AHCT08PW-Q100 74AHC08D-Q100 74AHCT08BQ-Q100 74AHC08BQ-Q100 74AHC08PW-Q100 74AHCT08D-Q100
描述 AHCT/VHCT/VT SERIES, QUAD 2-INPUT AND GATE, PDSO14, 4.40 MM, PLASTIC, MO-153, SOT402-1, TSSOP-14 AHC/VHC/H/U/V SERIES, QUAD 2-INPUT AND GATE, PDSO14, 3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14 AHCT/VHCT/VT SERIES, QUAD 2-INPUT AND GATE, PQCC14, 2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT762-1, DHVQFN-14 AHC/VHC/H/U/V SERIES, QUAD 2-INPUT AND GATE, PQCC14, 2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT762-1, DHVQFN-14 AHC/VHC/H/U/V SERIES, QUAD 2-INPUT AND GATE, PDSO14, 4.40 MM, PLASTIC, MO-153, SOT402-1, TSSOP-14 AHCT/VHCT/VT SERIES, QUAD 2-INPUT AND GATE, PDSO14, 3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14
是否Rohs认证 符合 符合 符合 符合 符合 符合
厂商名称 NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦)
零件包装代码 TSSOP SOIC QFN QFN TSSOP SOIC
包装说明 4.40 MM, PLASTIC, MO-153, SOT402-1, TSSOP-14 3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14 2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT762-1, DHVQFN-14 2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT762-1, DHVQFN-14 4.40 MM, PLASTIC, MO-153, SOT402-1, TSSOP-14 3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14
针数 14 14 14 14 14 14
Reach Compliance Code unknow unknown unknown unknown unknown unknown
系列 AHCT/VHCT/VT AHC/VHC/H/U/V AHCT/VHCT/VT AHC/VHC/H/U/V AHC/VHC/H/U/V AHCT/VHCT/VT
JESD-30 代码 R-PDSO-G14 R-PDSO-G14 R-PQCC-N14 R-PQCC-N14 R-PDSO-G14 R-PDSO-G14
长度 5 mm 8.65 mm 3 mm 3 mm 5 mm 8.65 mm
逻辑集成电路类型 AND GATE AND GATE AND GATE AND GATE AND GATE AND GATE
湿度敏感等级 1 1 1 1 1 1
功能数量 4 4 4 4 4 4
输入次数 2 2 2 2 2 2
端子数量 14 14 14 14 14 14
最高工作温度 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 TSSOP SOP HVQCCN HVQCCN TSSOP SOP
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE
峰值回流温度(摄氏度) 260 260 260 260 260 260
传播延迟(tpd) 10 ns 15.5 ns 10 ns 15.5 ns 15.5 ns 10 ns
筛选级别 AEC-Q100 AEC-Q100 AEC-Q100 AEC-Q100 AEC-Q100 AEC-Q100
座面最大高度 1.1 mm 1.75 mm 1 mm 1 mm 1.1 mm 1.75 mm
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 4.5 V 2 V 4.5 V 2 V 2 V 4.5 V
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
端子形式 GULL WING GULL WING NO LEAD NO LEAD GULL WING GULL WING
端子节距 0.65 mm 1.27 mm 0.5 mm 0.5 mm 0.65 mm 1.27 mm
端子位置 DUAL DUAL QUAD QUAD DUAL DUAL
处于峰值回流温度下的最长时间 30 30 30 30 30 30
宽度 4.4 mm 3.9 mm 2.5 mm 2.5 mm 4.4 mm 3.9 mm

 
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