MASK ROM, 2KX8, 1820ns, CMOS, PDIP24
参数名称 | 属性值 |
厂商名称 | Hughes Aircraft |
包装说明 | , |
Reach Compliance Code | unknow |
ECCN代码 | EAR99 |
最长访问时间 | 1820 ns |
其他特性 | OUTPUT IS LATCHED; 16-BIT ADDR. MUXED. ON 8 ADDR. LINES |
JESD-30 代码 | R-PDIP-T24 |
内存密度 | 16384 bi |
内存集成电路类型 | MASK ROM |
内存宽度 | 8 |
功能数量 | 1 |
端子数量 | 24 |
字数 | 2048 words |
字数代码 | 2000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
组织 | 2KX8 |
输出特性 | 3-STATE |
封装主体材料 | PLASTIC/EPOXY |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
并行/串行 | PARALLEL |
认证状态 | Not Qualified |
最大供电电压 (Vsup) | 6.5 V |
最小供电电压 (Vsup) | 4 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子形式 | THROUGH-HOLE |
端子位置 | DUAL |
H1835CP | H1835CH | H1835CD | H1835CL | H1835CY | |
---|---|---|---|---|---|
描述 | MASK ROM, 2KX8, 1820ns, CMOS, PDIP24 | MASK ROM, 2KX8, 1820ns, CMOS | MASK ROM, 2KX8, 1820ns, CMOS, CDIP24 | MASK ROM, 2KX8, 1820ns, CMOS, CQCC24, LCC-24 | MASK ROM, 2KX8, 1820ns, CMOS, CDIP24 |
厂商名称 | Hughes Aircraft | Hughes Aircraft | Hughes Aircraft | Hughes Aircraft | Hughes Aircraft |
Reach Compliance Code | unknow | unknown | unknown | unknown | unknow |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
最长访问时间 | 1820 ns | 1820 ns | 1820 ns | 1820 ns | 1820 ns |
其他特性 | OUTPUT IS LATCHED; 16-BIT ADDR. MUXED. ON 8 ADDR. LINES | OUTPUT IS LATCHED; 16-BIT ADDR. MUXED. ON 8 ADDR. LINES | OUTPUT IS LATCHED; 16-BIT ADDR. MUXED. ON 8 ADDR. LINES | OUTPUT IS LATCHED; 16-BIT ADDR. MUXED. ON 8 ADDR. LINES | OUTPUT IS LATCHED; 16-BIT ADDR. MUXED. ON 8 ADDR. LINES |
JESD-30 代码 | R-PDIP-T24 | X-XUUC-N | R-CDIP-T24 | S-CQCC-N24 | R-GDIP-T24 |
内存密度 | 16384 bi | 16384 bit | 16384 bit | 16384 bit | 16384 bi |
内存集成电路类型 | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM |
内存宽度 | 8 | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 | 1 | 1 |
字数 | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words |
字数代码 | 2000 | 2000 | 2000 | 2000 | 2000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
组织 | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | PLASTIC/EPOXY | UNSPECIFIED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED |
封装形状 | RECTANGULAR | UNSPECIFIED | RECTANGULAR | SQUARE | RECTANGULAR |
封装形式 | IN-LINE | UNCASED CHIP | IN-LINE | CHIP CARRIER | IN-LINE |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大供电电压 (Vsup) | 6.5 V | 6.5 V | 6.5 V | 6.5 V | 6.5 V |
最小供电电压 (Vsup) | 4 V | 4 V | 4 V | 4 V | 4 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | YES | NO | YES | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
端子形式 | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | NO LEAD | THROUGH-HOLE |
端子位置 | DUAL | UPPER | DUAL | QUAD | DUAL |
端子数量 | 24 | - | 24 | 24 | 24 |
最高工作温度 | 85 °C | - | 125 °C | 125 °C | 125 °C |
最低工作温度 | -40 °C | - | -55 °C | -55 °C | -55 °C |
温度等级 | INDUSTRIAL | - | MILITARY | MILITARY | MILITARY |
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