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SST29EE010-70-4I-NH

产品描述Flash, 128KX8, 70ns, PQCC32, PLASTIC, MS-016AE, LCC-32
产品类别存储    存储   
文件大小771KB,共26页
制造商Silicon Laboratories Inc
下载文档 详细参数 选型对比 全文预览

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SST29EE010-70-4I-NH概述

Flash, 128KX8, 70ns, PQCC32, PLASTIC, MS-016AE, LCC-32

SST29EE010-70-4I-NH规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
厂商名称Silicon Laboratories Inc
零件包装代码QFJ
包装说明PLASTIC, MS-016AE, LCC-32
针数32
Reach Compliance Codeunknow
ECCN代码EAR99
最长访问时间70 ns
命令用户界面NO
数据轮询YES
JESD-30 代码R-PQCC-J32
JESD-609代码e0
长度13.97 mm
内存密度1048576 bi
内存集成电路类型FLASH
内存宽度8
功能数量1
端子数量32
字数131072 words
字数代码128000
工作模式ASYNCHRONOUS
最高工作温度85 °C
最低工作温度-40 °C
组织128KX8
封装主体材料PLASTIC/EPOXY
封装代码QCCJ
封装等效代码LDCC32,.5X.6
封装形状RECTANGULAR
封装形式CHIP CARRIER
页面大小128 words
并行/串行PARALLEL
峰值回流温度(摄氏度)240
电源5 V
编程电压5 V
认证状态Not Qualified
座面最大高度3.556 mm
最大待机电流0.00005 A
最大压摆率0.05 mA
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层Tin/Lead (Sn/Pb)
端子形式J BEND
端子节距1.27 mm
端子位置QUAD
处于峰值回流温度下的最长时间10
切换位YES
类型NOR TYPE
宽度11.43 mm
最长写入周期时间 (tWC)10 ms

文档预览

下载PDF文档
1 Mbit (128K x8) Page-Write EEPROM
SST29EE010 / SST29LE010 / SST29VE010
SST29EE / LE / VE0101Mb Page-Write flash memories
Data Sheet
FEATURES:
• Single Voltage Read and Write Operations
– 4.5-5.5V for SST29EE010
– 3.0-3.6V for SST29LE010
– 2.7-3.6V for SST29VE010
• Superior Reliability
– Endurance: 100,000 Cycles (typical)
– Greater than 100 years Data Retention
• Low Power Consumption
– Active Current: 20 mA (typical) for 5V and 10 mA
(typical) for 3.0/2.7V
– Standby Current: 10 µA (typical)
• Fast Page-Write Operation
– 128 Bytes per Page, 1024 Pages
– Page-Write Cycle: 5 ms (typical)
– Complete Memory Rewrite: 5 sec (typical)
– Effective Byte-Write Cycle Time: 39 µs (typical)
• Fast Read Access Time
– 4.5-5.5V operation: 70 and 90 ns
– 3.0-3.6V operation: 150 and 200 ns
– 2.7-3.6V operation: 200 ns
• Latched Address and Data
• Automatic Write Timing
– Internal V
PP
Generation
• End of Write Detection
– Toggle Bit
– Data# Polling
• Hardware and Software Data Protection
• Product Identification can be accessed via
Software Operation
• TTL I/O Compatibility
• JEDEC Standard
– Flash EEPROM Pinouts and command sets
• Packages Available
– 32-lead PLCC
– 32-lead TSOP (8mm x 14mm, 8mm x 20mm)
– 32-pin PDIP
PRODUCT DESCRIPTION
The SST29EE/LE/VE010 are 128K x8 CMOS Page-Write
EEPROMs manufactured with SST’s proprietary, high per-
formance CMOS SuperFlash technology. The split-gate
cell design and thick oxide tunneling injector attain better
reliability and manufacturability compared with alternate
approaches. The SST29EE/LE/VE010 write with a single
power supply. Internal Erase/Program is transparent to the
user. The SST29EE/LE/VE010 conform to JEDEC stan-
dard pinouts for byte-wide memories.
Featuring high performance Page-Write, the SST29EE/LE/
VE010 provide a typical Byte-Write time of 39 µsec. The
entire memory, i.e., 128 Kbyte, can be written page-by-
page in as little as 5 seconds, when using interface features
such as Toggle Bit or Data# Polling to indicate the comple-
tion of a Write cycle. To protect against inadvertent write,
the SST29EE/LE/VE010 have on-chip hardware and Soft-
ware Data Protection schemes. Designed, manufactured,
and tested for a wide spectrum of applications, the
SST29EE/LE/VE010 are offered with a guaranteed Page-
Write endurance of 10,000 cycles. Data retention is rated at
greater than 100 years.
The SST29EE/LE/VE010 are suited for applications
that require convenient and economical updating of
program, configuration, or data memory. For all sys-
tem applications, the SST29EE/LE/VE010 significantly
improve performance and reliability, while lowering
power consumption. The
SST29EE/LE/VE010
improve flexibility while lowering the cost for program,
data, and configuration storage applications.
To meet high density, surface mount requirements, the
SST29EE/LE/VE010 are offered in 32-lead PLCC and 32-
lead TSOP packages. A 600-mil, 32-pin PDIP package is
also available. See Figures 1, 2, and 3 for pinouts.
Device Operation
The SST Page-Write EEPROM offers in-circuit electrical
write capability. The SST29EE/LE/VE010 does not require
separate Erase and Program operations. The internally
timed Write cycle executes both erase and program trans-
parently to the user. The SST29EE/LE/VE010 have indus-
try standard optional Software Data Protection, which SST
recommends always to be enabled. The SST29EE/LE/
VE010 are compatible with industry standard EEPROM
pinouts and functionality.
©2002 Silicon Storage Technology, Inc.
S71061-07-000 2/02
304
1
The SST logo and SuperFlash are registered trademarks of Silicon Storage Technology, Inc.
Small-Sector Flash and SSF are trademarks of Silicon Storage Technology, Inc.
These specifications are subject to change without notice.

SST29EE010-70-4I-NH相似产品对比

SST29EE010-70-4I-NH SST29EE010-70-4C-NH SST29EE010-90-4C-PH SST29EE010-90-4C-WH
描述 Flash, 128KX8, 70ns, PQCC32, PLASTIC, MS-016AE, LCC-32 Flash, 128KX8, 70ns, PQCC32, PLASTIC, MS-016AE, LCC-32 Flash, 128KX8, 90ns, PDIP32, 0.600 INCH, PLASTIC, MO-015AP, DIP-32 Flash, 128KX8, 90ns, PDSO32, 8 X 14 MM, MO-142BA, TSOP1-32
是否Rohs认证 不符合 不符合 不符合 不符合
厂商名称 Silicon Laboratories Inc Silicon Laboratories Inc Silicon Laboratories Inc Silicon Laboratories Inc
零件包装代码 QFJ QFJ DIP TSOP1
包装说明 PLASTIC, MS-016AE, LCC-32 PLASTIC, MS-016AE, LCC-32 0.600 INCH, PLASTIC, MO-015AP, DIP-32 8 X 14 MM, MO-142BA, TSOP1-32
针数 32 32 32 32
Reach Compliance Code unknow unknown unknown unknown
ECCN代码 EAR99 EAR99 EAR99 EAR99
最长访问时间 70 ns 70 ns 90 ns 90 ns
命令用户界面 NO NO NO NO
数据轮询 YES YES YES YES
JESD-30 代码 R-PQCC-J32 R-PQCC-J32 R-PDIP-T32 R-PDSO-G32
JESD-609代码 e0 e0 e0 e0
长度 13.97 mm 13.97 mm 41.91 mm 12.4 mm
内存密度 1048576 bi 1048576 bit 1048576 bit 1048576 bit
内存集成电路类型 FLASH FLASH FLASH FLASH
内存宽度 8 8 8 8
功能数量 1 1 1 1
端子数量 32 32 32 32
字数 131072 words 131072 words 131072 words 131072 words
字数代码 128000 128000 128000 128000
工作模式 ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 85 °C 70 °C 70 °C 70 °C
组织 128KX8 128KX8 128KX8 128KX8
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 QCCJ QCCJ DIP TSOP1
封装等效代码 LDCC32,.5X.6 LDCC32,.5X.6 DIP32,.6 TSSOP32,.56,20
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 CHIP CARRIER CHIP CARRIER IN-LINE SMALL OUTLINE, THIN PROFILE
页面大小 128 words 128 words 128 words 128 words
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL
峰值回流温度(摄氏度) 240 240 NOT SPECIFIED NOT SPECIFIED
电源 5 V 5 V 5 V 5 V
编程电压 5 V 5 V 5 V 5 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 3.556 mm 3.556 mm 5.08 mm 1.2 mm
最大待机电流 0.00005 A 0.00005 A 0.00005 A 0.00005 A
最大压摆率 0.05 mA 0.05 mA 0.05 mA 0.05 mA
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V
表面贴装 YES YES NO YES
技术 CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL COMMERCIAL COMMERCIAL COMMERCIAL
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
端子形式 J BEND J BEND THROUGH-HOLE GULL WING
端子节距 1.27 mm 1.27 mm 2.54 mm 0.5 mm
端子位置 QUAD QUAD DUAL DUAL
处于峰值回流温度下的最长时间 10 10 NOT SPECIFIED NOT SPECIFIED
切换位 YES YES YES YES
类型 NOR TYPE NOR TYPE NOR TYPE NOR TYPE
宽度 11.43 mm 11.43 mm 15.24 mm 8 mm
最长写入周期时间 (tWC) 10 ms 10 ms 10 ms 10 ms
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