Standard SRAM, 512KX16, 100ns, CMOS, PDSO48, 12 X 18 MM, LEAD FREE, PLASTIC, TSOP1-48
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | NEC(日电) |
| 包装说明 | 12 X 18 MM, LEAD FREE, PLASTIC, TSOP1-48 |
| Reach Compliance Code | compli |
| 最长访问时间 | 100 ns |
| JESD-30 代码 | R-PDSO-G48 |
| JESD-609代码 | e3/e6 |
| 长度 | 18 mm |
| 内存密度 | 8388608 bi |
| 内存集成电路类型 | STANDARD SRAM |
| 内存宽度 | 16 |
| 功能数量 | 1 |
| 端子数量 | 48 |
| 字数 | 524288 words |
| 字数代码 | 512000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -25 °C |
| 组织 | 512KX16 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.2 mm |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 2.2 V |
| 标称供电电压 (Vsup) | 2.7 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | OTHER |
| 端子面层 | MATTE TIN/TIN BISMUTH |
| 端子形式 | GULL WING |
| 端子节距 | 0.5 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 12 mm |
| UPD448012GY-C10X-MJH-A | UPD448012GY-C12X-MJH-A | UPD448012GY-B55X-MJH-A | UPD448012GY-B55X-MJH | UPD448012GY-B70X-MJH-A | UPD448012GY-C85X-MJH | UPD448012GY-C70X-MJH-A | UPD448012GY-C12X-MJH | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Standard SRAM, 512KX16, 100ns, CMOS, PDSO48, 12 X 18 MM, LEAD FREE, PLASTIC, TSOP1-48 | Standard SRAM, 512KX16, 120ns, CMOS, PDSO48, 12 X 18 MM, LEAD FREE, PLASTIC, TSOP1-48 | Standard SRAM, 512KX16, 55ns, CMOS, PDSO48, 12 X 18 MM, LEAD FREE, PLASTIC, TSOP1-48 | Standard SRAM, 512KX16, 55ns, CMOS, PDSO48, 12 X 18 MM, PLASTIC, TSOP1-48 | Standard SRAM, 512KX16, 70ns, CMOS, PDSO48, 12 X 18 MM, LEAD FREE, PLASTIC, TSOP1-48 | Standard SRAM, 512KX16, 85ns, CMOS, PDSO48, 12 X 18 MM, PLASTIC, TSOP1-48 | Standard SRAM, 512KX16, 70ns, CMOS, PDSO48, 12 X 18 MM, LEAD FREE, PLASTIC, TSOP1-48 | Standard SRAM, 512KX16, 120ns, CMOS, PDSO48, 12 X 18 MM, PLASTIC, TSOP1-48 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 不符合 | 符合 | 不符合 | 符合 | 不符合 |
| 厂商名称 | NEC(日电) | NEC(日电) | NEC(日电) | NEC(日电) | NEC(日电) | NEC(日电) | NEC(日电) | NEC(日电) |
| 包装说明 | 12 X 18 MM, LEAD FREE, PLASTIC, TSOP1-48 | 12 X 18 MM, LEAD FREE, PLASTIC, TSOP1-48 | 12 X 18 MM, LEAD FREE, PLASTIC, TSOP1-48 | 12 X 18 MM, PLASTIC, TSOP1-48 | 12 X 18 MM, LEAD FREE, PLASTIC, TSOP1-48 | 12 X 18 MM, PLASTIC, TSOP1-48 | 12 X 18 MM, LEAD FREE, PLASTIC, TSOP1-48 | 12 X 18 MM, PLASTIC, TSOP1-48 |
| Reach Compliance Code | compli | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| 最长访问时间 | 100 ns | 120 ns | 55 ns | 55 ns | 70 ns | 85 ns | 70 ns | 120 ns |
| JESD-30 代码 | R-PDSO-G48 | R-PDSO-G48 | R-PDSO-G48 | R-PDSO-G48 | R-PDSO-G48 | R-PDSO-G48 | R-PDSO-G48 | R-PDSO-G48 |
| JESD-609代码 | e3/e6 | e3/e6 | e3/e6 | e0 | e3/e6 | e0 | e3/e6 | e0 |
| 长度 | 18 mm | 18 mm | 18 mm | 18 mm | 18 mm | 18 mm | 18 mm | 18 mm |
| 内存密度 | 8388608 bi | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit |
| 内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| 内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 48 | 48 | 48 | 48 | 48 | 48 | 48 | 48 |
| 字数 | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words |
| 字数代码 | 512000 | 512000 | 512000 | 512000 | 512000 | 512000 | 512000 | 512000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -25 °C | -25 °C | -25 °C | -25 °C | -25 °C | -25 °C | -25 °C | -25 °C |
| 组织 | 512KX16 | 512KX16 | 512KX16 | 512KX16 | 512KX16 | 512KX16 | 512KX16 | 512KX16 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 2.2 V | 2.2 V | 2.7 V | 2.7 V | 2.7 V | 2.2 V | 2.2 V | 2.2 V |
| 标称供电电压 (Vsup) | 2.7 V | 2.7 V | 3 V | 3 V | 3 V | 2.7 V | 2.7 V | 2.7 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | OTHER | OTHER | OTHER | OTHER | OTHER | OTHER | OTHER | OTHER |
| 端子面层 | MATTE TIN/TIN BISMUTH | MATTE TIN/TIN BISMUTH | MATTE TIN/TIN BISMUTH | TIN LEAD | MATTE TIN/TIN BISMUTH | TIN LEAD | MATTE TIN/TIN BISMUTH | TIN LEAD |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 12 mm | 12 mm | 12 mm | 12 mm | 12 mm | 12 mm | 12 mm | 12 mm |
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