SOIC-24, Tube
| 参数名称 | 属性值 |
| Brand Name | Integrated Device Technology |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | IDT (Integrated Device Technology) |
| 零件包装代码 | SOIC |
| 包装说明 | SOP, SOP24,.4 |
| 针数 | 24 |
| 制造商包装代码 | PS24 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | EAR99 |
| 最长访问时间 | 10 ns |
| 最大时钟频率 (fCLK) | 66.7 MHz |
| 周期时间 | 15 ns |
| JESD-30 代码 | R-PDSO-G24 |
| JESD-609代码 | e0 |
| 内存密度 | 64 bit |
| 内存集成电路类型 | OTHER FIFO |
| 内存宽度 | 1 |
| 湿度敏感等级 | 1 |
| 功能数量 | 1 |
| 端子数量 | 24 |
| 字数 | 64 words |
| 字数代码 | 64 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 64X1 |
| 可输出 | YES |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP24,.4 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 并行/串行 | SERIAL |
| 峰值回流温度（摄氏度） | 225 |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 最大待机电流 | 0.08 A |
| 最大压摆率 | 0.08 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 72423L15SO | 72203L12SO | 72203L15SO | 72213L15SO | 72203L12TP | 72213L12TP | 72423L12TP | |
|---|---|---|---|---|---|---|---|
| 描述 | SOIC-24, Tube | SOIC-24, Tube | SOIC-24, Tube | SOIC-24, Tube | FIFO, 256X1, 8ns, Synchronous, CMOS, PDIP24 | FIFO, 512X1, 8ns, Synchronous, CMOS, PDIP24 | FIFO, 64X1, 8ns, Synchronous, CMOS, PDIP24 |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
| 包装说明 | SOP, SOP24,.4 | SOP, SOP24,.4 | SOP, SOP24,.4 | SOIC-24 | DIP, DIP24,.3 | DIP, DIP24,.3 | DIP, DIP24,.3 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | _compli | _compli | _compli |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 10 ns | 8 ns | 10 ns | 10 ns | 8 ns | 8 ns | 8 ns |
| 最大时钟频率 (fCLK) | 66.7 MHz | 83.3 MHz | 66.7 MHz | 66.7 MHz | 83.3 MHz | 83.3 MHz | 83.3 MHz |
| 周期时间 | 15 ns | 12 ns | 15 ns | 15 ns | 12 ns | 12 ns | 12 ns |
| JESD-30 代码 | R-PDSO-G24 | R-PDSO-G24 | R-PDSO-G24 | R-PDSO-G24 | R-PDIP-T24 | R-PDIP-T24 | R-PDIP-T24 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 内存密度 | 64 bit | 256 bit | 256 bit | 512 bit | 256 bi | 512 bi | 64 bi |
| 内存集成电路类型 | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO |
| 内存宽度 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 24 | 24 | 24 | 24 | 24 | 24 | 24 |
| 字数 | 64 words | 256 words | 256 words | 512 words | 256 words | 512 words | 64 words |
| 字数代码 | 64 | 256 | 256 | 512 | 256 | 512 | 64 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 64X1 | 256X1 | 256X1 | 512X1 | 256X1 | 512X1 | 64X1 |
| 可输出 | YES | YES | YES | YES | YES | YES | YES |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | SOP | SOP | SOP | DIP | DIP | DIP |
| 封装等效代码 | SOP24,.4 | SOP24,.4 | SOP24,.4 | SOP24,.4 | DIP24,.3 | DIP24,.3 | DIP24,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | IN-LINE | IN-LINE |
| 并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| 峰值回流温度（摄氏度） | 225 | 225 | 225 | 225 | 225 | 225 | 225 |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大待机电流 | 0.08 A | 0.08 A | 0.08 A | 0.08 A | 0.08 A | 0.08 A | 0.08 A |
| 最大压摆率 | 0.08 mA | 0.08 mA | 0.08 mA | 0.08 mA | 0.08 mA | 0.08 mA | 0.08 mA |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | 30 | 30 | 30 |
| Brand Name | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | - | - | - |
| 零件包装代码 | SOIC | SOIC | SOIC | SOIC | - | - | - |
| 针数 | 24 | 24 | 24 | 24 | - | - | - |
| 制造商包装代码 | PS24 | PS24 | PS24 | PS24 | - | - | - |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | - | - | - |
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