XNOR Gate, CMOS,
参数名称 | 属性值 |
厂商名称 | RCA |
包装说明 | , DIE OR CHIP |
Reach Compliance Code | unknow |
负载电容(CL) | 50 pF |
逻辑集成电路类型 | XNOR GATE |
最大I(ol) | 0.004 A |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
封装等效代码 | DIE OR CHIP |
电源 | 2/6 V |
Prop。Delay @ Nom-Su | 35 ns |
认证状态 | Not Qualified |
施密特触发器 | NO |
技术 | CMOS |
温度等级 | MILITARY |
CD54HC7266H | CD54HC7266F | CD54HC7266F/3A | CD74HC7266EX | CD74HC7266H | CD74HC7266M | CD74HC7266M96 | CD74HC7266E | |
---|---|---|---|---|---|---|---|---|
描述 | XNOR Gate, CMOS, | XNOR Gate, CMOS, CDIP14, | XNOR Gate, CMOS, CDIP14 | XNOR Gate, CMOS, PDIP14, | XNOR Gate, CMOS, | XNOR Gate, CMOS, PDSO14, | XNOR Gate, CMOS, PDSO14, | XNOR Gate, CMOS, PDIP14, |
Reach Compliance Code | unknow | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
负载电容(CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
逻辑集成电路类型 | XNOR GATE | XNOR GATE | XNOR GATE | XNOR GATE | XNOR GATE | XNOR GATE | XNOR GATE | XNOR GATE |
最大I(ol) | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A |
最高工作温度 | 125 °C | 125 °C | 125 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
封装等效代码 | DIE OR CHIP | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIE OR CHIP | SOP14,.25 | SOP14,.25 | DIP14,.3 |
电源 | 2/6 V | 2/6 V | 2/6 V | 2/6 V | 2/6 V | 2/6 V | 2/6 V | 2/6 V |
施密特触发器 | NO | NO | NO | NO | NO | NO | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | MILITARY | MILITARY | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
厂商名称 | RCA | RCA | RCA | - | RCA | RCA | RCA | RCA |
包装说明 | , DIE OR CHIP | DIP, DIP14,.3 | - | DIP, DIP14,.3 | , DIE OR CHIP | SOP, SOP14,.25 | SOP, SOP14,.25 | DIP, DIP14,.3 |
认证状态 | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
是否Rohs认证 | - | 不符合 | 不符合 | 不符合 | - | 不符合 | 不符合 | 不符合 |
JESD-30 代码 | - | R-XDIP-T14 | R-XDIP-T14 | R-PDIP-T14 | - | R-PDSO-G14 | R-PDSO-G14 | R-PDIP-T14 |
JESD-609代码 | - | e0 | e0 | e0 | - | e0 | e0 | e0 |
端子数量 | - | 14 | 14 | 14 | - | 14 | 14 | 14 |
封装主体材料 | - | CERAMIC | CERAMIC | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | - | DIP | DIP | DIP | - | SOP | SOP | DIP |
封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | - | IN-LINE | IN-LINE | IN-LINE | - | SMALL OUTLINE | SMALL OUTLINE | IN-LINE |
Prop。Delay @ Nom-Sup | - | 35 ns | 35 ns | 29 ns | 29 ns | 29 ns | 29 ns | 29 ns |
表面贴装 | - | NO | NO | NO | - | YES | YES | NO |
端子面层 | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | - | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | - | GULL WING | GULL WING | THROUGH-HOLE |
端子节距 | - | 2.54 mm | 2.54 mm | 2.54 mm | - | 1.27 mm | 1.27 mm | 2.54 mm |
端子位置 | - | DUAL | DUAL | DUAL | - | DUAL | DUAL | DUAL |
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