RISC Microcontroller, 16-Bit, FLASH, F2MC-16F CPU, 32MHz, CMOS, PQFP64,
参数名称 | 属性值 |
是否Rohs认证 | 符合 |
厂商名称 | Cypress(赛普拉斯) |
Reach Compliance Code | compliant |
位大小 | 16 |
CPU系列 | F2MC-16F |
JESD-30 代码 | S-PQFP-G64 |
端子数量 | 64 |
最高工作温度 | 105 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | QFP |
封装等效代码 | QFP64,.55SQ |
封装形状 | SQUARE |
封装形式 | FLATPACK |
电源 | 3/5 V |
认证状态 | Not Qualified |
RAM(字节) | 4096 |
ROM(单词) | 33024 |
ROM可编程性 | FLASH |
速度 | 32 MHz |
最大压摆率 | 34 mA |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子形式 | GULL WING |
端子节距 | 0.635 mm |
端子位置 | QUAD |
uPs/uCs/外围集成电路类型 | MICROCONTROLLER, RISC |
MB96F673ABPMC-GSE1 | MB96F673ABPMC-GSE2 | MB96F673RBPMC-GSE2 | MB96F673RBPMC1-GSE2 | MB96F675ABPMC1-GSE1 | MB96F675RBPMC-GSE2 | |
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描述 | RISC Microcontroller, 16-Bit, FLASH, F2MC-16F CPU, 32MHz, CMOS, PQFP64, | RISC Microcontroller, 16-Bit, FLASH, F2MC-16F CPU, 32MHz, CMOS, PQFP64, | RISC Microcontroller, 16-Bit, FLASH, F2MC-16F CPU, 32MHz, CMOS, PQFP64, | RISC Microcontroller, 16-Bit, FLASH, F2MC-16F CPU, 32MHz, CMOS, PQFP64, | RISC Microcontroller, 16-Bit, FLASH, F2MC-16F CPU, 32MHz, CMOS, PQFP64, | RISC Microcontroller, 16-Bit, FLASH, F2MC-16F CPU, 32MHz, CMOS, PQFP64, |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
厂商名称 | Cypress(赛普拉斯) | Cypress(赛普拉斯) | Cypress(赛普拉斯) | Cypress(赛普拉斯) | Cypress(赛普拉斯) | Cypress(赛普拉斯) |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant |
位大小 | 16 | 16 | 16 | 16 | 16 | 16 |
CPU系列 | F2MC-16F | F2MC-16F | F2MC-16F | F2MC-16F | F2MC-16F | F2MC-16F |
JESD-30 代码 | S-PQFP-G64 | S-PQFP-G64 | S-PQFP-G64 | S-PQFP-G64 | S-PQFP-G64 | S-PQFP-G64 |
端子数量 | 64 | 64 | 64 | 64 | 64 | 64 |
最高工作温度 | 105 °C | 105 °C | 105 °C | 105 °C | 105 °C | 105 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | QFP | QFP | QFP | QFP | QFP | QFP |
封装等效代码 | QFP64,.55SQ | QFP64,.55SQ | QFP64,.55SQ | QFP64,.47SQ,20 | QFP64,.47SQ,20 | QFP64,.55SQ |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK |
电源 | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
RAM(字节) | 4096 | 4096 | 4096 | 4096 | 4096 | 4096 |
ROM(单词) | 33024 | 33024 | 33024 | 65792 | 65792 | 33024 |
ROM可编程性 | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH |
速度 | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
最大压摆率 | 34 mA | 34 mA | 34 mA | 34 mA | 34 mA | 34 mA |
表面贴装 | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 0.635 mm | 0.635 mm | 0.635 mm | 0.5 mm | 0.5 mm | 0.635 mm |
端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
uPs/uCs/外围集成电路类型 | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC |
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