Quad, Closed-Loop Monolithic Buffer
参数名称 | 属性值 |
厂商名称 | National Semiconductor(TI ) |
零件包装代码 | WAFER |
包装说明 | DIE, |
针数 | 11 |
Reach Compliance Code | unknow |
ECCN代码 | EAR99 |
放大器类型 | BUFFER |
最大平均偏置电流 (IIB) | 20 µA |
标称带宽 (3dB) | 700 MHz |
JESD-30 代码 | R-XUUC-N11 |
负供电电压上限 | -7 V |
标称负供电电压 (Vsup) | -5 V |
功能数量 | 1 |
端子数量 | 11 |
最小输出电流 | 0.048 A |
封装主体材料 | UNSPECIFIED |
封装代码 | DIE |
封装形状 | RECTANGULAR |
封装形式 | UNCASED CHIP |
认证状态 | Not Qualified |
标称压摆率 | 2700 V/us |
供电电压上限 | 7 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
端子形式 | NO LEAD |
端子位置 | UPPER |
CLC115MDC | CLC115 | CLC115AI | CLC115AJE | CLC115AJP | CLC115ALC | CLC115AMC | |
---|---|---|---|---|---|---|---|
描述 | Quad, Closed-Loop Monolithic Buffer | Quad, Closed-Loop Monolithic Buffer | Quad, Closed-Loop Monolithic Buffer | Quad, Closed-Loop Monolithic Buffer | Quad, Closed-Loop Monolithic Buffer | Quad, Closed-Loop Monolithic Buffer | Quad, Closed-Loop Monolithic Buffer |
零件包装代码 | WAFER | - | - | SOIC | DIP | WAFER | WAFER |
包装说明 | DIE, | - | - | SOP, SOP14,.25 | DIP, DIP14,.3 | DIE, DIE OR CHIP | DIE, DIE OR CHIP |
针数 | 11 | - | - | 14 | 14 | 11 | - |
Reach Compliance Code | unknow | - | - | unknow | unknow | unknow | unknow |
ECCN代码 | EAR99 | - | - | EAR99 | EAR99 | EAR99 | EAR99 |
放大器类型 | BUFFER | - | - | BUFFER | BUFFER | BUFFER | BUFFER |
最大平均偏置电流 (IIB) | 20 µA | - | - | 20 µA | 20 µA | 20 µA | 20 µA |
标称带宽 (3dB) | 700 MHz | - | - | 700 MHz | 270 MHz | 700 MHz | 700 MHz |
JESD-30 代码 | R-XUUC-N11 | - | - | R-PDSO-G14 | R-PDIP-T14 | X-XUUC-N10 | X-XUUC-N10 |
负供电电压上限 | -7 V | - | - | -7 V | -7 V | -7 V | -7 V |
标称负供电电压 (Vsup) | -5 V | - | - | -5 V | -5 V | -5 V | -5 V |
功能数量 | 1 | - | - | 4 | 4 | 4 | 4 |
端子数量 | 11 | - | - | 14 | 14 | 10 | 10 |
封装主体材料 | UNSPECIFIED | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED | UNSPECIFIED |
封装代码 | DIE | - | - | SOP | DIP | DIE | DIE |
封装形状 | RECTANGULAR | - | - | RECTANGULAR | RECTANGULAR | UNSPECIFIED | UNSPECIFIED |
封装形式 | UNCASED CHIP | - | - | SMALL OUTLINE | IN-LINE | UNCASED CHIP | UNCASED CHIP |
认证状态 | Not Qualified | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
标称压摆率 | 2700 V/us | - | - | 2700 V/us | 2700 V/us | 2700 V/us | 2700 V/us |
供电电压上限 | 7 V | - | - | 7 V | 7 V | 7 V | 7 V |
标称供电电压 (Vsup) | 5 V | - | - | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | - | - | YES | NO | YES | YES |
端子形式 | NO LEAD | - | - | GULL WING | THROUGH-HOLE | NO LEAD | NO LEAD |
端子位置 | UPPER | - | - | DUAL | DUAL | UPPER | UPPER |
25C 时的最大偏置电流 (IIB) | - | - | - | 20 µA | 20 µA | 20 µA | 20 µA |
最大输入失调电压 | - | - | - | 17000 µV | 9000 µV | 17000 µV | 17000 µV |
最高工作温度 | - | - | - | 85 °C | 85 °C | 125 °C | 125 °C |
最低工作温度 | - | - | - | -40 °C | -40 °C | -55 °C | -55 °C |
封装等效代码 | - | - | - | SOP14,.25 | DIP14,.3 | DIE OR CHIP | DIE OR CHIP |
电源 | - | - | - | +-5 V | +-5 V | +-5 V | +-5 V |
最小摆率 | - | - | - | 2200 V/us | 2200 V/us | 2200 V/us | 2200 V/us |
最大压摆率 | - | - | - | 61 mA | 61 mA | 61 mA | 61 mA |
技术 | - | - | - | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
温度等级 | - | - | - | INDUSTRIAL | INDUSTRIAL | MILITARY | MILITARY |
Base Number Matches | - | - | - | 1 | 1 | 1 | 1 |
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