255D
Vishay Sprague
Organic Polymer, Low ESR,
Molded Tantalum Surface Mount Capacitors
FEATURES
•
•
•
•
•
Conductive polymer cathode technology
Low ESR
No-ignition failure mode
EIA standard case sizes
100 % surge current tested Lead (Pb)-free
RoHS
COMPLIANT
PERFORMANCE CHARACTERISTICS
Operating Temperature:
- 55 °C to + 105 °C
Capacitance Range:
5.6 µF to 330 µF
Capacitance Tolerance:
± 20 % standard
Voltage Rating:
2.5 WVDC to 25 WVDC
ORDERING INFORMATION
255D
MODEL
227
CAPACITANCE
This is expressed
in picofarads. The
first two digits are
the significant
figures. The third
is the number of
zeros to follow.
X0
CAPACITANCE
TOLERANCE
X0 =
±
20 %
004
DC VOLTAGE RATING
AT + 85 °C
This is expressed in
volts. To complete
the three-digit block,
zeros precede the
voltage rating.
A decimal point is
indicated by an "R"
(6R3 = 6.3 volts).
D
CASE CODE
See Ratings
and Case
Codes Table.
2
TERMINATION
2 = 100 % Tin
-
REEL SIZE AND
PACKAGING
T = Tape and reel*
7" [178 mm] reel
W = 13" [330 mm] reel
*Cathode nearest
sprocket hole.
040
ESR VALUE
IN mΩ
Note: Preferred Tolerance and reel sizes are in bold.
Last three characters designate ESR max. Limit in milliohms
DIMENSIONS
in inches [millimeters]
L
TW
H
TH Min.
W
P
CASE
B
D
V
EIA
3528
734331
734319
L
0.138 ± 0.008
[3.5 ± 0.2]
0.287 ± 0.012
[7.3 ± 0.3]
0.287 ± 0.012
[7.3 ± 0.3]
W
0.110 ± 0.008
[2.8 ± 0.2]
0.170 ± 0.008
[4.3 ± 0.2]
0.170 ± 0.012
[4.3 ± 0.3]
H
0.075 ± 0.008
[1.9 ± 0.2]
0.110 ± 0.012
[2.8 ± 0.3]
0.076
[1.9 max]
P
0.031 ± 0.012
[0.8 ± 0.3]
0.051 ± 0.012
[1.3 ± 0.3]
0.051 ± 0.012
[1.3 ± 0.3]
Tw
0.087 ± 0.004
[2.2 ± 0.1]
0.095 ± 0.004
[2.4 ± 0.1]
0.095 ± 0.004
[2.4 ± 0.1]
TH (Min.)
0.028
[0.7]
0.039
[1.0]
0.039
[1.0]
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For technical questions, contact: tantalum@vishay.com
Document Number: 40052
Revision: 08-Feb-06
255D
Organic Polymer, Low ESR,
Molded Tantalum Surface Mount Capacitors
Vishay Sprague
RATINGS AND CASE CODES
µF
5.6*
15
22
33
100
150
220
330
*Preliminary values, contact factory for availability.
2.5 V
4V
6.3 V
8V
10 V
16 V
20 V
25 V
B*
V
V
V
B, V
V
V
B*/V
D, V
D, V
V
D*
V
D
STANDARD RATINGS
CAPACITANCE
(µF)
CASE CODE
PART NUMBER
MAX. DCL
AT + 25 °C
(µA)
MAX. DF
AT + 25 °C
(%)
MAX. ESR
AT 100 kHz
(mΩ)
MAX. RIPPLE
100 kHz
Irms
(Amps)
2.2
2.2
1.1*
1.9
2.2*
2.0
2.0
1.9
2.2
1.8
0.92
1.10
1.9*
1.7
2.0
2.2
1.8
2.2
1.9*
1.8
1.51
1.7
1.4
1.18
1.26
0.92*
1.18
150
220
150*
150
150*
220
220
220
220
220
100
100
100*
150
150
150
150
220
330*
150
100
100
33
22
22
5.6*
15
2.5 WVDC AT + 85 °C, 1.7 WVDC AT + 105 °C, SURGE = 3.3 V AT + 85 °C, 2.0 V AT + 105 °C
V
255D157X02R5V2T025
37
8
25
V
255D227X02R5V2T025
55
8
25
4 WVDC AT + 85 °C, 3.3 WVDC AT + 105 °C, SURGE = 5.2 V AT + 85 °C, 4.3 V AT + 105 °C
B*
255D157X0004B2T070*
60*
8*
70*
V
255D157X0004V2T040
60
8
40
V*
255D157X0004V2T025*
60*
8*
25*
D
255D227X0004D2T055
88
8
55
D
255D227X0004D2T045
88
8
45
D
255D227X0004D2T040
88
8
40
V
255D227X0004V2T025
88
8
25
V
255D227X0004V2T040
88
8
40
6.3 WVDC AT + 85 °C, 5 WVDC AT + 105 °C, SURGE = 8 V AT + 85 °C, 6.5 V AT + 105 °C
B
255D107X06R3B2T100
63
8
100
B
255D107X06R3B2T070
63
8
70
V*
255D107X06R3V2T035*
63*
8*
35*
D
255D157X06R3D2T055
95
8
55
D
255D157X06R3D2T045
95
8
45
V
255D157X06R3V2T025
95
8
25
V
255D157X06R3V2T040
95
8
40
V
255D227X06R3V2T025
139
12
25
D*
255D337X06R3D2T040*
208*
12*
40*
8 WVDC AT + 85 °C, 6 WVDC AT + 105 °C, SURGE = 10 V AT + 85 °C, 6 V AT + 105 °C
V
255D157X0008V2T040
120
8
40
10 WVDC AT + 85 °C, 8 WVDC AT + 105 °C, SURGE = 13 V AT + 85 °C, 11 V AT + 105 °C
D
255D107X0010D2T065
100
8
65
D
255D107X0010D2T050
100
8
50
16 WVDC AT + 85 °C, 13 WVDC AT + 105 °C, SURGE = 19 V AT + 85 °C, 17 V AT + 105 °C
V
255D336X0016V2T070*
53.8
8
70
20 WVDC AT + 85 °C, 16 WVDC AT + 105 °C, SURGE = 26 V AT + 85 °C, 21 V AT + 105 °C
V
255D226X0020V2T090
44
8
90
V
255D226X0020V2T080
44
8
80
25 WVDC AT + 85 °C, 20 WVDC AT + 105 °C, SURGE = 32 V AT + 85 °C, 27 V AT + 105 °C
B*
255D565X0025B2T100*
14*
8*
100*
V
255D156X0025V2T090
38
10
90
*Preliminary values, contact factory for availability.
Document Number: 40052
Revision: 08-Feb-06
For technical questions, contact: tantalum@vishay.com
www.vishay.com
2
255D
Vishay Sprague
Organic Polymer, Low ESR,
Molded Tantalum Surface Mount Capacitors
PERFORMANCE CHARACTERISTICS
1.
Operating Temperature:
Capacitors are designed
to operate over the temperature range of - 55 °C to
+ 105 °C.
Capacitors may be operated to + 105 °C with voltage
derating to 0.8 times the + 85 °C rating.
+ 85 °C Rating
WORKING
VOLTAGE
(V)
2.5
4.0
6.3
10
16
25
SURGE
VOLTAGE
(V)
3.3
5.2
8.0
13
19
32
+ 105 °C Rating
WORKING
VOLTAGE
(V)
1.7
3.3
5.0
8.0
12.8
20
SURGE
VOLTAGE
(V)
2.0
4.3
6.5
10.4
19
26
6.
Dissipation Factor:
The dissipation factor,
determined from the expression 2πfRC, shall not
exceed values listed in the Standard Ratings Table.
Measurements shall be made by the bridge method
at, or referred to, a frequency of 120 Hz and a
temperature of + 25 °C.
Leakage Current:
Capacitors shall be stabilized at
the rated temperature for 30 minutes. Rated voltage
shall be applied to capacitors for 5 minutes using a
steady source of power (such as a regulated power
supply) with 1000 ohm resistor connected in series
with the capacitor under test to limit the charging
current. Leakage current shall then be measured
.
At + 25 °C,
the leakage current shall not exceed the
value listed in the Standard Ratings Table.
At + 85 °C,
the leakage current shall not exceed 10
times the value listed in the Standard Ratings Table.
At + 105 °C,
the leakage current shall not exceed 10
times the value listed in the Standard Ratings Table
.
ESR
ESR (Equivalent Series Resistance)
shall not
exceed the values listed in the Ratings Table.
Measurement shall be made by the bridge method at
a frequency of 100 kHz and a temperature of + 25 °C.
Life Test:
Capacitors shall withstand rated DC
voltage applied at + 85 °C for 1000 hours.
Following the life test, the dissipation factor shall not
exceed 1.5 times the initial requirement; the
capacitance change shall not exceed ± 20 %; the
leakage current shall not exceed 0.1 CV (3 µA).
Solderability:
Capacitors will meet the solderability
requirements of (MIL-STD-202, method 208),
ANSI/J-STD-002, Test B, Category 3.
Resistance to Solder Heat:
Capacitors will with
stand reflow soldering at + 240 °C + 5 °C for
10 seconds max. Capacitors should be allowed to
remain at ambient conditions for a period of up to
24 hours prior to electrical measurements.
Following the resistance to solder heat test,
capacitance, be within ± 20 % of the initial value, the
dissipation factor and the DC leakage current shall
not exceed the initial value.
Terminal Strength:
Per UEC-384-3, minimum of 3N
shear force.
Flammability:
Encapsulant materials meet UL94 V0
with an oxygen index of 32 %.
1.1
6.1
7.
7.1
7.2
7.3
8.
8.1
2.
DC Working Voltage:
The DC working voltage is the
maximum operating voltage for continuous duty at the
rated temperature.
Surge Voltage:
The surge DC rating is the maximum
voltage to which the capacitors may be subjected
under any conditions, including transients and peak
ripple at the highest line voltage.
Surge Voltage Test:
Capacitors shall withstand the
surge voltage applied in series with a 33 ohm ± 5 %
resistor at the rate of one-half minute on, one-half
minute off, at + 85 °C, for 1000 successive test
cycles.
Following the surge voltage test, the dissipation factor
shall meet the initial requirements; the capacitance
shall not have changed more than ± 20 %. The
leakage current shall not exceed 150 % of the value.
Capacitance Tolerance:
The capacitance of all
capacitors shall be within the specified tolerance
limits of the normal rating.
Capacitance measurements shall be made by means
of polarized capacitance bridge. The polarizing
voltage shall be of such magnitude that there shall be
no reversal of polarity due to the AC component. The
maximum voltage applied to capacitors during
measurement shall be 2 volts rms at 120 Hz at + 25 °C.
If the AC voltage applied is less than one-half volt
rms, no DC bias is required. Accuracy of the bridge
shall be within ± 2 %.
Capacitance Change With Temperature:
The
capacitance change with temperature shall not
exceed the following percentage of the capacitance
measured at + 25 °C:
- 55 °C
± 20 %
+ 85 °C
± 20 %
+ 105 °C
± 30 %
3
3.1
9.
9.1
3.2
4.
10.
4.1
11.
11.1
5.
12.
13.
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For technical questions, contact: tantalum@vishay.com
Document Number: 40052
Revision: 08-Feb-06
255D
Organic Polymer, Low ESR,
Molded Tantalum Surface Mount Capacitors
PERFORMANCE CHARACTERISTICS
(Continued)
14.
Humidity Test:
Capacitors shall withstand 500 hours
at + 60 °C, 90 % to 95 % relative humidity, with no
voltage applied.
Following the humidity test, capacitance change shall
not exceed - 20 % to + 40 % of the initial value,
dissipation factor shall not exceed 150 % of the initial
requirement; leakage current shall not exceed 0.1 CV
(9 µA).
2.4
TEMPERATURE
+ 25 °C
+ 85 °C
+ 105 °C
DERATING FACTOR
1.0
0.9
0.4
Vishay Sprague
14.1
GUIDE TO APPLICATION
1.
A-C Ripple Current:
The maximum allowable ripple
current shall be determined from the formula:
Power Dissipation:
Power dissipation will be
affected by the heat sinking capability of the mounting
surface. Non-sinusoidal ripple current may produce
heating effects which differ from those shown. It is
important that the equivalent I
rms
value be established
when calculating permissible operating levels. (Power
Dissipation calculated using + 25
°C
temperature rise.
MAXIMUM PERMISSIBLE
POWER DISSIPATION
AT + 25 °C (WATTS) IN FREE AIR
0.085
0.150
0.125
CASE CODE
I
rms
=
where,
P=
P
---------------
-
R
ESR
B
D
V
R
ESR
=
2.
Power Dissipation in Watts at + 25 °C as
given in the table in Paragraph Number 2.4
(Power Dissipation)
The capacitor Equivalent Series
Resistance at the specified frequency.
3.
A-C Ripple Voltage:
The maximum allowable ripple
voltage shall be determined from the formula:
P
V
rms
=
Z ---------------
-
R
ESR
or, from the formula:
V
rms
=
I
rms
×
Z
where,
P=
Power Dissipation in Watts at + 25 °C as
given in the table in Paragraph Number 2.4
(Power Dissipation).
The capacitor Equivalent Series
Resistance at the specified frequency.
The capacitor impedance at the specified
frequency.
Reverse Voltage:
These capacitors are capable of
withstanding peak voltages in the reverse direction
equal to 10 % of the DC rating at + 25 °C, 5 % of the
DC rating at + 85 °C and 1 % of the DC rating at
+ 105 °C.
Recommended rated working voltage guidelines:
APPLICATION
VOLTAGE
(V)
2.0
3.2
5.0
8.0
12.8
20
RECOMMENDED CAPACITOR
VOLTAGE RATING
(V)
2.5
4.0
6.3
10
16
25
4.
R
ESR
=
Z=
2.1
5.
The sum of the peak AC voltage plus the applied DC
voltage shall not exceed the DC voltage rating of the
capacitor.
The sum of the negative peak AC voltage plus the
applied DC voltage shall not allow a voltage reversal
exceeding 10 % of the DC working voltage at + 25 °C.
Temperature Derating:
If these capacitors are to be
operated at temperatures above + 25 °C, the
permissible rms ripple current or voltage shall be
calculated using the derating factors as shown:
Printed Circuit Board Materials:
Type 255D is
compatible with commonly used printed circuit board
materials (alumina substrates, FR4, FR5, G10,
PTFE-fluorocarbon and porcelanized steel).
Attachment:
Solder Paste:
The recommended thickness of the
solder paste after application is 0.007" ± 0.001"
[0.178 mm ± 0.025 mm]. Care should be exercised in
selecting the solder paste. The metal purity should be
as high as practical. The flux (in the paste) must be
active enough to remove the oxides formed on the
metallization prior to the exposure to soldering heat.
In practice this can be aided by extending the solder
preheat time at temperatures below the liquidous
state of the solder.
6.
6.1
2.2
2.3
Document Number: 40052
Revision: 08-Feb-06
For technical questions, contact: tantalum@vishay.com
www.vishay.com
4
255D
Vishay Sprague
Organic Polymer, Low ESR,
Molded Tantalum Surface Mount Capacitors
GUIDE TO APPLICATION
(Continued)
6.2
Soldering:
Capacitors can be attached by
conventional soldering techniques - vapor phase,
infrared reflow, wave soldering and hot plate
methods. The Soldering Profile charts show
recommended time/temperature conditions for
soldering. Attachment with a soldering iron is not
recommended due to the difficulty of controlling
temperature and time at temperature. If hand
soldering is necesary, the soldering iron must never
come in contact with the capacitor.
minimize component rework due to unacceptable
solder joints. The dimensional configurations shown
are the recommended pad geometries for both wave
and reflow soldering techniques. These dimensions
are intended to be a starting point for circuit board
designers and may be fine tuned if necessary based
upon the peculiarities of the soldering process and/or
circuit board design.
6.2.1 When necessary to solder with a soldering iron do not
exceed these following guidelines:
1. Tip of Soldering Iron: 350 °C max.
2. Power of Soldering Iron: 30 W max.
3. Working Time: 3 seconds max.
REFLOW SOLDER PADS*
in inches [millimeters]
D
B
C
E
RECOMMENDED REFLOW SOLDERING
A
Recommended SnPb Reflow Soldering Profile: Twice (max.)
TEMPERATURE DEG. CENTIGRADE
225 °C
183 °C
160 °C
10 sec
60 sec
130 °C
60 - 90 sec
Preheat
CASE
CODE
B
D
V
WIDTH
(A)
0.061 [1.54]
0.018 [3.0]
0.018 [3.0]
PAD
METALLIZATION
(B)
0.085 [2.15]
0.106 [2.70]
0.106 [2.70]
SEPARATION
(C)
0.065 [1.65]
0.175 [4.45]
0.175 [4.45]
25 °C
TIME (SECONDS)
9.
All Case Codes
Recommended Pb Free Reflow Soldering Profile: Twice (max.)
TEMPERATURE DEG. CENTIGRADE
250 °C
217 °C
200 °C
10 sec
60 sec
130 °C
60 - 150 sec
Preheat
a t
P re h e
Cleaning (Flux Removal) After Soldering:
The
255D is compatible with all commonly used solvents
such as TES, TMS, Prelete, Chlorethane, Terpene
and aqueous cleaning media. However, CFC/ODS
products are not used in the production of these
devices and are not recommended. Solvents
containing methylene chloride or other epoxy
solvents should be avoided since these will attack the
epoxy encapsulation material.
When using ultrasonic cleaning, the board may
resonate if the output power is too high. This vibration
can cause cracking or a decrease in the adherence-of
the termination. DO NOT EXCEED 9 W/L at 40 kHz
for 2 minutes.
Leakage Current:
Slight increases in DC leakage
may be observed occassionally following normal
reflow solderind conditions, unbiased high-temp
storage, elevated levels of humidity exposure, and
temperature cycling. In such instances, the leakage
will typically decrease when voltage is applied to the
device.
9.1
25 °C
TIME (SECONDS)
All Case Codes
10.
8.
Recommended Mounting Pad Geometries: Proper
mounting pad geometries are essential for successful
solder connections. These dimensions are highly
process sensitive and should be designed to
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For technical questions, contact: tantalum@vishay.com
Document Number: 40052
Revision: 08-Feb-06
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