MASK ROM, 128KX8, 150ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28
参数名称 | 属性值 |
厂商名称 | Hualon Microelectronics Corp |
零件包装代码 | DIP |
包装说明 | DIP, |
针数 | 28 |
Reach Compliance Code | unknow |
ECCN代码 | EAR99 |
最长访问时间 | 150 ns |
JESD-30 代码 | R-PDIP-T28 |
长度 | 36.703 mm |
内存密度 | 1048576 bi |
内存集成电路类型 | MASK ROM |
内存宽度 | 8 |
功能数量 | 1 |
端子数量 | 28 |
字数 | 131072 words |
字数代码 | 128000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 128KX8 |
输出特性 | 3-STATE |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | DIP |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
并行/串行 | PARALLEL |
认证状态 | Not Qualified |
座面最大高度 | 6.35 mm |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
宽度 | 15.24 mm |
HM23C1000P-15 | HM23C1000AM-15 | HM23C1000AM-20 | HM23C1000AP-15 | HM23C1000AP-20 | HM23C1000M-15 | HM23C1000M-20 | HM23C1000P-20 | |
---|---|---|---|---|---|---|---|---|
描述 | MASK ROM, 128KX8, 150ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | MASK ROM, 128KX8, 150ns, CMOS, PDSO28, 0.300 INCH, PLASTIC, SOP-28 | MASK ROM, 128KX8, 200ns, CMOS, PDSO28, 0.300 INCH, PLASTIC, SOP-28 | MASK ROM, 128KX8, 150ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | MASK ROM, 128KX8, 200ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | MASK ROM, 128KX8, 150ns, CMOS, PDSO28, 0.300 INCH, PLASTIC, SOP-28 | MASK ROM, 128KX8, 200ns, CMOS, PDSO28, 0.300 INCH, PLASTIC, SOP-28 | MASK ROM, 128KX8, 200ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 |
厂商名称 | Hualon Microelectronics Corp | Hualon Microelectronics Corp | Hualon Microelectronics Corp | Hualon Microelectronics Corp | Hualon Microelectronics Corp | Hualon Microelectronics Corp | Hualon Microelectronics Corp | Hualon Microelectronics Corp |
零件包装代码 | DIP | SOIC | SOIC | DIP | DIP | SOIC | SOIC | DIP |
包装说明 | DIP, | SOP, | SOP, | DIP, | DIP, | SOP, | SOP, | DIP, |
针数 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
Reach Compliance Code | unknow | unknow | unknow | unknow | unknow | unknow | unknow | unknow |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
最长访问时间 | 150 ns | 150 ns | 200 ns | 150 ns | 200 ns | 150 ns | 200 ns | 200 ns |
JESD-30 代码 | R-PDIP-T28 | R-PDSO-G28 | R-PDSO-G28 | R-PDIP-T28 | R-PDIP-T28 | R-PDSO-G28 | R-PDSO-G28 | R-PDIP-T28 |
长度 | 36.703 mm | 17.9 mm | 17.9 mm | 36.703 mm | 36.703 mm | 17.9 mm | 17.9 mm | 36.703 mm |
内存密度 | 1048576 bi | 1048576 bi | 1048576 bi | 1048576 bi | 1048576 bi | 1048576 bi | 1048576 bi | 1048576 bi |
内存集成电路类型 | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM |
内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
字数 | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words |
字数代码 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | DIP | SOP | SOP | DIP | DIP | SOP | SOP | DIP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 6.35 mm | 2.65 mm | 2.65 mm | 6.35 mm | 6.35 mm | 2.65 mm | 2.65 mm | 6.35 mm |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | YES | YES | NO | NO | YES | YES | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子形式 | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE |
端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
宽度 | 15.24 mm | 7.5 mm | 7.5 mm | 15.24 mm | 15.24 mm | 7.5 mm | 7.5 mm | 15.24 mm |
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