IC PLL FREQUENCY SYNTHESIZER, 4000 MHz, QCC20, 4 X 4 MM, MO-220VGGD-1, LFCSP-20, PLL or Frequency Synthesis Circuit
参数名称 | 属性值 |
Source Url Status Check Date | 2013-05-01 14:56:35.702 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
厂商名称 | ADI(亚德诺半导体) |
零件包装代码 | QFN |
包装说明 | 4 X 4 MM, MO-220VGGD-1, LFCSP-20 |
针数 | 20 |
Reach Compliance Code | unknow |
ECCN代码 | 5A991.B |
Samacsys Descripti | IC FRACTION-N FREQ SYNTH 20LFCSP |
模拟集成电路 - 其他类型 | PLL FREQUENCY SYNTHESIZER |
JESD-30 代码 | S-XQCC-N20 |
JESD-609代码 | e0 |
长度 | 4 mm |
湿度敏感等级 | 3 |
功能数量 | 1 |
端子数量 | 20 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | UNSPECIFIED |
封装代码 | HVQCCN |
封装等效代码 | LCC20,.16SQ,20 |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | 240 |
电源 | 3,3/5.5 V |
认证状态 | Not Qualified |
座面最大高度 | 1 mm |
最大供电电流 (Isup) | 24 mA |
最大供电电压 (Vsup) | 3.3 V |
最小供电电压 (Vsup) | 2.7 V |
标称供电电压 (Vsup) | 3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Tin/Lead (Sn85Pb15) |
端子形式 | NO LEAD |
端子节距 | 0.5 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | 30 |
宽度 | 4 mm |
ADF4154BCP | ADF4154BRUZ-RL | ADF4154BRU-REEL | ADF4154BCP-REEL | |
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描述 | IC PLL FREQUENCY SYNTHESIZER, 4000 MHz, QCC20, 4 X 4 MM, MO-220VGGD-1, LFCSP-20, PLL or Frequency Synthesis Circuit | Fractional-N Frequency Synthesizer | Fractional-N Frequency Synthesizer | IC PLL FREQUENCY SYNTHESIZER, 4000 MHz, QCC20, 4 X 4 MM, MO-220VGGD-1, LFCSP-20, PLL or Frequency Synthesis Circuit |
是否Rohs认证 | 不符合 | 符合 | 不符合 | 不符合 |
厂商名称 | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) |
零件包装代码 | QFN | TSSOP | TSSOP | QFN |
包装说明 | 4 X 4 MM, MO-220VGGD-1, LFCSP-20 | TSSOP, TSSOP16,.25 | MO-153AB, TSSOP-16 | 4 X 4 MM, MO-220VGGD-1, LFCSP-20 |
针数 | 20 | 16 | 16 | 20 |
Reach Compliance Code | unknow | compliant | _compli | unknow |
ECCN代码 | 5A991.B | 5A991.B | 5A991.B | 5A991.B |
模拟集成电路 - 其他类型 | PLL FREQUENCY SYNTHESIZER | PLL FREQUENCY SYNTHESIZER | PLL FREQUENCY SYNTHESIZER | PLL FREQUENCY SYNTHESIZER |
JESD-30 代码 | S-XQCC-N20 | R-PDSO-G16 | R-PDSO-G16 | S-XQCC-N20 |
JESD-609代码 | e0 | e3 | e0 | e0 |
长度 | 4 mm | 5 mm | 5 mm | 4 mm |
湿度敏感等级 | 3 | 1 | 1 | 3 |
功能数量 | 1 | 1 | 1 | 1 |
端子数量 | 20 | 16 | 16 | 20 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED |
封装代码 | HVQCCN | TSSOP | TSSOP | HVQCCN |
封装等效代码 | LCC20,.16SQ,20 | TSSOP16,.25 | TSSOP16,.25 | LCC20,.16SQ,20 |
封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | 240 | 260 | 240 | 240 |
电源 | 3,3/5.5 V | 3,3/5.5 V | 3,3/5.5 V | 3,3/5.5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1 mm | 1.2 mm | 1.2 mm | 1 mm |
最大供电电流 (Isup) | 24 mA | 24 mA | 24 mA | 24 mA |
最大供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
最小供电电压 (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
标称供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V |
表面贴装 | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | Tin/Lead (Sn85Pb15) | Matte Tin (Sn) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) |
端子形式 | NO LEAD | GULL WING | GULL WING | NO LEAD |
端子节距 | 0.5 mm | 0.65 mm | 0.65 mm | 0.5 mm |
端子位置 | QUAD | DUAL | DUAL | QUAD |
处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 |
宽度 | 4 mm | 4.4 mm | 4.4 mm | 4 mm |
是否无铅 | 含铅 | 含铅 | 含铅 | - |
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