DDR DRAM Module, 512MX72, 0.3ns, CMOS, HALOGEN FREE AND ROHS COMPLIANT, DIMM-240
参数名称 | 属性值 |
厂商名称 | SAMSUNG(三星) |
零件包装代码 | DIMM |
包装说明 | DIMM, |
针数 | 240 |
Reach Compliance Code | unknow |
ECCN代码 | EAR99 |
访问模式 | DUAL BANK PAGE BURST |
最长访问时间 | 0.3 ns |
其他特性 | AUTO/SELF REFRESH |
JESD-30 代码 | R-XDMA-N240 |
长度 | 133.35 mm |
内存密度 | 38654705664 bi |
内存集成电路类型 | DDR DRAM MODULE |
内存宽度 | 72 |
功能数量 | 1 |
端口数量 | 1 |
端子数量 | 240 |
字数 | 536870912 words |
字数代码 | 512000000 |
工作模式 | SYNCHRONOUS |
最高工作温度 | 95 °C |
最低工作温度 | |
组织 | 512MX72 |
封装主体材料 | UNSPECIFIED |
封装代码 | DIMM |
封装形状 | RECTANGULAR |
封装形式 | MICROELECTRONIC ASSEMBLY |
认证状态 | Not Qualified |
座面最大高度 | 30.15 mm |
自我刷新 | YES |
最大供电电压 (Vsup) | 1.45 V |
最小供电电压 (Vsup) | 1.2825 V |
标称供电电压 (Vsup) | 1.35 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | OTHER |
端子形式 | NO LEAD |
端子节距 | 1 mm |
端子位置 | DUAL |
M393B5170FH0-YF8 | M393B5170FH0-YH9 | M393B5673FH0-YF8 | M393B5670FH0-YF8 | M393B5173FH0-YH9 | M393B5173FH0-YF8 | M393B2873FH0-YH9 | M393B5670FH0-YH9 | M393B5673FH0-YH9 | |
---|---|---|---|---|---|---|---|---|---|
描述 | DDR DRAM Module, 512MX72, 0.3ns, CMOS, HALOGEN FREE AND ROHS COMPLIANT, DIMM-240 | DDR DRAM Module, 512MX72, 0.255ns, CMOS, HALOGEN FREE AND ROHS COMPLIANT, DIMM-240 | DDR DRAM Module, 256MX72, 0.3ns, CMOS, HALOGEN FREE AND ROHS COMPLIANT, DIMM-240 | DDR DRAM Module, 256MX72, 0.3ns, CMOS, HALOGEN FREE AND ROHS COMPLIANT, DIMM-240 | DDR DRAM Module, 512MX72, 0.255ns, CMOS, HALOGEN FREE AND ROHS COMPLIANT, DIMM-240 | DDR DRAM Module, 512MX72, 0.3ns, CMOS, HALOGEN FREE AND ROHS COMPLIANT, DIMM-240 | DDR DRAM Module, 128MX72, 0.255ns, CMOS, HALOGEN FREE AND ROHS COMPLIANT, DIMM-240 | DDR DRAM Module, 256MX72, 0.255ns, CMOS, HALOGEN FREE AND ROHS COMPLIANT, DIMM-240 | DDR DRAM Module, 256MX72, 0.255ns, CMOS, HALOGEN FREE AND ROHS COMPLIANT, DIMM-240 |
零件包装代码 | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM |
包装说明 | DIMM, | DIMM, | DIMM, | DIMM, | DIMM, | DIMM, | DIMM, | DIMM, | DIMM, |
针数 | 240 | 240 | 240 | 240 | 240 | 240 | 240 | 240 | 240 |
Reach Compliance Code | unknow | unknown | unknown | unknown | unknown | unknown | unknow | unknow | unknow |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
访问模式 | DUAL BANK PAGE BURST | DUAL BANK PAGE BURST | DUAL BANK PAGE BURST | SINGLE BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | SINGLE BANK PAGE BURST | SINGLE BANK PAGE BURST | DUAL BANK PAGE BURST |
最长访问时间 | 0.3 ns | 0.255 ns | 0.3 ns | 0.3 ns | 0.255 ns | 0.3 ns | 0.255 ns | 0.255 ns | 0.255 ns |
其他特性 | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH |
JESD-30 代码 | R-XDMA-N240 | R-XDMA-N240 | R-XDMA-N240 | R-XDMA-N240 | R-XDMA-N240 | R-XDMA-N240 | R-XDMA-N240 | R-XDMA-N240 | R-XDMA-N240 |
长度 | 133.35 mm | 133.35 mm | 133.35 mm | 133.35 mm | 133.35 mm | 133.35 mm | 133.35 mm | 133.35 mm | 133.35 mm |
内存密度 | 38654705664 bi | 38654705664 bit | 19327352832 bit | 19327352832 bit | 38654705664 bit | 38654705664 bit | 9663676416 bi | 19327352832 bi | 19327352832 bi |
内存集成电路类型 | DDR DRAM MODULE | DDR DRAM MODULE | DDR DRAM MODULE | DDR DRAM MODULE | DDR DRAM MODULE | DDR DRAM MODULE | DDR DRAM MODULE | DDR DRAM MODULE | DDR DRAM MODULE |
内存宽度 | 72 | 72 | 72 | 72 | 72 | 72 | 72 | 72 | 72 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端口数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 240 | 240 | 240 | 240 | 240 | 240 | 240 | 240 | 240 |
字数 | 536870912 words | 536870912 words | 268435456 words | 268435456 words | 536870912 words | 536870912 words | 134217728 words | 268435456 words | 268435456 words |
字数代码 | 512000000 | 512000000 | 256000000 | 256000000 | 512000000 | 512000000 | 128000000 | 256000000 | 256000000 |
工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | 95 °C | 95 °C | 95 °C | 95 °C | 95 °C | 95 °C | 95 °C | 95 °C | 95 °C |
组织 | 512MX72 | 512MX72 | 256MX72 | 256MX72 | 512MX72 | 512MX72 | 128MX72 | 256MX72 | 256MX72 |
封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
封装代码 | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 30.15 mm | 30.15 mm | 30.15 mm | 30.15 mm | 30.15 mm | 30.15 mm | 30.15 mm | 30.15 mm | 30.15 mm |
自我刷新 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
最大供电电压 (Vsup) | 1.45 V | 1.45 V | 1.45 V | 1.45 V | 1.45 V | 1.45 V | 1.45 V | 1.45 V | 1.45 V |
最小供电电压 (Vsup) | 1.2825 V | 1.2825 V | 1.2825 V | 1.2825 V | 1.2825 V | 1.2825 V | 1.2825 V | 1.2825 V | 1.2825 V |
标称供电电压 (Vsup) | 1.35 V | 1.35 V | 1.35 V | 1.35 V | 1.35 V | 1.35 V | 1.35 V | 1.35 V | 1.35 V |
表面贴装 | NO | NO | NO | NO | NO | NO | NO | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | OTHER | OTHER | OTHER | OTHER | OTHER | OTHER | OTHER | OTHER | OTHER |
端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
端子节距 | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
厂商名称 | SAMSUNG(三星) | SAMSUNG(三星) | - | - | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) |
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