SB-32, Tube
| 参数名称 | 属性值 |
| Brand Name | Integrated Device Technology |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | IDT (Integrated Device Technology) |
| 零件包装代码 | SB |
| 包装说明 | DIP, DIP32,.4 |
| 针数 | 32 |
| 制造商包装代码 | SF32 |
| Reach Compliance Code | _compli |
| 最长访问时间 | 10 ns |
| I/O 类型 | SEPARATE |
| JESD-30 代码 | R-CDIP-T32 |
| JESD-609代码 | e0 |
| 内存密度 | 65536 bi |
| 内存集成电路类型 | STANDARD SRAM |
| 内存宽度 | 4 |
| 湿度敏感等级 | 1 |
| 负电源额定电压 | -5.2 V |
| 功能数量 | 1 |
| 端子数量 | 32 |
| 字数 | 16384 words |
| 字数代码 | 16000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 75 °C |
| 最低工作温度 | |
| 组织 | 16KX4 |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP |
| 封装等效代码 | DIP32,.4 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | -5.2 V |
| 认证状态 | Not Qualified |
| 最大压摆率 | 0.26 mA |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL EXTENDED |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 10496RL10C | 101496RL10Y | 101496RL12Y | 101496RL15Y | 10496RL15Y | 10496RL12Y | 10496RL10Y | 10496RL12C | |
|---|---|---|---|---|---|---|---|---|
| 描述 | SB-32, Tube | SOJ-32, Tube | SOJ-32, Tube | SOJ-32, Tube | SOJ-32, Tube | SOJ-32, Tube | SOJ-32, Tube | SB-32, Tube |
| Brand Name | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
| 零件包装代码 | SB | SOJ | SOJ | SOJ | SOJ | SOJ | SOJ | SB |
| 包装说明 | DIP, DIP32,.4 | SOJ, SOJ32,.44 | SOJ, SOJ32,.44 | SOJ, SOJ32,.44 | SOJ, SOJ32,.44 | SOJ, SOJ32,.44 | SOJ, SOJ32,.44 | DIP, DIP32,.4 |
| 针数 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| 制造商包装代码 | SF32 | PJ32 | PJ32 | PJ32 | PJ32 | PJ32 | PJ32 | SF32 |
| Reach Compliance Code | _compli | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | _compli |
| 最长访问时间 | 10 ns | 10 ns | - | 15 ns | 15 ns | 12 ns | - | 12 ns |
| I/O 类型 | SEPARATE | SEPARATE | - | SEPARATE | SEPARATE | SEPARATE | - | SEPARATE |
| JESD-30 代码 | R-CDIP-T32 | R-PDSO-J32 | - | R-PDSO-J32 | R-PDSO-J32 | R-PDSO-J32 | - | R-CDIP-T32 |
| JESD-609代码 | e0 | e0 | - | e0 | e0 | e0 | - | e0 |
| 内存密度 | 65536 bi | 65536 bit | - | 65536 bit | 65536 bit | 65536 bit | - | 65536 bi |
| 内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | - | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | - | STANDARD SRAM |
| 内存宽度 | 4 | 4 | - | 4 | 4 | 4 | - | 4 |
| 湿度敏感等级 | 1 | 3 | - | 3 | 3 | 3 | - | 1 |
| 负电源额定电压 | -5.2 V | -5.2 V | - | -5.2 V | -5.2 V | -5.2 V | - | -5.2 V |
| 功能数量 | 1 | 1 | - | 1 | 1 | 1 | - | 1 |
| 端子数量 | 32 | 32 | - | 32 | 32 | 32 | - | 32 |
| 字数 | 16384 words | 16384 words | - | 16384 words | 16384 words | 16384 words | - | 16384 words |
| 字数代码 | 16000 | 16000 | - | 16000 | 16000 | 16000 | - | 16000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | - | SYNCHRONOUS |
| 最高工作温度 | 75 °C | 75 °C | - | 75 °C | 75 °C | 75 °C | - | 75 °C |
| 组织 | 16KX4 | 16KX4 | - | 16KX4 | 16KX4 | 16KX4 | - | 16KX4 |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP | SOJ | - | SOJ | SOJ | SOJ | - | DIP |
| 封装等效代码 | DIP32,.4 | SOJ32,.44 | - | SOJ32,.44 | SOJ32,.44 | SOJ32,.44 | - | DIP32,.4 |
| 封装形状 | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR |
| 封装形式 | IN-LINE | SMALL OUTLINE | - | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | - | IN-LINE |
| 并行/串行 | PARALLEL | PARALLEL | - | PARALLEL | PARALLEL | PARALLEL | - | PARALLEL |
| 峰值回流温度（摄氏度） | 260 | 225 | - | 225 | 225 | 225 | - | 260 |
| 电源 | -5.2 V | -5.2 V | - | -5.2 V | -5.2 V | -5.2 V | - | -5.2 V |
| 认证状态 | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified |
| 最大压摆率 | 0.26 mA | 0.26 mA | - | 0.26 mA | 0.26 mA | 0.26 mA | - | 0.26 mA |
| 表面贴装 | NO | YES | - | YES | YES | YES | - | NO |
| 技术 | CMOS | CMOS | - | CMOS | CMOS | CMOS | - | CMOS |
| 温度等级 | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | - | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | - | COMMERCIAL EXTENDED |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn85Pb15) | - | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | - | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | J BEND | - | J BEND | J BEND | J BEND | - | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 1.27 mm | - | 1.27 mm | 1.27 mm | 1.27 mm | - | 2.54 mm |
| 端子位置 | DUAL | DUAL | - | DUAL | DUAL | DUAL | - | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED |
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