电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

IDT72264L15G

产品描述FIFO, 16KX9, 10ns, Synchronous, CMOS, CPGA68, PGA-68
产品类别存储    存储   
文件大小392KB,共31页
制造商IDT (Integrated Device Technology)
下载文档 详细参数 选型对比 全文预览

IDT72264L15G概述

FIFO, 16KX9, 10ns, Synchronous, CMOS, CPGA68, PGA-68

IDT72264L15G规格参数

参数名称属性值
是否Rohs认证不符合
厂商名称IDT (Integrated Device Technology)
零件包装代码PGA
包装说明PGA-68
针数68
Reach Compliance Code_compli
ECCN代码EAR99
最长访问时间10 ns
其他特性RETRANSMIT; AUTOMATIC POWER-DOWN
备用内存宽度9
最大时钟频率 (fCLK)66.7 MHz
周期时间15 ns
JESD-30 代码S-CPGA-P68
JESD-609代码e0
长度29.464 mm
内存密度147456 bi
内存集成电路类型OTHER FIFO
内存宽度9
功能数量1
端子数量68
字数16384 words
字数代码16000
工作模式SYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织16KX9
输出特性3-STATE
可输出YES
封装主体材料CERAMIC, METAL-SEALED COFIRED
封装代码PGA
封装等效代码PGA68,11X11
封装形状SQUARE
封装形式GRID ARRAY
并行/串行PARALLEL
峰值回流温度(摄氏度)NOT SPECIFIED
电源5 V
认证状态Not Qualified
座面最大高度5.207 mm
最大压摆率0.135 mA
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装NO
技术CMOS
温度等级COMMERCIAL
端子面层Tin/Lead (Sn/Pb)
端子形式PIN/PEG
端子节距2.54 mm
端子位置PERPENDICULAR
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度29.464 mm

文档预览

下载PDF文档
VARIABLE WIDTH SUPERSYNC™ FIFO
8,192 x 18 or 16,384 x 9
16,384 x 18 or 32,768 x 9
Integrated Device Technology, Inc.
IDT72264
IDT72274
FEATURES:
Select 8192 x 18 or 16384x 9 organization (IDT72264)
Select 16384 x 18 or 32678 x 9 organization (IDT72274)
Flexible control of read and write clock frequencies
Reduced dynamic power dissipation
Auto power down minimizes power consumption
15 ns read/write cycle time (10 ns access time)
Retransmit Capability
Master Reset clears entire FIFO, Partial Reset clears
data, but retains programmable settings
Empty, full and half-full flags signal FIFO status
Programmable almost empty and almost full flags, each
flag can default to one of two preselected offsets
Program partial flags by either serial or parallel means
Select IDT Standard timing (using
EF
and
FF
flags) or
First Word Fall Through timing (using
OR
and
IR
flags)
Easily expandable in depth and width
Independent read and write clocks (permits simultaneous
reading and writing with one clock signal)
Available in the 64-pin Thin Quad Flat Pack (TQFP), 64-
pin Slim Thin Quad Flat Pack (STQFP) and the 68-pin
Pin Grid Array (PGA)
Output enable puts data outputs into high impedance
High-performance submicron CMOS technology
• Industrial temperature range (-40
O
C to +85
O
C) is avail-
able, tested to military electrical specifications
DESCRIPTION:
The IDT72264/72274 are monolithic, CMOS, high capac-
ity, high speed, low power first-in, first-out (FIFO) memories
with clocked read and write controls. These FIFOs have three
main features that distinguish them among SuperSync FIFOs:
First, the data path width can be changed from 9-bits to 18-
bits; as a result, halving the depth. A pin called Memory Array
Select (MAC) chooses between the two options. This feature
helps reduce the need for redesigns or multiple versions of PC
cards, since a single layout can be used for both data bus
widths.
Second, IDT72264/72274 offer the greatest flexibility for
setting and varying the read and write clock (WCLK and
RCLK) frequencies. For example, given that the two clock
frequencies are unequal, the slower clock may exceed the
faster by, at most, twice its frequency. This feature is espe-
cially useful for communications and network applications
where clock frequencies are switched to permit different data
rates.
FUNCTIONAL BLOCK DIAGRAM
WEN
WCLK
D
0
-D
n
LD SEN
INPUT REGISTER
OFFSET REGISTER
WRITE CONTROL
LOGIC
RAM ARRAY
8192 x 18 or 16384 x 9
16384 x 18 or 32768 x 9
FLAG
LOGIC
FF
/
IR
PAF
EF
/
OR
PAE
HF
FWFT/SI
WRITE POINTER
READ POINTER
MAC
MEMORY ARRAY
CONFIGURATION
OUTPUT REGISTER
READ
CONTROL
LOGIC
RT
MRS
PRS
FS
RESET
LOGIC
RCLK
REN
TIMING
OE
COMMERCIAL TEMPERATURE RANGES
©1997
Integrated Device Technology, Inc
Q
0
-Q
n
3218 drw 01
SyncFIFO is a trademark and the IDT logo is a registered trademark of Integrated Device Technology, Inc.
MAY 1997
DSC-3218/2
For latest information contact IDT's web site at www.idt.com or fax-on-demand at 408-492-8391.
1

IDT72264L15G相似产品对比

IDT72264L15G IDT72264L15TF IDT72264L20TF IDT72274L15G IDT72274L20G IDT72274L20TF IDT72274L20PF IDT72274L15TF IDT72274L15PF IDT72264L20G
描述 FIFO, 16KX9, 10ns, Synchronous, CMOS, CPGA68, PGA-68 FIFO, 16KX9, 10ns, Synchronous, CMOS, PQFP64, STQFP-64 FIFO, 16KX9, 12ns, Synchronous, CMOS, PQFP64, STQFP-64 FIFO, 32KX9, 10ns, Synchronous, CMOS, CPGA68, PGA-68 FIFO, 32KX9, 12ns, Synchronous, CMOS, CPGA68, PGA-68 FIFO, 32KX9, 12ns, Synchronous, CMOS, PQFP64, STQFP-64 FIFO, 32KX9, 12ns, Synchronous, CMOS, PQFP64, TQFP-64 FIFO, 32KX9, 10ns, Synchronous, CMOS, PQFP64, STQFP-64 FIFO, 32KX9, 10ns, Synchronous, CMOS, PQFP64, TQFP-64 FIFO, 16KX9, 12ns, Synchronous, CMOS, CPGA68, PGA-68
是否Rohs认证 不符合 不符合 不符合 不符合 不符合 不符合 不符合 不符合 不符合 不符合
零件包装代码 PGA QFP QFP PGA PGA QFP QFP QFP QFP PGA
包装说明 PGA-68 STQFP-64 STQFP-64 PGA-68 PGA-68 STQFP-64 TQFP-64 STQFP-64 TQFP-64 PGA-68
针数 68 64 64 68 68 64 64 64 64 68
Reach Compliance Code _compli not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant _compli
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
最长访问时间 10 ns 10 ns 12 ns 10 ns 12 ns 12 ns 12 ns 10 ns 10 ns 12 ns
其他特性 RETRANSMIT; AUTOMATIC POWER-DOWN RETRANSMIT; AUTO POWER-DOWN RETRANSMIT; AUTO POWER-DOWN RETRANSMIT; AUTOMATIC POWER-DOWN RETRANSMIT; AUTOMATIC POWER-DOWN RETRANSMIT; AUTO POWER-DOWN RETRANSMIT; AUTO POWER-DOWN RETRANSMIT; AUTO POWER-DOWN RETRANSMIT; AUTO POWER-DOWN RETRANSMIT; AUTOMATIC POWER-DOWN
备用内存宽度 9 9 9 9 9 9 9 9 9 9
最大时钟频率 (fCLK) 66.7 MHz 66.7 MHz 50 MHz 66.7 MHz 50 MHz 50 MHz 50 MHz 66.7 MHz 66.7 MHz 50 MHz
周期时间 15 ns 15 ns 20 ns 15 ns 20 ns 20 ns 20 ns 15 ns 15 ns 20 ns
JESD-30 代码 S-CPGA-P68 S-PQFP-G64 S-PQFP-G64 S-CPGA-P68 S-CPGA-P68 S-PQFP-G64 S-PQFP-G64 S-PQFP-G64 S-PQFP-G64 S-CPGA-P68
JESD-609代码 e0 e0 e0 e0 e0 e0 e0 e0 e0 e0
长度 29.464 mm 10 mm 10 mm 29.464 mm 29.464 mm 10 mm 14 mm 10 mm 14 mm 29.464 mm
内存密度 147456 bi 147456 bit 147456 bit 294912 bit 294912 bit 294912 bit 294912 bit 294912 bit 294912 bit 147456 bi
内存集成电路类型 OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO
内存宽度 9 9 9 9 9 9 9 9 9 9
功能数量 1 1 1 1 1 1 1 1 1 1
端子数量 68 64 64 68 68 64 64 64 64 68
字数 16384 words 16384 words 16384 words 32768 words 32768 words 32768 words 32768 words 32768 words 32768 words 16384 words
字数代码 16000 16000 16000 32000 32000 32000 32000 32000 32000 16000
工作模式 SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
最高工作温度 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
组织 16KX9 16KX9 16KX9 32KX9 32KX9 32KX9 32KX9 32KX9 32KX9 16KX9
输出特性 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
可输出 YES YES YES YES YES YES YES YES YES YES
封装主体材料 CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
封装代码 PGA LFQFP LFQFP PGA PGA LFQFP LQFP LFQFP LQFP PGA
封装等效代码 PGA68,11X11 QFP64,.47SQ,20 QFP64,.47SQ,20 PGA68,11X11 PGA68,11X11 QFP64,.47SQ,20 QFP64,.66SQ,32 QFP64,.47SQ,20 QFP64,.66SQ,32 PGA68,11X11
封装形状 SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
封装形式 GRID ARRAY FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH GRID ARRAY GRID ARRAY FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE GRID ARRAY
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
电源 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 5.207 mm 1.6 mm 1.6 mm 5.207 mm 5.207 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 5.207 mm
最大压摆率 0.135 mA 0.135 mA 0.135 mA 0.135 mA 0.135 mA 0.135 mA 0.135 mA 0.135 mA 0.135 mA 0.135 mA
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 NO YES YES NO NO YES YES YES YES NO
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn/Pb)
端子形式 PIN/PEG GULL WING GULL WING PIN/PEG PIN/PEG GULL WING GULL WING GULL WING GULL WING PIN/PEG
端子节距 2.54 mm 0.5 mm 0.5 mm 2.54 mm 2.54 mm 0.5 mm 0.8 mm 0.5 mm 0.8 mm 2.54 mm
端子位置 PERPENDICULAR QUAD QUAD PERPENDICULAR PERPENDICULAR QUAD QUAD QUAD QUAD PERPENDICULAR
宽度 29.464 mm 10 mm 10 mm 29.464 mm 29.464 mm 10 mm 14 mm 10 mm 14 mm 29.464 mm
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) - - IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
湿度敏感等级 - 3 3 - - 3 3 3 3 -

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 2475  2219  1115  2615  2517  30  41  29  56  1 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved