Standard SRAM, 8KX8, 9ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28
参数名称 | 属性值 |
厂商名称 | Micron Technology |
零件包装代码 | DIP |
包装说明 | DIP, |
针数 | 28 |
Reach Compliance Code | unknow |
ECCN代码 | EAR99 |
最长访问时间 | 9 ns |
其他特性 | TTL-COMPATIBLE INPUTS & OUTPUTS |
JESD-30 代码 | R-PDIP-T28 |
长度 | 36.83 mm |
内存密度 | 65536 bi |
内存集成电路类型 | STANDARD SRAM |
内存宽度 | 8 |
功能数量 | 1 |
端子数量 | 28 |
字数 | 8192 words |
字数代码 | 8000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 125 °C |
最低工作温度 | -40 °C |
组织 | 8KX8 |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | DIP |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
并行/串行 | PARALLEL |
认证状态 | Not Qualified |
座面最大高度 | 4.32 mm |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | AUTOMOTIVE |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
宽度 | 7.62 mm |
MT5C6408-9LAT | MT5C6408-15LAT | MT5C6408-12L | MT5C6408-9LXT | MT5C6408-9L | MT5C6408-9LIT | |
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描述 | Standard SRAM, 8KX8, 9ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28 | Standard SRAM, 8KX8, 15ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28 | Standard SRAM, 8KX8, 12ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28 | Standard SRAM, 8KX8, 9ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28 | Standard SRAM, 8KX8, 9ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28 | Standard SRAM, 8KX8, 9ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28 |
厂商名称 | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology |
零件包装代码 | DIP | DIP | DIP | DIP | DIP | DIP |
包装说明 | DIP, | 0.300 INCH, PLASTIC, DIP-28 | 0.300 INCH, PLASTIC, DIP-28 | DIP, | 0.300 INCH, PLASTIC, DIP-28 | DIP, |
针数 | 28 | 28 | 28 | 28 | 28 | 28 |
Reach Compliance Code | unknow | not_compliant | not_compliant | unknown | _compli | unknow |
ECCN代码 | EAR99 | EAR99 | EAR99 | 3A001.A.2.C | EAR99 | EAR99 |
最长访问时间 | 9 ns | 15 ns | 12 ns | 9 ns | 9 ns | 9 ns |
其他特性 | TTL-COMPATIBLE INPUTS & OUTPUTS | TTL-COMPATIBLE INPUTS & OUTPUTS | TTL-COMPATIBLE INPUTS & OUTPUTS | TTL-COMPATIBLE INPUTS & OUTPUTS | TTL-COMPATIBLE INPUTS & OUTPUTS | TTL-COMPATIBLE INPUTS & OUTPUTS |
JESD-30 代码 | R-PDIP-T28 | R-PDIP-T28 | R-PDIP-T28 | R-PDIP-T28 | R-PDIP-T28 | R-PDIP-T28 |
长度 | 36.83 mm | 36.83 mm | 36.83 mm | 36.83 mm | 36.83 mm | 36.83 mm |
内存密度 | 65536 bi | 65536 bit | 65536 bit | 65536 bit | 65536 bi | 65536 bi |
内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 28 | 28 | 28 | 28 | 28 | 28 |
字数 | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words |
字数代码 | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 125 °C | 125 °C | 70 °C | 125 °C | 70 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | - | -55 °C | - | -40 °C |
组织 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | DIP | DIP | DIP | DIP | DIP | DIP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 4.32 mm | 4.32 mm | 4.32 mm | 4.32 mm | 4.32 mm | 4.32 mm |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | NO | NO | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | AUTOMOTIVE | AUTOMOTIVE | COMMERCIAL | MILITARY | COMMERCIAL | INDUSTRIAL |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
宽度 | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm |
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