Field Programmable Gate Array, 110000-Cell, CMOS, PBGA484,
参数名称 | 属性值 |
是否Rohs认证 | 符合 |
厂商名称 | Intel(英特尔) |
Reach Compliance Code | compliant |
JESD-30 代码 | S-PBGA-B484 |
输入次数 | 66 |
逻辑单元数量 | 110000 |
输出次数 | 66 |
端子数量 | 484 |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | FBGA |
封装等效代码 | BGA484,22X22,32 |
封装形状 | SQUARE |
封装形式 | GRID ARRAY, FINE PITCH |
电源 | 1.1,1.2/3.3,2.5 V |
可编程逻辑类型 | FIELD PROGRAMMABLE GATE ARRAY |
认证状态 | Not Qualified |
表面贴装 | YES |
技术 | CMOS |
端子形式 | BALL |
端子节距 | 0.8 mm |
端子位置 | BOTTOM |
5CSEMA6U19C72N | 5CSEMA6U19C62N | 5CSEMA6U23C81 | 5CSEMA6U23I71N | 5CSTFD6D4F31C62 | 5CSTFD6D4F31C72N | 5CSTFD6D4F31C82N | 5CSXFC6C6U23C82N | 5CSXFC6C6U23I72N | |
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描述 | Field Programmable Gate Array, 110000-Cell, CMOS, PBGA484, | Field Programmable Gate Array, 110000-Cell, CMOS, PBGA484, | Field Programmable Gate Array, 110000-Cell, CMOS, PBGA672, | Field Programmable Gate Array, 110000-Cell, CMOS, PBGA672, | Field Programmable Gate Array, 110000-Cell, CMOS, PBGA896, | Field Programmable Gate Array, 110000-Cell, CMOS, PBGA896, | Field Programmable Gate Array, 110000-Cell, CMOS, PBGA896, | Field Programmable Gate Array, 110000-Cell, CMOS, PBGA672, | Field Programmable Gate Array, 110000-Cell, CMOS, PBGA672, |
是否Rohs认证 | 符合 | 符合 | 不符合 | 符合 | 不符合 | 符合 | 符合 | 符合 | 符合 |
厂商名称 | Intel(英特尔) | Intel(英特尔) | Intel(英特尔) | Intel(英特尔) | Intel(英特尔) | Intel(英特尔) | Intel(英特尔) | Intel(英特尔) | Intel(英特尔) |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
JESD-30 代码 | S-PBGA-B484 | S-PBGA-B484 | S-PBGA-B672 | S-PBGA-B672 | S-PBGA-B896 | S-PBGA-B896 | S-PBGA-B896 | S-PBGA-B672 | S-PBGA-B672 |
输入次数 | 66 | 66 | 124 | 124 | 288 | 288 | 288 | 124 | 124 |
逻辑单元数量 | 110000 | 110000 | 110000 | 110000 | 110000 | 110000 | 110000 | 110000 | 110000 |
输出次数 | 66 | 66 | 124 | 124 | 288 | 288 | 288 | 124 | 124 |
端子数量 | 484 | 484 | 672 | 672 | 896 | 896 | 896 | 672 | 672 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | FBGA | FBGA | FBGA | FBGA | BGA | BGA | BGA | FBGA | FBGA |
封装等效代码 | BGA484,22X22,32 | BGA484,22X22,32 | BGA672,26X26,32 | BGA672,26X26,32 | BGA896,30X30,40 | BGA896,30X30,40 | BGA896,30X30,40 | BGA672,26X26,32 | BGA672,26X26,32 |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH |
电源 | 1.1,1.2/3.3,2.5 V | 1.1,1.2/3.3,2.5 V | 1.1,1.2/3.3,2.5 V | 1.1,1.2/3.3,2.5 V | 1.1,1.2/3.3,2.5 V | 1.1,1.2/3.3,2.5 V | 1.1,1.2/3.3,2.5 V | 1.1,1.2/3.3,2.5 V | 1.1,1.2/3.3,2.5 V |
可编程逻辑类型 | FIELD PROGRAMMABLE GATE ARRAY | FIELD PROGRAMMABLE GATE ARRAY | FIELD PROGRAMMABLE GATE ARRAY | FIELD PROGRAMMABLE GATE ARRAY | FIELD PROGRAMMABLE GATE ARRAY | FIELD PROGRAMMABLE GATE ARRAY | FIELD PROGRAMMABLE GATE ARRAY | FIELD PROGRAMMABLE GATE ARRAY | FIELD PROGRAMMABLE GATE ARRAY |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
端子形式 | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL |
端子节距 | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 1 mm | 1 mm | 1 mm | 0.8 mm | 0.8 mm |
端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
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