TDA1308AT
| 参数名称 | 属性值 |
| Source Url Status Check Date | 2013-06-14 00:00:00 |
| Brand Name | NXP Semiconduc |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | NXP(恩智浦) |
| 零件包装代码 | SOIC |
| 包装说明 | SOP, SOP8,.25 |
| 针数 | 8 |
| Reach Compliance Code | unknow |
| ECCN代码 | EAR99 |
| 其他特性 | IT CAN ALSO OPERATE WITH SINGLE 2.4V TO 7V SUPPLY |
| 标称带宽 | 20 kHz |
| 商用集成电路类型 | AUDIO AMPLIFIER |
| JESD-30 代码 | R-PDSO-G8 |
| 长度 | 4.9 mm |
| 湿度敏感等级 | 1 |
| 信道数量 | 2 |
| 功能数量 | 2 |
| 端子数量 | 8 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 标称输出功率 | 0.04 W |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP8,.25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | 225 |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.75 mm |
| 最大压摆率 | 5 mA |
| 最大供电电压 (Vsup) | 3.5 V |
| 最小供电电压 (Vsup) | 1.2 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 3.9 mm |
| TDA1308AT/N1,112 | TDA1308TT/N1,118 | TDA1308/N1,112 | TDA1308AT/N1,115 | |
|---|---|---|---|---|
| 描述 | TDA1308AT | TDA1308 - Class-AB stereo headphone driver TSSOP 8-Pin | TDA1308 - Class-AB stereo headphone driver | TDA1308AT |
| Source Url Status Check Date | 2013-06-14 00:00:00 | 2013-06-14 00:00:00 | 2013-10-15 00:00:00 | 2013-06-14 00:00:00 |
| Brand Name | NXP Semiconduc | NXP Semiconductor | NXP Semiconductor | NXP Semiconduc |
| 厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
| 零件包装代码 | SOIC | TSSOP | DIP | SOIC |
| 包装说明 | SOP, SOP8,.25 | TSSOP, TSSOP8,.19 | 0.300 INCH, PLASTIC, MO-001, SOT-97-1, DIP-8 | 3.90 MM, PLASTIC, MS-012, SOT-96-1, SOP-8 |
| 针数 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | unknow | unknown | unknown | unknow |
| 其他特性 | IT CAN ALSO OPERATE WITH SINGLE 2.4V TO 7V SUPPLY | IT CAN ALSO OPERATE WITH SINGLE 3V TO 7V SUPPLY | IT CAN ALSO OPERATE WITH SINGLE 3V TO 7V SUPPLY | IT CAN ALSO OPERATE WITH SINGLE 2.4V TO 7V SUPPLY |
| 标称带宽 | 20 kHz | 20 kHz | 20 kHz | 20 kHz |
| 商用集成电路类型 | AUDIO AMPLIFIER | AUDIO AMPLIFIER | AUDIO AMPLIFIER | AUDIO AMPLIFIER |
| JESD-30 代码 | R-PDSO-G8 | S-PDSO-G8 | R-PDIP-T8 | R-PDSO-G8 |
| 长度 | 4.9 mm | 3 mm | 9.5 mm | 4.9 mm |
| 信道数量 | 2 | 2 | 2 | 2 |
| 功能数量 | 2 | 1 | 1 | 2 |
| 端子数量 | 8 | 8 | 8 | 8 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C |
| 标称输出功率 | 0.04 W | 0.04 W | 0.04 W | 0.04 W |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | TSSOP | DIP | SOP |
| 封装等效代码 | SOP8,.25 | TSSOP8,.19 | DIP8,.3 | SOP8,.25 |
| 封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | IN-LINE | SMALL OUTLINE |
| 电源 | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.75 mm | 1.1 mm | 4.2 mm | 1.75 mm |
| 最大压摆率 | 5 mA | 5 mA | 5 mA | 5 mA |
| 最大供电电压 (Vsup) | 3.5 V | 3.5 V | 3.5 V | 3.5 V |
| 最小供电电压 (Vsup) | 1.2 V | 1.5 V | 1.5 V | 1.2 V |
| 表面贴装 | YES | YES | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | GULL WING | GULL WING | THROUGH-HOLE | GULL WING |
| 端子节距 | 1.27 mm | 0.65 mm | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 3.9 mm | 3 mm | 7.62 mm | 3.9 mm |
| 是否Rohs认证 | 不符合 | - | 不符合 | 不符合 |
| ECCN代码 | EAR99 | EAR99 | - | EAR99 |
| 湿度敏感等级 | 1 | 1 | - | 1 |
| 峰值回流温度（摄氏度） | 225 | 225 | - | 225 |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED |
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