D Latch, 1-Func, 8-Bit, CMOS, CDIP20
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | SGS-Ates Componenti Electronici SPA |
| 包装说明 | DIP, DIP20,.3 |
| Reach Compliance Code | unknow |
| JESD-30 代码 | R-XDIP-T20 |
| JESD-609代码 | e0 |
| 逻辑集成电路类型 | D LATCH |
| 位数 | 8 |
| 功能数量 | 1 |
| 端子数量 | 20 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE |
| 封装主体材料 | CERAMIC |
| 封装代码 | DIP |
| 封装等效代码 | DIP20,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | 2/6 V |
| 认证状态 | Not Qualified |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| M74HC573F1 | M54HC563F1 | 30-07-L-X | M54HC373F1 | M74HC533C1 | M74HC533F1 | M74HC563F1 | |
|---|---|---|---|---|---|---|---|
| 描述 | D Latch, 1-Func, 8-Bit, CMOS, CDIP20 | D Latch, 1-Func, 8-Bit, CMOS, CDIP20 | HERMETICALLY SEALED HALF CRYSTAL CAN RELAY | D Latch, 1-Func, 8-Bit, CMOS, CDIP20 | D Latch, 1-Func, 8-Bit, CMOS, PQCC20 | D Latch, 1-Func, 8-Bit, CMOS, CDIP20 | D Latch, 1-Func, 8-Bit, CMOS, CDIP20 |
| 是否Rohs认证 | 不符合 | 不符合 | - | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | SGS-Ates Componenti Electronici SPA | SGS-Ates Componenti Electronici SPA | - | SGS-Ates Componenti Electronici SPA | SGS-Ates Componenti Electronici SPA | SGS-Ates Componenti Electronici SPA | SGS-Ates Componenti Electronici SPA |
| 包装说明 | DIP, DIP20,.3 | - | - | DIP, DIP20,.3 | QCCJ, LDCC20,.4SQ | DIP, DIP20,.3 | DIP, DIP20,.3 |
| Reach Compliance Code | unknow | unknown | - | unknown | unknown | unknown | unknown |
| JESD-30 代码 | R-XDIP-T20 | R-XDIP-T20 | - | R-XDIP-T20 | S-PQCC-J20 | R-XDIP-T20 | R-XDIP-T20 |
| JESD-609代码 | e0 | e0 | - | e0 | e0 | e0 | e0 |
| 逻辑集成电路类型 | D LATCH | D LATCH | - | D LATCH | D LATCH | D LATCH | D LATCH |
| 位数 | 8 | 8 | - | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | - | 1 | 1 | 1 | 1 |
| 端子数量 | 20 | 20 | - | 20 | 20 | 20 | 20 |
| 最高工作温度 | 85 °C | 125 °C | - | 125 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -55 °C | - | -55 °C | -40 °C | -40 °C | -40 °C |
| 输出特性 | 3-STATE | 3-STATE | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | CERAMIC | CERAMIC | - | CERAMIC | PLASTIC/EPOXY | CERAMIC | CERAMIC |
| 封装代码 | DIP | DIP | - | DIP | QCCJ | DIP | DIP |
| 封装等效代码 | DIP20,.3 | DIP20,.3 | - | DIP20,.3 | LDCC20,.4SQ | DIP20,.3 | DIP20,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | - | IN-LINE | CHIP CARRIER | IN-LINE | IN-LINE |
| 电源 | 2/6 V | 2/6 V | - | 2/6 V | 2/6 V | 2/6 V | 2/6 V |
| 认证状态 | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 表面贴装 | NO | NO | - | NO | YES | NO | NO |
| 技术 | CMOS | CMOS | - | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | MILITARY | - | MILITARY | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | - | THROUGH-HOLE | J BEND | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | - | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | - | DUAL | QUAD | DUAL | DUAL |
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