Freescale Semiconductor
Data Sheet: Advance Information
Document Number: MPC5643L
Rev. 8.1, 5/2012
MPC5643L
Qorivva MPC5643L
Microcontroller Data Sheet
•
High-performance e200z4d dual core
— 32-bit Power Architecture
®
technology CPU
— Core frequency as high as 120 MHz
— Dual issue five-stage pipeline core
— Variable Length Encoding (VLE)
— Memory Management Unit (MMU)
— 4 KB instruction cache with error detection code
— Signal processing engine (SPE)
Memory available
— 1 MB flash memory with ECC
— 128 KB on-chip SRAM with ECC
— Built-in RWW capabilities for EEPROM emulation
SIL3/ASILD innovative safety concept: LockStep mode
and Fail-safe protection
— Sphere of replication (SoR) for key components (such
as CPU core, eDMA, crossbar switch)
— Fault collection and control unit (FCCU)
— Redundancy control and checker unit (RCCU) on
outputs of the SoR connected to FCCU
— Boot-time Built-In Self-Test for Memory (MBIST)
and Logic (LBIST) triggered by hardware
— Boot-time Built-In Self-Test for ADC and flash
memory triggered by software
— Replicated safety enhanced watchdog
— Replicated junction temperature sensor
— Non-maskable interrupt (NMI)
— 16-region memory protection unit (MPU)
— Clock monitoring units (CMU)
— Power management unit (PMU)
— Cyclic redundancy check (CRC) unit
— Decoupled Parallel mode for high-performance use
of replicated cores
Nexus Class 3+ interface
Interrupts
— Replicated 16-priority controller
— Replicated 16-channel eDMA controller
GPIOs individually programmable as input, output or
special function
Three 6-channel general-purpose eTimer units
MAPBGA–225
15 mm x 15 mm
QFN12
##_mm_x_##mm
SOT-343R
##_mm_x_##mm
144 LQFP
(20 x 20 x 1.4 mm)
TBD
PKG-TBD
## mm x ## mm
257 MAPBGA
(14 x 14 x 0.8 mm)
•
•
•
•
•
•
•
•
•
•
2 FlexPWM units
— Four 16-bit channels per module
Communications interfaces
— 2 LINFlexD channels
— 3 DSPI channels with automatic chip select
generation
— 2 FlexCAN interfaces (2.0B Active) with 32 message
objects
— FlexRay module (V2.1 Rev. A) with 2 channels, 64
message buffers and data rates up to 10 Mbit/s
Two 12-bit analog-to-digital converters (ADCs)
— 16 input channels
— Programmable cross triggering unit (CTU) to
synchronize ADCs conversion with timer and PWM
Sine wave generator (D/A with low pass filter)
On-chip CAN/UART bootstrap loader
Single 3.0 V to 3.6 V voltage supply
Ambient temperature range –40 °C to 125 °C
Junction temperature range –40 °C to 150 °C
•
•
•
•
This document contains information on a product under development. Freescale reserves
the right to change or discontinue this product without notice.
© Freescale Semiconductor, Inc., 2009–2012. All rights reserved.
Table of Contents
1
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3
1.1 Document overview . . . . . . . . . . . . . . . . . . . . . . . . . . . .3
1.2 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3
1.3 Device comparison . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3
1.4 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
1.5 Feature details . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
1.5.1 High-performance e200z4d core . . . . . . . . . . . . .7
1.5.2 Crossbar switch (XBAR) . . . . . . . . . . . . . . . . . . .7
1.5.3 Memory Protection Unit (MPU) . . . . . . . . . . . . . .8
1.5.4 Enhanced Direct Memory Access (eDMA) . . . . .8
1.5.5 On-chip flash memory with ECC . . . . . . . . . . . . .9
1.5.6 On-chip SRAM with ECC. . . . . . . . . . . . . . . . . . .9
1.5.7 Platform flash memory controller . . . . . . . . . . . . .9
1.5.8 Platform Static RAM Controller (SRAMC) . . . . .10
1.5.9 Memory subsystem access time . . . . . . . . . . . .10
1.5.10 Error Correction Status Module (ECSM) . . . . . . 11
1.5.11 Peripheral bridge (PBRIDGE) . . . . . . . . . . . . . . 11
1.5.12 Interrupt Controller (INTC) . . . . . . . . . . . . . . . . . 11
1.5.13 System clocks and clock generation . . . . . . . . . 11
1.5.14 Frequency-Modulated Phase-Locked Loop
(FMPLL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
1.5.15 Main oscillator . . . . . . . . . . . . . . . . . . . . . . . . . .12
1.5.16 Internal Reference Clock (RC) oscillator . . . . . .12
1.5.17 Clock, reset, power, mode and test control
modules (MC_CGM, MC_RGM, MC_PCU, and MC_ME)
13
1.5.18 Periodic Interrupt Timer Module (PIT) . . . . . . . .13
1.5.19 System Timer Module (STM). . . . . . . . . . . . . . .13
1.5.20 Software Watchdog Timer (SWT) . . . . . . . . . . .13
1.5.21 Fault Collection and Control Unit (FCCU) . . . . .14
1.5.22 System Integration Unit Lite (SIUL) . . . . . . . . . .14
1.5.23 Non-Maskable Interrupt (NMI) . . . . . . . . . . . . . .14
1.5.24 Boot Assist Module (BAM). . . . . . . . . . . . . . . . .14
1.5.25 System Status and Configuration Module
(SSCM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
1.5.26 FlexCAN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15
1.5.27 FlexRay . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15
1.5.28 Serial communication interface module
(LINFlexD). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
1.5.29 Deserial Serial Peripheral Interface (DSPI) . . . .16
1.5.30 FlexPWM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
1.5.31 eTimer module. . . . . . . . . . . . . . . . . . . . . . . . . .18
1.5.32 Sine Wave Generator (SWG) . . . . . . . . . . . . . .18
1.5.33 Analog-to-Digital Converter module (ADC) . . . .18
1.5.34 Cross Triggering Unit (CTU) . . . . . . . . . . . . . . .19
1.5.35 Cyclic Redundancy Checker (CRC) Unit . . . . . .19
1.5.36 Redundancy Control and Checker Unit (RCCU)20
1.5.37 Junction temperature sensor . . . . . . . . . . . . . . .20
1.5.38 Nexus Port Controller (NPC) . . . . . . . . . . . . . . .20
1.5.39 IEEE 1149.1 JTAG Controller (JTAGC) . . . . . . .21
2
1.5.40 Voltage regulator / Power Management Unit
(PMU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
1.5.41 Built-In Self-Test (BIST) capability . . . . . . . . . . 22
Package pinouts and signal descriptions . . . . . . . . . . . . . . . 23
2.1 Package pinouts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
2.2 Supply pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
2.3 System pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
2.4 Pin muxing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
3.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
3.2 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . 76
3.3 Recommended operating conditions . . . . . . . . . . . . . . 77
3.4 Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . 78
3.4.1 General notes for specifications at maximum
junction temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 80
3.5 Electromagnetic Interference (EMI) characteristics. . . 81
3.6 Electrostatic discharge (ESD) characteristics . . . . . . . 82
3.7 Static latch-up (LU) . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
3.8 Voltage regulator electrical characteristics . . . . . . . . . 83
3.9 DC electrical characteristics . . . . . . . . . . . . . . . . . . . . 86
3.10 Supply current characteristics . . . . . . . . . . . . . . . . . . . 87
3.11 Temperature sensor electrical characteristics . . . . . . . 90
3.12 Main oscillator electrical characteristics . . . . . . . . . . . 90
3.13 FMPLL electrical characteristics . . . . . . . . . . . . . . . . . 92
3.14 16 MHz RC oscillator electrical characteristics . . . . . . 93
3.15 ADC electrical characteristics . . . . . . . . . . . . . . . . . . . 93
3.15.1 Input Impedance and ADC Accuracy . . . . . . . . 94
3.16 Flash memory electrical characteristics. . . . . . . . . . . . 99
3.17 SWG electrical characteristics. . . . . . . . . . . . . . . . . . 101
3.18 AC specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101
3.18.1 Pad AC specifications . . . . . . . . . . . . . . . . . . 101
3.19 Reset sequence. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102
3.19.1 Reset sequence duration . . . . . . . . . . . . . . . . 102
3.19.2 Reset sequence description . . . . . . . . . . . . . . 103
3.19.3 Reset sequence trigger mapping . . . . . . . . . . 105
3.19.4 Reset sequence — start condition . . . . . . . . . 107
3.19.5 External watchdog window. . . . . . . . . . . . . . . 108
3.20 AC timing characteristics . . . . . . . . . . . . . . . . . . . . . . 108
3.20.1 RESET pin characteristics . . . . . . . . . . . . . . . 109
3.20.2 WKUP/NMI timing . . . . . . . . . . . . . . . . . . . . . 110
3.20.3 IEEE 1149.1 JTAG interface timing . . . . . . . . 110
3.20.4 Nexus timing . . . . . . . . . . . . . . . . . . . . . . . . . 112
3.20.5 External interrupt timing (IRQ pin) . . . . . . . . . 115
3.20.6 DSPI timing . . . . . . . . . . . . . . . . . . . . . . . . . . 116
Package characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 121
4.1 Package mechanical data . . . . . . . . . . . . . . . . . . . . . 121
Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126
Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . 127
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6
MPC5643L Microcontroller Data Sheet, Rev. 8.1
2
Freescale Semiconductor
Introduction
1
1.1
Introduction
Document overview
This document describes the features of the family and options available within the family members, and highlights important
electrical and physical characteristics of the devices.
This document provides electrical specifications, pin assignments, and package diagrams for the MPC5643L series of
microcontroller units (MCUs). For functional characteristics, see the
MPC5643L Microcontroller Reference Manual.
For use
of the MPC5643L in a fail-safe system according to safety standard IEC 61508, see the
Safety Application Guide for
MPC5643L.
1.2
Description
The MPC5643L series microcontrollers are system-on-chip devices that are built on Power Architecture technology and contain
enhancements that improve the architecture’s fit in embedded applications, include additional instruction support for digital
signal processing (DSP) and integrate technologies such as an enhanced time processor unit, enhanced queued analog-to-digital
converter, Controller Area Network, and an enhanced modular input-output system.
The MPC5643L family of 32-bit microcontrollers is the latest achievement in integrated automotive application controllers. It
belongs to an expanding range of automotive-focused products designed to address electrical hydraulic power steering (EHPS),
electric power steering (EPS) and airbag applications. The advanced and cost-efficient host processor core of the MPC5643L
automotive controller family complies with the Power Architecture embedded category. It operates at speeds as high as
120 MHz and offers high-performance processing optimized for low power consumption. It capitalizes on the available
development infrastructure of current Power Architecture devices and is supported with software drivers, operating systems and
configuration code to assist with users’ implementations.
1.3
Device comparison
Table 1. MPC5643L device summary
Feature
CPU
Type
Architecture
Execution speed
DMIPS intrinsic performance
SIMD (DSP + FPU)
MMU
Instruction set PPC
Instruction set VLE
Instruction cache
MPU-16 regions
Semaphore unit (SEMA4)
Buses
Core bus
Internal periphery bus
MPC5643L
2 × e200z4
(in lock-step or decoupled operation)
Harvard
0–120 MHz (+2% FM)
>240 MIPS
Yes
16 entry
Yes
Yes
4 KB, EDC
Yes, replicated module
Yes
AHB, 32-bit address, 64-bit data
32-bit address, 32-bit data
MPC5643L Microcontroller Data Sheet, Rev. 8.1
Freescale Semiconductor
3
Introduction
Table 1. MPC5643L device summary (continued)
Feature
Crossbar
Memory
Master × slave ports
Flash
Static RAM (SRAM)
Modules
Interrupt Controller (INTC)
Periodic Interrupt Timer (PIT)
System Timer Module (STM)
Software Watchdog Timer (SWT)
eDMA
FlexRay
FlexCAN
LINFlexD (UART and LIN with DMA support)
Clock out
Fault Collection and Control Unit (FCCU)
Cross Triggering Unit (CTU)
eTimer
FlexPWM
Analog-to-Digital Converter (ADC)
Sine Wave Generator (SWG)
Modules
(cont.)
Deserial Serial Peripheral Interface (DSPI)
Cyclic Redundancy Checker (CRC) unit
Junction temperature sensor (TSENS)
Digital I/Os
Supply
Device power supply
Analog reference voltage
Clocking
Frequency-modulated phase-locked loop (FMPLL)
Internal RC oscillator
External crystal oscillator
Debug
Nexus
MPC5643L
Lock Step Mode: 4 × 3
Decoupled Parallel Mode: 6 × 3
1 MB, ECC, RWW
128 KB, ECC
16 interrupt levels, replicated module
1 × 4 channels
1 × 4 channels, replicated module
Yes, replicated module
16 channels, replicated module
1 × 64 message buffers, dual channel
2 × 32 message buffers
2
Yes
Yes
Yes
3 × 6 channels
1
2 Module 4 × (2 + 1) channels
2
2 × 12-bit ADC, 16 channels per ADC
(3 internal, 4 shared and 9 external)
32 point
3 × DSPI
as many as 8 chip selects
Yes
Yes, replicated module
16
3.3 V with integrated bypassable ballast transistor
External ballast transistor not needed for bare die
3.0 V – 3.6 V and 4.5 V – 5.5 V
2
16 MHz
4 – 40 MHz
Level 3+
MPC5643L Microcontroller Data Sheet, Rev. 8.1
4
Freescale Semiconductor
Introduction
Table 1. MPC5643L device summary (continued)
Feature
Packages
Known Good Die (KGD)
LQFP
MAPBGA
Temperature
Temperature range (junction)
Ambient temperature range using external ballast
transistor (LQFP)
Ambient temperature range using external ballast
transistor (BGA)
1
MPC5643L
Yes
144 pins
257 MAPBGA
–40 to 150
°
C
–40 to 125
°
C
–40 to 125
°
C
The third eTimer (eTimer_2) is available with external I/O access only in the BGA package, on the LQFP package
eTimer_2 is available internally only without any external I/O access.
2
The second FlexPWM module is available only in the BGA package.
1.4
Block diagram
Figure 1
shows a top-level block diagram of the MPC5643L device.
MPC5643L Microcontroller Data Sheet, Rev. 8.1
Freescale Semiconductor
5
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