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Datasheet> 器件分类 > 模拟混合信号IC> 信号电路> MC145146LD

MC145146LD: 产品描述IC,FREQUENCY SYNTHESIZER,CMOS,DIP,20PIN,CERAMIC; 产品类别模拟混合信号IC 信号电路; 文件大小770KB，共13页; 制造商NXP(恩智浦); 官网地址https://www.nxp.com

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MC145146LD概述

IC,FREQUENCY SYNTHESIZER,CMOS,DIP,20PIN,CERAMIC

MC145146LD规格参数

参数名称	属性值
是否Rohs认证	不符合
厂商名称	NXP(恩智浦)
包装说明	DIP, DIP20,.3
Reach Compliance Code	unknown
JESD-30 代码	R-XDIP-T20
JESD-609代码	e0
端子数量	20
最高工作温度	85 °C
最低工作温度	-40 °C
封装主体材料	CERAMIC
封装代码	DIP
封装等效代码	DIP20,.3
封装形状	RECTANGULAR
封装形式	IN-LINE
表面贴装	NO
技术	CMOS
温度等级	INDUSTRIAL
端子面层	Tin/Lead (Sn/Pb)
端子形式	THROUGH-HOLE
端子节距	2.54 mm
端子位置	DUAL

MC145146LD相似产品对比

	MC145146LD	MC145146L1D	MC145146L1DS	MC145146LDS	MC145146P1D	MC145146P1DS	MC145146P1S	MC145146PDS	MC145146L1	MC145146PD
描述	IC,FREQUENCY SYNTHESIZER,CMOS,DIP,20PIN,CERAMIC	IC,FREQUENCY SYNTHESIZER,CMOS,DIP,20PIN,CERAMIC	IC,FREQUENCY SYNTHESIZER,CMOS,DIP,20PIN,CERAMIC	IC,FREQUENCY SYNTHESIZER,CMOS,DIP,20PIN,CERAMIC	IC,FREQUENCY SYNTHESIZER,CMOS,DIP,20PIN,PLASTIC	IC,FREQUENCY SYNTHESIZER,CMOS,DIP,20PIN,PLASTIC	IC,FREQUENCY SYNTHESIZER,CMOS,DIP,20PIN,PLASTIC	IC,FREQUENCY SYNTHESIZER,CMOS,DIP,20PIN,PLASTIC	IC,FREQUENCY SYNTHESIZER,CMOS,DIP,20PIN,CERAMIC	IC,FREQUENCY SYNTHESIZER,CMOS,DIP,20PIN,PLASTIC
是否Rohs认证	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合
厂商名称	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)
包装说明	DIP, DIP20,.3	DIP, DIP20,.3	DIP, DIP20,.3	DIP, DIP20,.3	DIP, DIP20,.3	DIP, DIP20,.3	DIP, DIP20,.3	DIP, DIP20,.3	DIP, DIP20,.3	DIP, DIP20,.3
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
JESD-30 代码	R-XDIP-T20	R-XDIP-T20	R-XDIP-T20	R-XDIP-T20	R-PDIP-T20	R-PDIP-T20	R-PDIP-T20	R-PDIP-T20	R-XDIP-T20	R-PDIP-T20
JESD-609代码	e0	e0	e0	e0	e0	e0	e0	e0	e0	e0
端子数量	20	20	20	20	20	20	20	20	20	20
最高工作温度	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
最低工作温度	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
封装主体材料	CERAMIC	CERAMIC	CERAMIC	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC	PLASTIC/EPOXY
封装代码	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP
封装等效代码	DIP20,.3	DIP20,.3	DIP20,.3	DIP20,.3	DIP20,.3	DIP20,.3	DIP20,.3	DIP20,.3	DIP20,.3	DIP20,.3
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
表面贴装	NO	NO	NO	NO	NO	NO	NO	NO	NO	NO
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
端子面层	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
端子形式	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
端子节距	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
端子位置	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL

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