MASK ROM, 128KX8, 200ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28
| 参数名称 | 属性值 |
| 厂商名称 | Hualon Microelectronics Corp |
| 零件包装代码 | DIP |
| 包装说明 | DIP, |
| 针数 | 28 |
| Reach Compliance Code | unknow |
| ECCN代码 | EAR99 |
| 最长访问时间 | 200 ns |
| 其他特性 | AUTOMATIC POWER-DOWN |
| JESD-30 代码 | R-PDIP-T28 |
| 长度 | 36.703 mm |
| 内存密度 | 1048576 bi |
| 内存集成电路类型 | MASK ROM |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 28 |
| 字数 | 131072 words |
| 字数代码 | 128000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 128KX8 |
| 输出特性 | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 并行/串行 | PARALLEL |
| 认证状态 | Not Qualified |
| 座面最大高度 | 6.35 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 宽度 | 15.24 mm |
| HM23C1000AP-20 | HM23C1000AM-15 | HM23C1000AM-20 | HM23C1000AP-15 | HM23C1000M-15 | HM23C1000M-20 | HM23C1000P-15 | HM23C1000P-20 | |
|---|---|---|---|---|---|---|---|---|
| 描述 | MASK ROM, 128KX8, 200ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | MASK ROM, 128KX8, 150ns, CMOS, PDSO28, 0.300 INCH, PLASTIC, SOP-28 | MASK ROM, 128KX8, 200ns, CMOS, PDSO28, 0.300 INCH, PLASTIC, SOP-28 | MASK ROM, 128KX8, 150ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | MASK ROM, 128KX8, 150ns, CMOS, PDSO28, 0.300 INCH, PLASTIC, SOP-28 | MASK ROM, 128KX8, 200ns, CMOS, PDSO28, 0.300 INCH, PLASTIC, SOP-28 | MASK ROM, 128KX8, 150ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | MASK ROM, 128KX8, 200ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 |
| 厂商名称 | Hualon Microelectronics Corp | Hualon Microelectronics Corp | Hualon Microelectronics Corp | Hualon Microelectronics Corp | Hualon Microelectronics Corp | Hualon Microelectronics Corp | Hualon Microelectronics Corp | Hualon Microelectronics Corp |
| 零件包装代码 | DIP | SOIC | SOIC | DIP | SOIC | SOIC | DIP | DIP |
| 包装说明 | DIP, | SOP, | SOP, | DIP, | SOP, | SOP, | DIP, | DIP, |
| 针数 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
| Reach Compliance Code | unknow | unknow | unknow | unknow | unknow | unknow | unknow | unknow |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 200 ns | 150 ns | 200 ns | 150 ns | 150 ns | 200 ns | 150 ns | 200 ns |
| JESD-30 代码 | R-PDIP-T28 | R-PDSO-G28 | R-PDSO-G28 | R-PDIP-T28 | R-PDSO-G28 | R-PDSO-G28 | R-PDIP-T28 | R-PDIP-T28 |
| 长度 | 36.703 mm | 17.9 mm | 17.9 mm | 36.703 mm | 17.9 mm | 17.9 mm | 36.703 mm | 36.703 mm |
| 内存密度 | 1048576 bi | 1048576 bi | 1048576 bi | 1048576 bi | 1048576 bi | 1048576 bi | 1048576 bi | 1048576 bi |
| 内存集成电路类型 | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
| 字数 | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words |
| 字数代码 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | SOP | SOP | DIP | SOP | SOP | DIP | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | IN-LINE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 6.35 mm | 2.65 mm | 2.65 mm | 6.35 mm | 2.65 mm | 2.65 mm | 6.35 mm | 6.35 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | YES | NO | YES | YES | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 15.24 mm | 7.5 mm | 7.5 mm | 15.24 mm | 7.5 mm | 7.5 mm | 15.24 mm | 15.24 mm |
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