FCBGA-576, Tray
| 参数名称 | 属性值 |
| Brand Name | Integrated Device Technology |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | IDT (Integrated Device Technology) |
| 零件包装代码 | FCBGA |
| 包装说明 | BGA, |
| 针数 | 576 |
| 制造商包装代码 | RM576 |
| Reach Compliance Code | _compli |
| ECCN代码 | 3A991 |
| 最长访问时间 | 0.45 ns |
| JESD-30 代码 | S-PBGA-B576 |
| JESD-609代码 | e1 |
| 长度 | 25 mm |
| 内存密度 | 9437184 bi |
| 内存集成电路类型 | QDR SRAM |
| 内存宽度 | 18 |
| 湿度敏感等级 | 4 |
| 功能数量 | 1 |
| 端子数量 | 576 |
| 字数 | 524288 words |
| 字数代码 | 512000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 512KX18 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | BGA |
| 封装形状 | SQUARE |
| 封装形式 | GRID ARRAY |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | 245 |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.55 mm |
| 最大供电电压 (Vsup) | 1.9 V |
| 最小供电电压 (Vsup) | 1.7 V |
| 标称供电电压 (Vsup) | 1.8 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 | BALL |
| 端子节距 | 1 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 25 mm |
| 70P3337S233RM | 70P3337S250RM | 70P3307S233RM | 70P3307S233RMI | 70P3337S233RMI | 70P3337S200RMI | 70P3307S250RM | |
|---|---|---|---|---|---|---|---|
| 描述 | FCBGA-576, Tray | FCBGA-576, Tray | FCBGA-576, Tray | FCBGA-576, Tray | FCBGA-576, Tray | FCBGA-576, Tray | FCBGA-576, Tray |
| Brand Name | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
| 零件包装代码 | FCBGA | FCBGA | FCBGA | FCBGA | FCBGA | FCBGA | FCBGA |
| 针数 | 576 | 576 | 576 | 576 | 576 | 576 | 576 |
| 制造商包装代码 | RM576 | RM576 | RM576 | RM576 | RM576 | RM576 | RM576 |
| Reach Compliance Code | _compli | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| 包装说明 | BGA, | BGA, | BGA, | BGA, | BGA, | - | BGA, |
| ECCN代码 | 3A991 | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | - | 3A991.B.2.A |
| 最长访问时间 | 0.45 ns | 0.45 ns | - | 0.45 ns | 0.45 ns | - | 0.45 ns |
| JESD-30 代码 | S-PBGA-B576 | S-PBGA-B576 | - | S-PBGA-B576 | S-PBGA-B576 | - | S-PBGA-B576 |
| JESD-609代码 | e1 | e1 | - | e1 | e1 | e1 | e1 |
| 长度 | 25 mm | 25 mm | - | 25 mm | 25 mm | - | 25 mm |
| 内存密度 | 9437184 bi | 9437184 bit | - | 18874368 bit | 9437184 bit | - | 18874368 bit |
| 内存集成电路类型 | QDR SRAM | QDR SRAM | - | QDR SRAM | QDR SRAM | QDR SRAM | QDR SRAM |
| 内存宽度 | 18 | 18 | - | 18 | 18 | - | 18 |
| 湿度敏感等级 | 4 | 4 | - | 4 | 4 | 4 | 4 |
| 功能数量 | 1 | 1 | - | 1 | 1 | - | 1 |
| 端子数量 | 576 | 576 | - | 576 | 576 | - | 576 |
| 字数 | 524288 words | 524288 words | - | 1048576 words | 524288 words | - | 1048576 words |
| 字数代码 | 512000 | 512000 | - | 1000000 | 512000 | - | 1000000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | - | SYNCHRONOUS | SYNCHRONOUS | - | SYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | - | 85 °C | 85 °C | - | 70 °C |
| 组织 | 512KX18 | 512KX18 | - | 1MX18 | 512KX18 | - | 1MX18 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
| 封装代码 | BGA | BGA | - | BGA | BGA | - | BGA |
| 封装形状 | SQUARE | SQUARE | - | SQUARE | SQUARE | - | SQUARE |
| 封装形式 | GRID ARRAY | GRID ARRAY | - | GRID ARRAY | GRID ARRAY | - | GRID ARRAY |
| 并行/串行 | PARALLEL | PARALLEL | - | PARALLEL | PARALLEL | - | PARALLEL |
| 峰值回流温度（摄氏度） | 245 | 245 | - | 245 | 245 | 245 | 245 |
| 认证状态 | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | - | Not Qualified |
| 座面最大高度 | 2.55 mm | 2.55 mm | - | 2.55 mm | 2.55 mm | - | 2.55 mm |
| 最大供电电压 (Vsup) | 1.9 V | 1.9 V | - | 1.9 V | 1.9 V | - | 1.9 V |
| 最小供电电压 (Vsup) | 1.7 V | 1.7 V | - | 1.7 V | 1.7 V | - | 1.7 V |
| 标称供电电压 (Vsup) | 1.8 V | 1.8 V | - | 1.8 V | 1.8 V | - | 1.8 V |
| 表面贴装 | YES | YES | - | YES | YES | - | YES |
| 技术 | CMOS | CMOS | - | CMOS | CMOS | - | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | - | INDUSTRIAL | INDUSTRIAL | - | COMMERCIAL |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | - | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 | BALL | BALL | - | BALL | BALL | - | BALL |
| 端子节距 | 1 mm | 1 mm | - | 1 mm | 1 mm | - | 1 mm |
| 端子位置 | BOTTOM | BOTTOM | - | BOTTOM | BOTTOM | - | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 25 mm | 25 mm | - | 25 mm | 25 mm | - | 25 mm |
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