3.3V 512K x 18 Pipelined burst Synchronous SRAM with NTD
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | ALSC [Alliance Semiconductor Corporation] |
零件包装代码 | QFP |
包装说明 | LQFP, QFP100,.63X.87 |
针数 | 100 |
Reach Compliance Code | unknow |
ECCN代码 | 3A991.B.2.A |
最长访问时间 | 4 ns |
其他特性 | PIPELINED ARCHITECTURE; LATE WRITE |
最大时钟频率 (fCLK) | 166 MHz |
I/O 类型 | COMMON |
JESD-30 代码 | R-PQFP-G100 |
JESD-609代码 | e0 |
长度 | 20 mm |
内存密度 | 9437184 bi |
内存集成电路类型 | ZBT SRAM |
内存宽度 | 18 |
功能数量 | 1 |
端子数量 | 100 |
字数 | 524288 words |
字数代码 | 512000 |
工作模式 | SYNCHRONOUS |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
组织 | 512KX18 |
输出特性 | 3-STATE |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | LQFP |
封装等效代码 | QFP100,.63X.87 |
封装形状 | RECTANGULAR |
封装形式 | FLATPACK, LOW PROFILE |
并行/串行 | PARALLEL |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | 2.5/3.3,3.3 V |
认证状态 | Not Qualified |
座面最大高度 | 1.6 mm |
最大待机电流 | 0.03 A |
最小待机电流 | 3.14 V |
最大压摆率 | 0.475 mA |
最大供电电压 (Vsup) | 3.465 V |
最小供电电压 (Vsup) | 3.135 V |
标称供电电压 (Vsup) | 3.3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING |
端子节距 | 0.65 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 14 mm |
AS7C33512NTD18A-166TQI | AS7C33512NTD18A | AS7C33512NTD18A-133TQC | AS7C33512NTD18A-133TQCN | AS7C33512NTD18A-133TQIN | AS7C33512NTD18A-133TQI | AS7C33512NTD18A-166TQCN | AS7C33512NTD18A-166TQC | AS7C33512NTD18A-166TQIN | |
---|---|---|---|---|---|---|---|---|---|
描述 | 3.3V 512K x 18 Pipelined burst Synchronous SRAM with NTD | 3.3V 512K x 18 Pipelined burst Synchronous SRAM with NTD | 3.3V 512K x 18 Pipelined burst Synchronous SRAM with NTD | 3.3V 512K x 18 Pipelined burst Synchronous SRAM with NTD | 3.3V 512K x 18 Pipelined burst Synchronous SRAM with NTD | 3.3V 512K x 18 Pipelined burst Synchronous SRAM with NTD | 3.3V 512K x 18 Pipelined burst Synchronous SRAM with NTD | 3.3V 512K x 18 Pipelined burst Synchronous SRAM with NTD | 3.3V 512K x 18 Pipelined burst Synchronous SRAM with NTD |
是否Rohs认证 | 不符合 | - | 不符合 | 符合 | 符合 | 不符合 | 符合 | 不符合 | 符合 |
厂商名称 | ALSC [Alliance Semiconductor Corporation] | - | ALSC [Alliance Semiconductor Corporation] | ALSC [Alliance Semiconductor Corporation] | ALSC [Alliance Semiconductor Corporation] | ALSC [Alliance Semiconductor Corporation] | ALSC [Alliance Semiconductor Corporation] | ALSC [Alliance Semiconductor Corporation] | ALSC [Alliance Semiconductor Corporation] |
零件包装代码 | QFP | - | QFP | QFP | QFP | QFP | QFP | QFP | QFP |
包装说明 | LQFP, QFP100,.63X.87 | - | LQFP, QFP100,.63X.87 | LQFP, QFP100,.63X.87 | LQFP, QFP100,.63X.87 | LQFP, QFP100,.63X.87 | LQFP, QFP100,.63X.87 | LQFP, QFP100,.63X.87 | LQFP, QFP100,.63X.87 |
针数 | 100 | - | 100 | 100 | 100 | 100 | 100 | 100 | 100 |
Reach Compliance Code | unknow | - | unknow | unknow | unknow | unknow | unknow | unknow | unknow |
ECCN代码 | 3A991.B.2.A | - | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A |
最长访问时间 | 4 ns | - | 4.5 ns | 4.5 ns | 4.5 ns | 4.5 ns | 4 ns | 4 ns | 4 ns |
其他特性 | PIPELINED ARCHITECTURE; LATE WRITE | - | PIPELINED ARCHITECTURE; LATE WRITE | PIPELINED ARCHITECTURE; LATE WRITE | PIPELINED ARCHITECTURE; LATE WRITE | PIPELINED ARCHITECTURE; LATE WRITE | PIPELINED ARCHITECTURE; LATE WRITE | PIPELINED ARCHITECTURE; LATE WRITE | PIPELINED ARCHITECTURE; LATE WRITE |
最大时钟频率 (fCLK) | 166 MHz | - | 133 MHz | 133 MHz | 133 MHz | 133 MHz | 166 MHz | 166 MHz | 166 MHz |
I/O 类型 | COMMON | - | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
JESD-30 代码 | R-PQFP-G100 | - | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 |
JESD-609代码 | e0 | - | e0 | e3 | e3 | e0 | e3 | e0 | e3 |
长度 | 20 mm | - | 20 mm | 20 mm | 20 mm | 20 mm | 20 mm | 20 mm | 20 mm |
内存密度 | 9437184 bi | - | 9437184 bi | 9437184 bi | 9437184 bi | 9437184 bi | 9437184 bi | 9437184 bi | 9437184 bi |
内存集成电路类型 | ZBT SRAM | - | ZBT SRAM | ZBT SRAM | ZBT SRAM | ZBT SRAM | ZBT SRAM | ZBT SRAM | ZBT SRAM |
内存宽度 | 18 | - | 18 | 18 | 18 | 18 | 18 | 18 | 18 |
功能数量 | 1 | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 100 | - | 100 | 100 | 100 | 100 | 100 | 100 | 100 |
字数 | 524288 words | - | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words |
字数代码 | 512000 | - | 512000 | 512000 | 512000 | 512000 | 512000 | 512000 | 512000 |
工作模式 | SYNCHRONOUS | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | 85 °C | - | 70 °C | 70 °C | 85 °C | 85 °C | 70 °C | 70 °C | 85 °C |
组织 | 512KX18 | - | 512KX18 | 512KX18 | 512KX18 | 512KX18 | 512KX18 | 512KX18 | 512KX18 |
输出特性 | 3-STATE | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | LQFP | - | LQFP | LQFP | LQFP | LQFP | LQFP | LQFP | LQFP |
封装等效代码 | QFP100,.63X.87 | - | QFP100,.63X.87 | QFP100,.63X.87 | QFP100,.63X.87 | QFP100,.63X.87 | QFP100,.63X.87 | QFP100,.63X.87 | QFP100,.63X.87 |
封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | FLATPACK, LOW PROFILE | - | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE |
并行/串行 | PARALLEL | - | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
峰值回流温度(摄氏度) | NOT SPECIFIED | - | NOT SPECIFIED | 245 | 245 | NOT SPECIFIED | 245 | NOT SPECIFIED | 245 |
电源 | 2.5/3.3,3.3 V | - | 2.5/3.3,3.3 V | 2.5/3.3,3.3 V | 2.5/3.3,3.3 V | 2.5/3.3,3.3 V | 2.5/3.3,3.3 V | 2.5/3.3,3.3 V | 2.5/3.3,3.3 V |
认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.6 mm | - | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm |
最大待机电流 | 0.03 A | - | 0.03 A | 0.03 A | 0.03 A | 0.03 A | 0.03 A | 0.03 A | 0.03 A |
最小待机电流 | 3.14 V | - | 3.14 V | 3.14 V | 3.14 V | 3.14 V | 3.14 V | 3.14 V | 3.14 V |
最大压摆率 | 0.475 mA | - | 0.4 mA | 0.4 mA | 0.4 mA | 0.4 mA | 0.475 mA | 0.475 mA | 0.475 mA |
最大供电电压 (Vsup) | 3.465 V | - | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V |
最小供电电压 (Vsup) | 3.135 V | - | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V |
标称供电电压 (Vsup) | 3.3 V | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | YES | - | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | - | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | MATTE TIN | MATTE TIN | Tin/Lead (Sn/Pb) | MATTE TIN | Tin/Lead (Sn/Pb) | MATTE TIN |
端子形式 | GULL WING | - | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 0.65 mm | - | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm |
端子位置 | QUAD | - | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | NOT SPECIFIED | 30 | 30 | NOT SPECIFIED | 30 | NOT SPECIFIED | 30 |
宽度 | 14 mm | - | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm |
电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved