DDR DRAM Module, 64MX8, CMOS, STACK, TSOP-66
| 参数名称 | 属性值 |
| 厂商名称 | B&B Electronics Manufacturing Company |
| 零件包装代码 | DMA |
| 包装说明 | , |
| 针数 | 66 |
| Reach Compliance Code | unknow |
| ECCN代码 | EAR99 |
| 访问模式 | DUAL BANK PAGE BURST |
| 其他特性 | AUTO/SELF REFRESH |
| JESD-30 代码 | R-XDMA-G66 |
| 内存密度 | 536870912 bi |
| 内存集成电路类型 | DDR DRAM MODULE |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端口数量 | 1 |
| 端子数量 | 66 |
| 字数 | 67108864 words |
| 字数代码 | 64000000 |
| 工作模式 | SYNCHRONOUS |
| 组织 | 64MX8 |
| 封装主体材料 | UNSPECIFIED |
| 封装形状 | RECTANGULAR |
| 封装形式 | MICROELECTRONIC ASSEMBLY |
| 认证状态 | Not Qualified |
| 自我刷新 | YES |
| 标称供电电压 (Vsup) | 2.5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 端子形式 | GULL WING |
| 端子位置 | DUAL |
| DPDD64MX8WSBNY5-DP-XX0820 | DPDD64MX8WSBNY5-DP-XX0825 | DPDD64MX8WSBNY5-DP-XX7025 | DPDD64MX8WSBNY5-DP-XX7020 | DPDD64MX8WSBNY5-DP-XX7520 | DPDD64MX8WSBNY5-DP-XX6020 | DPDD64MX8WSBNY5-DP-XX7525 | DPDD64MX8WSBNY5-DP-XX1025 | DPDD64MX8WSBNY5-DP-XX1020 | DPDD64MX8WSBNY5-DP-XX6025 | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | DDR DRAM Module, 64MX8, CMOS, STACK, TSOP-66 | DDR DRAM Module, 64MX8, CMOS, STACK, TSOP-66 | DDR DRAM Module, 64MX8, CMOS, STACK, TSOP-66 | DDR DRAM Module, 64MX8, CMOS, STACK, TSOP-66 | DDR DRAM Module, 64MX8, CMOS, STACK, TSOP-66 | DDR DRAM Module, 64MX8, CMOS, STACK, TSOP-66 | DDR DRAM Module, 64MX8, CMOS, STACK, TSOP-66 | DDR DRAM Module, 64MX8, CMOS, STACK, TSOP-66 | DDR DRAM Module, 64MX8, CMOS, STACK, TSOP-66 | DDR DRAM Module, 64MX8, CMOS, STACK, TSOP-66 |
| 零件包装代码 | DMA | DMA | DMA | DMA | DMA | DMA | DMA | DMA | DMA | DMA |
| 针数 | 66 | 66 | 66 | 66 | 66 | 66 | 66 | 66 | 66 | 66 |
| Reach Compliance Code | unknow | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 访问模式 | DUAL BANK PAGE BURST | DUAL BANK PAGE BURST | DUAL BANK PAGE BURST | DUAL BANK PAGE BURST | DUAL BANK PAGE BURST | DUAL BANK PAGE BURST | DUAL BANK PAGE BURST | DUAL BANK PAGE BURST | DUAL BANK PAGE BURST | DUAL BANK PAGE BURST |
| 其他特性 | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH |
| JESD-30 代码 | R-XDMA-G66 | R-XDMA-G66 | R-XDMA-G66 | R-XDMA-G66 | R-XDMA-G66 | R-XDMA-G66 | R-XDMA-G66 | R-XDMA-G66 | R-XDMA-G66 | R-XDMA-G66 |
| 内存密度 | 536870912 bi | 536870912 bit | 536870912 bit | 536870912 bit | 536870912 bit | 536870912 bit | 536870912 bit | 536870912 bit | 536870912 bit | 536870912 bit |
| 内存集成电路类型 | DDR DRAM MODULE | DDR DRAM MODULE | DDR DRAM MODULE | DDR DRAM MODULE | DDR DRAM MODULE | DDR DRAM MODULE | DDR DRAM MODULE | DDR DRAM MODULE | DDR DRAM MODULE | DDR DRAM MODULE |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 66 | 66 | 66 | 66 | 66 | 66 | 66 | 66 | 66 | 66 |
| 字数 | 67108864 words | 67108864 words | 67108864 words | 67108864 words | 67108864 words | 67108864 words | 67108864 words | 67108864 words | 67108864 words | 67108864 words |
| 字数代码 | 64000000 | 64000000 | 64000000 | 64000000 | 64000000 | 64000000 | 64000000 | 64000000 | 64000000 | 64000000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 组织 | 64MX8 | 64MX8 | 64MX8 | 64MX8 | 64MX8 | 64MX8 | 64MX8 | 64MX8 | 64MX8 | 64MX8 |
| 封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 自我刷新 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 标称供电电压 (Vsup) | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Base Number Matches | - | 1 | 1 | 1 | 1 | 1 | 1 | - | - | - |
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