OT PLD, 6ns, PAL-Type, ECL100K, CDIP24
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Cypress(赛普拉斯) |
Reach Compliance Code | not_compliant |
架构 | PAL-TYPE |
JESD-30 代码 | R-XDIP-T24 |
JESD-609代码 | e0 |
输入次数 | 16 |
输出次数 | 4 |
产品条款数 | 32 |
端子数量 | 24 |
最高工作温度 | 85 °C |
最低工作温度 | |
输出函数 | COMBINATORIAL |
封装主体材料 | CERAMIC |
封装代码 | DIP |
封装等效代码 | DIP24,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
电源 | -4.5 V |
可编程逻辑类型 | OT PLD |
传播延迟 | 6 ns |
认证状态 | Not Qualified |
表面贴装 | NO |
技术 | ECL100K |
温度等级 | OTHER |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
CY100E302L-6DC | CY100E302-2.5DC | CY100E302-2.5LC | CY10E302-2.5DC | CY10E302-2.5LC | CY100E302-4LC | CY100E302L-6PC | CY100E302L-6JC | |
---|---|---|---|---|---|---|---|---|
描述 | OT PLD, 6ns, PAL-Type, ECL100K, CDIP24 | OT PLD, 2.5ns, PAL-Type, ECL100K, CDIP24 | OT PLD, 2.5ns, PAL-Type, ECL100K, CQCC28 | OT PLD, 2.5ns, PAL-Type, ECL10K, CDIP24 | OT PLD, 2.5ns, PAL-Type, ECL10K, CQCC28 | OT PLD, 4ns, PAL-Type, ECL100K, CQCC28 | OT PLD, 6ns, PAL-Type, ECL100K, PDIP24 | OT PLD, 6ns, PAL-Type, ECL100K, PQCC28 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
Reach Compliance Code | not_compliant | compliant | compliant | compliant | compliant | not_compliant | not_compliant | _compli |
架构 | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE |
JESD-30 代码 | R-XDIP-T24 | R-XDIP-T24 | S-XQCC-N28 | R-XDIP-T24 | S-XQCC-N28 | S-XQCC-N28 | R-PDIP-T24 | S-PQCC-J28 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
输入次数 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
输出次数 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
产品条款数 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
端子数量 | 24 | 24 | 28 | 24 | 28 | 28 | 24 | 28 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 70 °C | 70 °C | 85 °C | 85 °C | 85 °C |
输出函数 | COMBINATORIAL | COMBINATORIAL | COMBINATORIAL | COMBINATORIAL | COMBINATORIAL | COMBINATORIAL | COMBINATORIAL | COMBINATORIAL |
封装主体材料 | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | DIP | DIP | QCCN | DIP | QCCN | QCCN | DIP | QCCJ |
封装等效代码 | DIP24,.3 | DIP24,.3 | LCC28,.45SQ | DIP24,.3 | LCC28,.45SQ | LCC28,.45SQ | DIP24,.3 | LDCC28,.5SQ |
封装形状 | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | SQUARE |
封装形式 | IN-LINE | IN-LINE | CHIP CARRIER | IN-LINE | CHIP CARRIER | CHIP CARRIER | IN-LINE | CHIP CARRIER |
电源 | -4.5 V | -4.5 V | -4.5 V | -5.2 V | -5.2 V | -4.5 V | -4.5 V | -4.5 V |
可编程逻辑类型 | OT PLD | OT PLD | OT PLD | OT PLD | OT PLD | OT PLD | OT PLD | OT PLD |
传播延迟 | 6 ns | 2.5 ns | 2.5 ns | 2.5 ns | 2.5 ns | 4 ns | 6 ns | 6 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
表面贴装 | NO | NO | YES | NO | YES | YES | NO | YES |
技术 | ECL100K | ECL100K | ECL100K | ECL10K | ECL10K | ECL100K | ECL100K | ECL100K |
温度等级 | OTHER | OTHER | OTHER | COMMERCIAL | COMMERCIAL | OTHER | OTHER | OTHER |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | NO LEAD | NO LEAD | THROUGH-HOLE | J BEND |
端子节距 | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm |
端子位置 | DUAL | DUAL | QUAD | DUAL | QUAD | QUAD | DUAL | QUAD |
厂商名称 | Cypress(赛普拉斯) | - | - | Cypress(赛普拉斯) | Cypress(赛普拉斯) | Cypress(赛普拉斯) | Cypress(赛普拉斯) | Cypress(赛普拉斯) |
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