OT PLD, 6ns, PAL-Type, ECL100K, PQCC28
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Cypress(赛普拉斯) |
| Reach Compliance Code | _compli |
| 架构 | PAL-TYPE |
| JESD-30 代码 | S-PQCC-J28 |
| JESD-609代码 | e0 |
| 输入次数 | 16 |
| 输出次数 | 4 |
| 产品条款数 | 32 |
| 端子数量 | 28 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | |
| 输出函数 | COMBINATORIAL |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | QCCJ |
| 封装等效代码 | LDCC28,.5SQ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 电源 | -4.5 V |
| 可编程逻辑类型 | OT PLD |
| 传播延迟 | 6 ns |
| 认证状态 | Not Qualified |
| 表面贴装 | YES |
| 技术 | ECL100K |
| 温度等级 | OTHER |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | J BEND |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| CY100E302L-6JC | CY100E302-2.5DC | CY100E302-2.5LC | CY10E302-2.5DC | CY10E302-2.5LC | CY100E302-4LC | CY100E302L-6DC | CY100E302L-6PC | |
|---|---|---|---|---|---|---|---|---|
| 描述 | OT PLD, 6ns, PAL-Type, ECL100K, PQCC28 | OT PLD, 2.5ns, PAL-Type, ECL100K, CDIP24 | OT PLD, 2.5ns, PAL-Type, ECL100K, CQCC28 | OT PLD, 2.5ns, PAL-Type, ECL10K, CDIP24 | OT PLD, 2.5ns, PAL-Type, ECL10K, CQCC28 | OT PLD, 4ns, PAL-Type, ECL100K, CQCC28 | OT PLD, 6ns, PAL-Type, ECL100K, CDIP24 | OT PLD, 6ns, PAL-Type, ECL100K, PDIP24 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| Reach Compliance Code | _compli | compliant | compliant | compliant | compliant | not_compliant | not_compliant | not_compliant |
| 架构 | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE |
| JESD-30 代码 | S-PQCC-J28 | R-XDIP-T24 | S-XQCC-N28 | R-XDIP-T24 | S-XQCC-N28 | S-XQCC-N28 | R-XDIP-T24 | R-PDIP-T24 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 输入次数 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 输出次数 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| 产品条款数 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| 端子数量 | 28 | 24 | 28 | 24 | 28 | 28 | 24 | 24 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 70 °C | 70 °C | 85 °C | 85 °C | 85 °C |
| 输出函数 | COMBINATORIAL | COMBINATORIAL | COMBINATORIAL | COMBINATORIAL | COMBINATORIAL | COMBINATORIAL | COMBINATORIAL | COMBINATORIAL |
| 封装主体材料 | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY |
| 封装代码 | QCCJ | DIP | QCCN | DIP | QCCN | QCCN | DIP | DIP |
| 封装等效代码 | LDCC28,.5SQ | DIP24,.3 | LCC28,.45SQ | DIP24,.3 | LCC28,.45SQ | LCC28,.45SQ | DIP24,.3 | DIP24,.3 |
| 封装形状 | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER | IN-LINE | CHIP CARRIER | IN-LINE | CHIP CARRIER | CHIP CARRIER | IN-LINE | IN-LINE |
| 电源 | -4.5 V | -4.5 V | -4.5 V | -5.2 V | -5.2 V | -4.5 V | -4.5 V | -4.5 V |
| 可编程逻辑类型 | OT PLD | OT PLD | OT PLD | OT PLD | OT PLD | OT PLD | OT PLD | OT PLD |
| 传播延迟 | 6 ns | 2.5 ns | 2.5 ns | 2.5 ns | 2.5 ns | 4 ns | 6 ns | 6 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 表面贴装 | YES | NO | YES | NO | YES | YES | NO | NO |
| 技术 | ECL100K | ECL100K | ECL100K | ECL10K | ECL10K | ECL100K | ECL100K | ECL100K |
| 温度等级 | OTHER | OTHER | OTHER | COMMERCIAL | COMMERCIAL | OTHER | OTHER | OTHER |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | J BEND | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | NO LEAD | NO LEAD | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm |
| 端子位置 | QUAD | DUAL | QUAD | DUAL | QUAD | QUAD | DUAL | DUAL |
| 厂商名称 | Cypress(赛普拉斯) | - | - | Cypress(赛普拉斯) | Cypress(赛普拉斯) | Cypress(赛普拉斯) | Cypress(赛普拉斯) | Cypress(赛普拉斯) |
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