电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

HLMA-QF00-PQ031

产品描述Single Color LED, Red, Untinted Nondiffused, T-3/4, 1.78mm, PLASTIC PACKAGE-2
产品类别光电子/LED    光电   
文件大小71KB,共9页
制造商Broadcom(博通)
下载文档 详细参数 全文预览

HLMA-QF00-PQ031概述

Single Color LED, Red, Untinted Nondiffused, T-3/4, 1.78mm, PLASTIC PACKAGE-2

HLMA-QF00-PQ031规格参数

参数名称属性值
厂商名称Broadcom(博通)
包装说明PLASTIC PACKAGE-2
Reach Compliance Codecompli
颜色RED
配置SINGLE
最大正向电流0.05 A
透镜类型UNTINTED NONDIFFUSED
标称发光强度82.5 mcd
安装特点SURFACE MOUNT
功能数量1
端子数量2
最高工作温度100 °C
最低工作温度-40 °C
光电设备类型SINGLE COLOR LED
总高度2.92 mm
包装方法TAPE AND REEL 7\"
峰值波长635 nm
形状ROUND
尺寸1.78 mm
表面贴装YES
T代码T-3/4
视角15 deg

文档预览

下载PDF文档
HLMA-Qx00, HLMA-Px00 HLMT-Px00 and HLMT-Qx00
Subminiature High Performance AlInGaP LED Lamps
Data Sheet
SunPower Series
HLMA-PF00, HLMA-PG00, HLMA-PH00, HLMA-PL00, HLMA-QF00, HLMA-QG00, HLMA-QH00,
HLMA-QL00, HLMT-PG00, HLMT-PH00, HLMT-PL00, HLMT-QG00, HLMT-QH00, HLMT-QL00
Description
Flat Top Package
The HLMX-PXXX flat top lamps use an untinted, nondif-
fused, truncated lens to provide a wide radiation pattern
that is necessary for use in backlighting applications. The
flat top lamps are also ideal for use as emitters in light
pipe applications.
Features
Subminiature flat top package
Ideal for backlighting and light piping applications
Subminiature dome package
Nondiffused dome for high brightness
Wide range of drive currents
Colors: 590 nm Amber, 605 nm Orange, 615 nm Red-
dish-Orange, 622/626 nm Red, and 635 nm Red
Ideal for space limited applications
Axial leads
Available with lead configurations for surface mount
and through hole PC board mounting
Dome Packages
The HLMX-QXXX dome lamps use an untinted, nondif-
fused lens to provide a high luminous intensity within a
narrow radiation pattern.
Lead Configurations
All of these devices are made by encapsulating LED chips
on axial lead frames to form molded epoxy submini-
ature lamp packages. A variety of package configuration
options is available. These include special surface mount
lead configurations, gull wing, yoke lead, or Z-bend. Right
angle lead bends at 2.54 mm (0.100 inch) and 5.08 mm
(0.200 inch) center spacing are available for through hole
mounting. For more information refer to Standard SMT
and Through Hole Lead Bend Options for Subminiature
LED Lamps data sheet.
Technology
These subminiature solid state lamps utilize one of the
two newly developed aluminum indium gallium phos-
phide (AlInGaP) LED technologies. The HLMT-Devices
are especially effective in very bright ambient lighting
conditions. The colors 590 nm amber, 605 nm orange,
615 nm reddish-orange, 622/626 nm red, and 635 nm red
are available with viewing angles of 15° for the domed
devices and 125° for the flat top devices.
如何改变镜像的名称"VXWORKS"
Tornado 生成VXWORKS镜像的名称都为“VXWORKS”,有没有可能改成其他的名字?...
thedegree 实时操作系统RTOS
MSP430的PC指针如何修改
目前在做IAP升级,将升级程序从外部E2PROM导入RAM后,需要修改PC指针指向RAM空间的首地址。求问:修改PC值该咋办?用C语言咋实现?IAR好像不支持嵌入汇编。不胜感激!...
bsnzc 微控制器 MCU
GD32F350--体验之五(关于串口官方一些细节操作)
今晚本来想利用串口自带的块尾中断来接收一帧完整的modbus协议,回来的时候,刚想动手把其调通,没想到突然看了手册,串口1竟然只是实现了官方的部分功能,不支持modbus通信!串口0才全部支 ......
RCSN GD32 MCU
如果用6mil的线输出5V电压,会有什么影响
如果用6mil的线输出5V电压,会有什么影响 ...
a956880405 DIY/开源硬件专区
交流特性分析——需要考虑开关卡的通路隔离和带宽指标
瞬态和交流特性分析在半导体行业中非常重要,分析这些特性可用来开发合适的电子模块和了解器件的状态转换。 为了简化电容-电压(C-V)测量,需注意通路隔离指标的电容部分,并选择具有低杂散 ......
Jack_ma 测试/测量
C6000 Cache(缓存)
1. 为什么需要Cache? 大容量的存储器(如DRAM)访问速度受到限制,一般比CPU时钟速度慢很多;小容量的存储器(如SRAM)能提供快速的访问速度。因此很多高性能的处理器都提供分层的存储访问架 ......
Jacktang 微控制器 MCU

技术资料推荐更多

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 883  2391  601  693  394  18  49  13  14  8 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved