TQFP-100, Tray
| 参数名称 | 属性值 |
| Brand Name | Integrated Device Technology |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | IDT (Integrated Device Technology) |
| 零件包装代码 | TQFP |
| 包装说明 | PLASTIC, TQFP-100 |
| 针数 | 100 |
| 制造商包装代码 | PK100 |
| Reach Compliance Code | _compli |
| 最长访问时间 | 3.5 ns |
| 其他特性 | PIPELINED ARCHITECTURE |
| 最大时钟频率 (fCLK) | 166 MHz |
| I/O 类型 | COMMON |
| JESD-30 代码 | R-PQFP-G100 |
| JESD-609代码 | e0 |
| 内存密度 | 4718592 bi |
| 内存集成电路类型 | STANDARD SRAM |
| 内存宽度 | 18 |
| 湿度敏感等级 | 3 |
| 功能数量 | 1 |
| 端子数量 | 100 |
| 字数 | 262144 words |
| 字数代码 | 256000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 256KX18 |
| 输出特性 | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | QFP |
| 封装等效代码 | QFP100,.63X.87 |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | 225 |
| 电源 | 2.5,3.3 V |
| 认证状态 | Not Qualified |
| 最大待机电流 | 0.02 A |
| 最小待机电流 | 3.14 V |
| 最大压摆率 | 0.32 mA |
| 最大供电电压 (Vsup) | 3.465 V |
| 最小供电电压 (Vsup) | 3.135 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn85Pb15) |
| 端子形式 | GULL WING |
| 端子节距 | 0.635 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 71V2578S166PF | 71V2576S200PF | 71V2578S166BG | 71V2578S183PF | 71V2578S200BG | 71V2576S166PF | 71V2576S183PF | IDT71V2576S183BG | 71V2576S183BG | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | TQFP-100, Tray | TQFP-100, Tray | PBGA-119, Tray | TQFP-100, Tray | PBGA-119, Tray | TQFP-100, Tray | TQFP-100, Tray | Cache SRAM, 128KX36, 3.3ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, BGA-119 | PBGA-119, Tray |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | TQFP | TQFP | PBGA | TQFP | PBGA | TQFP | TQFP | BGA | PBGA |
| 包装说明 | PLASTIC, TQFP-100 | PLASTIC, TQFP-100 | BGA-119 | PLASTIC, TQFP-100 | BGA-119 | PLASTIC, TQFP-100 | PLASTIC, TQFP-100 | 14 X 22 MM, PLASTIC, BGA-119 | BGA-119 |
| 针数 | 100 | 100 | 119 | 100 | 119 | 100 | 100 | 119 | 119 |
| Reach Compliance Code | _compli | not_compliant | _compli | _compli | _compli | _compli | _compli | not_compliant | not_compliant |
| 最长访问时间 | 3.5 ns | 3.1 ns | 3.5 ns | 3.3 ns | 3.1 ns | 3.5 ns | 3.3 ns | 3.3 ns | 3.3 ns |
| 最大时钟频率 (fCLK) | 166 MHz | 200 MHz | 166 MHz | 183 MHz | 200 MHz | 166 MHz | 183 MHz | 183 MHz | 183 MHz |
| I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 代码 | R-PQFP-G100 | R-PQFP-G100 | S-PBGA-B119 | R-PQFP-G100 | S-PBGA-B119 | R-PQFP-G100 | R-PQFP-G100 | R-PBGA-B119 | S-PBGA-B119 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 内存密度 | 4718592 bi | 4718592 bit | 4718592 bi | 4718592 bi | 4718592 bi | 4718592 bi | 4718592 bi | 4718592 bit | 4718592 bit |
| 内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | CACHE SRAM | STANDARD SRAM |
| 内存宽度 | 18 | 36 | 18 | 18 | 18 | 36 | 36 | 36 | 36 |
| 湿度敏感等级 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 100 | 100 | 119 | 100 | 119 | 100 | 100 | 119 | 119 |
| 字数 | 262144 words | 131072 words | 262144 words | 262144 words | 262144 words | 131072 words | 131072 words | 131072 words | 131072 words |
| 字数代码 | 256000 | 128000 | 256000 | 256000 | 256000 | 128000 | 128000 | 128000 | 128000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 256KX18 | 128KX36 | 256KX18 | 256KX18 | 256KX18 | 128KX36 | 128KX36 | 128KX36 | 128KX36 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | QFP | QFP | BGA | QFP | BGA | QFP | QFP | BGA | BGA |
| 封装等效代码 | QFP100,.63X.87 | QFP100,.63X.87 | BGA119,7X17,50 | QFP100,.63X.87 | BGA119,7X17,50 | QFP100,.63X.87 | QFP100,.63X.87 | BGA119,7X17,50 | BGA119,7X17,50 |
| 封装形状 | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE |
| 封装形式 | FLATPACK | FLATPACK | GRID ARRAY | FLATPACK | GRID ARRAY | FLATPACK | FLATPACK | GRID ARRAY | GRID ARRAY |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度（摄氏度） | 225 | 225 | 225 | 225 | 225 | 225 | 225 | NOT SPECIFIED | 225 |
| 电源 | 2.5,3.3 V | 2.5,3.3 V | 2.5,3.3 V | 2.5,3.3 V | 2.5,3.3 V | 2.5,3.3 V | 2.5,3.3 V | 2.5,3.3 V | 2.5,3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最小待机电流 | 3.14 V | 3.14 V | 3.14 V | 3.14 V | 3.14 V | 3.14 V | 3.14 V | 3.14 V | 3.14 V |
| 最大供电电压 (Vsup) | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V |
| 最小供电电压 (Vsup) | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn63Pb37) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn63Pb37) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn63Pb37) | Tin/Lead (Sn63Pb37) |
| 端子形式 | GULL WING | GULL WING | BALL | GULL WING | BALL | GULL WING | GULL WING | BALL | BALL |
| 端子节距 | 0.635 mm | 0.635 mm | 1.27 mm | 0.635 mm | 1.27 mm | 0.635 mm | 0.635 mm | 1.27 mm | 1.27 mm |
| 端子位置 | QUAD | QUAD | BOTTOM | QUAD | BOTTOM | QUAD | QUAD | BOTTOM | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Brand Name | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | - | Integrated Device Technology |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | - | 含铅 |
| 厂商名称 | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | - | - |
| 制造商包装代码 | PK100 | PK100 | BG119 | PK100 | BG119 | PK100 | PK100 | - | BG119 |
| 其他特性 | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE | - | PIPELINED ARCHITECTURE |
| 最大待机电流 | 0.02 A | 0.02 A | 0.02 A | - | 0.02 A | 0.02 A | - | - | - |
| 最大压摆率 | 0.32 mA | 0.36 mA | 0.32 mA | - | 0.36 mA | 0.32 mA | - | - | - |
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