FCBGA-576, Tray
参数名称 | 属性值 |
Brand Name | Integrated Device Technology |
是否无铅 | 含铅 |
是否Rohs认证 | 符合 |
厂商名称 | IDT (Integrated Device Technology) |
零件包装代码 | FCBGA |
包装说明 | BGA, |
针数 | 576 |
制造商包装代码 | RM576 |
Reach Compliance Code | not_compliant |
ECCN代码 | 3A991.B.2.A |
最长访问时间 | 0.45 ns |
JESD-30 代码 | S-PBGA-B576 |
JESD-609代码 | e1 |
长度 | 25 mm |
内存密度 | 9437184 bit |
内存集成电路类型 | QDR SRAM |
内存宽度 | 18 |
湿度敏感等级 | 4 |
功能数量 | 1 |
端子数量 | 576 |
字数 | 524288 words |
字数代码 | 512000 |
工作模式 | SYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 512KX18 |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | BGA |
封装形状 | SQUARE |
封装形式 | GRID ARRAY |
并行/串行 | PARALLEL |
峰值回流温度(摄氏度) | 245 |
认证状态 | Not Qualified |
座面最大高度 | 2.55 mm |
最大供电电压 (Vsup) | 1.9 V |
最小供电电压 (Vsup) | 1.7 V |
标称供电电压 (Vsup) | 1.8 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) |
端子形式 | BALL |
端子节距 | 1 mm |
端子位置 | BOTTOM |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 25 mm |
Base Number Matches | 1 |
70P3337S250RM | 70P3307S233RM | 70P3307S233RMI | 70P3337S233RMI | 70P3337S200RMI | 70P3307S250RM | 70P3337S233RM | |
---|---|---|---|---|---|---|---|
描述 | FCBGA-576, Tray | FCBGA-576, Tray | FCBGA-576, Tray | FCBGA-576, Tray | FCBGA-576, Tray | FCBGA-576, Tray | FCBGA-576, Tray |
Brand Name | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology |
是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
厂商名称 | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
零件包装代码 | FCBGA | FCBGA | FCBGA | FCBGA | FCBGA | FCBGA | FCBGA |
针数 | 576 | 576 | 576 | 576 | 576 | 576 | 576 |
制造商包装代码 | RM576 | RM576 | RM576 | RM576 | RM576 | RM576 | RM576 |
Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | _compli |
包装说明 | BGA, | BGA, | BGA, | BGA, | - | BGA, | BGA, |
ECCN代码 | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | - | 3A991.B.2.A | 3A991 |
最长访问时间 | 0.45 ns | - | 0.45 ns | 0.45 ns | - | 0.45 ns | 0.45 ns |
JESD-30 代码 | S-PBGA-B576 | - | S-PBGA-B576 | S-PBGA-B576 | - | S-PBGA-B576 | S-PBGA-B576 |
JESD-609代码 | e1 | - | e1 | e1 | e1 | e1 | e1 |
长度 | 25 mm | - | 25 mm | 25 mm | - | 25 mm | 25 mm |
内存密度 | 9437184 bit | - | 18874368 bit | 9437184 bit | - | 18874368 bit | 9437184 bi |
内存集成电路类型 | QDR SRAM | - | QDR SRAM | QDR SRAM | QDR SRAM | QDR SRAM | QDR SRAM |
内存宽度 | 18 | - | 18 | 18 | - | 18 | 18 |
湿度敏感等级 | 4 | - | 4 | 4 | 4 | 4 | 4 |
功能数量 | 1 | - | 1 | 1 | - | 1 | 1 |
端子数量 | 576 | - | 576 | 576 | - | 576 | 576 |
字数 | 524288 words | - | 1048576 words | 524288 words | - | 1048576 words | 524288 words |
字数代码 | 512000 | - | 1000000 | 512000 | - | 1000000 | 512000 |
工作模式 | SYNCHRONOUS | - | SYNCHRONOUS | SYNCHRONOUS | - | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | 70 °C | - | 85 °C | 85 °C | - | 70 °C | 70 °C |
组织 | 512KX18 | - | 1MX18 | 512KX18 | - | 1MX18 | 512KX18 |
封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | BGA | - | BGA | BGA | - | BGA | BGA |
封装形状 | SQUARE | - | SQUARE | SQUARE | - | SQUARE | SQUARE |
封装形式 | GRID ARRAY | - | GRID ARRAY | GRID ARRAY | - | GRID ARRAY | GRID ARRAY |
并行/串行 | PARALLEL | - | PARALLEL | PARALLEL | - | PARALLEL | PARALLEL |
峰值回流温度(摄氏度) | 245 | - | 245 | 245 | 245 | 245 | 245 |
认证状态 | Not Qualified | - | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified |
座面最大高度 | 2.55 mm | - | 2.55 mm | 2.55 mm | - | 2.55 mm | 2.55 mm |
最大供电电压 (Vsup) | 1.9 V | - | 1.9 V | 1.9 V | - | 1.9 V | 1.9 V |
最小供电电压 (Vsup) | 1.7 V | - | 1.7 V | 1.7 V | - | 1.7 V | 1.7 V |
标称供电电压 (Vsup) | 1.8 V | - | 1.8 V | 1.8 V | - | 1.8 V | 1.8 V |
表面贴装 | YES | - | YES | YES | - | YES | YES |
技术 | CMOS | - | CMOS | CMOS | - | CMOS | CMOS |
温度等级 | COMMERCIAL | - | INDUSTRIAL | INDUSTRIAL | - | COMMERCIAL | COMMERCIAL |
端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) | - | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) |
端子形式 | BALL | - | BALL | BALL | - | BALL | BALL |
端子节距 | 1 mm | - | 1 mm | 1 mm | - | 1 mm | 1 mm |
端子位置 | BOTTOM | - | BOTTOM | BOTTOM | - | BOTTOM | BOTTOM |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 25 mm | - | 25 mm | 25 mm | - | 25 mm | 25 mm |
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