Flash PLD, 6ns, 32-Cell, CMOS, PQCC44, 16.50 X 16.50 MM, 1.27 MM PITCH, PLASTIC, LCC-44
参数名称 | 属性值 |
是否Rohs认证 | 符合 |
厂商名称 | XILINX(赛灵思) |
零件包装代码 | LCC |
包装说明 | 16.50 X 16.50 MM, 1.27 MM PITCH, PLASTIC, LCC-44 |
针数 | 44 |
Reach Compliance Code | unknown |
其他特性 | REAL DIGITAL DESIGN TECHNOLOGY |
系统内可编程 | YES |
JESD-30 代码 | S-PQCC-J44 |
JESD-609代码 | e3 |
JTAG BST | YES |
长度 | 16.5862 mm |
湿度敏感等级 | 3 |
专用输入次数 | 1 |
I/O 线路数量 | 33 |
宏单元数 | 32 |
端子数量 | 44 |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 1 DEDICATED INPUTS, 33 I/O |
输出函数 | MACROCELL |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | QCCJ |
封装等效代码 | LDCC44,.7SQ |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER |
峰值回流温度(摄氏度) | 245 |
电源 | 1.5/3.3,1.8 V |
可编程逻辑类型 | FLASH PLD |
传播延迟 | 6 ns |
认证状态 | Not Qualified |
座面最大高度 | 4.572 mm |
最大供电电压 | 1.9 V |
最小供电电压 | 1.7 V |
标称供电电压 | 1.8 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | Matte Tin (Sn) |
端子形式 | J BEND |
端子节距 | 1.27 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | 40 |
宽度 | 16.5862 mm |
XC2C32-6PCG44C | XC2C32-3PCG44C | XC2C32-4PCG44C | XC2C32-6PCG44I | XC2C32-3CPG56C | XC2C32-4CPG56C | XC2C32-6CPG56C | XC2C32-6CPG56I | |
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描述 | Flash PLD, 6ns, 32-Cell, CMOS, PQCC44, 16.50 X 16.50 MM, 1.27 MM PITCH, PLASTIC, LCC-44 | Flash PLD, 3ns, 32-Cell, CMOS, PQCC44, 16.50 X 16.50 MM, 1.27 MM PITCH, PLASTIC, LCC-44 | Flash PLD, 4ns, 32-Cell, CMOS, PQCC44, 16.50 X 16.50 MM, 1.27 MM PITCH, PLASTIC, LCC-44 | Flash PLD, 6ns, 32-Cell, CMOS, PQCC44, 16.50 X 16.50 MM, 1.27 MM PITCH, PLASTIC, LCC-44 | Flash PLD, 3ns, 32-Cell, CMOS, PBGA56, 6 X 6 MM, 0.50 MM PITCH, CSP-56 | Flash PLD, 4ns, 32-Cell, CMOS, PBGA56, 6 X 6 MM, 0.50 MM PITCH, CSP-56 | Flash PLD, 6ns, 32-Cell, CMOS, PBGA56, 6 X 6 MM, 0.50 MM PITCH, CSP-56 | Flash PLD, 6ns, 32-Cell, CMOS, PBGA56, 6 X 6 MM, 0.50 MM PITCH, CSP-56 |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
厂商名称 | XILINX(赛灵思) | XILINX(赛灵思) | XILINX(赛灵思) | XILINX(赛灵思) | XILINX(赛灵思) | XILINX(赛灵思) | XILINX(赛灵思) | XILINX(赛灵思) |
零件包装代码 | LCC | LCC | LCC | LCC | BGA | BGA | BGA | BGA |
包装说明 | 16.50 X 16.50 MM, 1.27 MM PITCH, PLASTIC, LCC-44 | 16.50 X 16.50 MM, 1.27 MM PITCH, PLASTIC, LCC-44 | 16.50 X 16.50 MM, 1.27 MM PITCH, PLASTIC, LCC-44 | 16.50 X 16.50 MM, 1.27 MM PITCH, PLASTIC, LCC-44 | 6 X 6 MM, 0.50 MM PITCH, CSP-56 | 6 X 6 MM, 0.50 MM PITCH, CSP-56 | 6 X 6 MM, 0.50 MM PITCH, CSP-56 | 6 X 6 MM, 0.50 MM PITCH, CSP-56 |
针数 | 44 | 44 | 44 | 44 | 56 | 56 | 56 | 56 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
其他特性 | REAL DIGITAL DESIGN TECHNOLOGY | REAL DIGITAL DESIGN TECHNOLOGY | REAL DIGITAL DESIGN TECHNOLOGY | REAL DIGITAL DESIGN TECHNOLOGY | REAL DIGITAL DESIGN TECHNOLOGY | REAL DIGITAL DESIGN TECHNOLOGY | REAL DIGITAL DESIGN TECHNOLOGY | REAL DIGITAL DESIGN TECHNOLOGY |
系统内可编程 | YES | YES | YES | YES | YES | YES | YES | YES |
JESD-30 代码 | S-PQCC-J44 | S-PQCC-J44 | S-PQCC-J44 | S-PQCC-J44 | S-PBGA-B56 | S-PBGA-B56 | S-PBGA-B56 | S-PBGA-B56 |
JESD-609代码 | e3 | e3 | e3 | e3 | e1 | e1 | e1 | e1 |
JTAG BST | YES | YES | YES | YES | YES | YES | YES | YES |
长度 | 16.5862 mm | 16.5862 mm | 16.5862 mm | 16.5862 mm | 6 mm | 6 mm | 6 mm | 6 mm |
湿度敏感等级 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
专用输入次数 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
I/O 线路数量 | 33 | 33 | 33 | 33 | 33 | 33 | 33 | 33 |
宏单元数 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
端子数量 | 44 | 44 | 44 | 44 | 56 | 56 | 56 | 56 |
最高工作温度 | 70 °C | 70 °C | 70 °C | 85 °C | 70 °C | 70 °C | 70 °C | 85 °C |
组织 | 1 DEDICATED INPUTS, 33 I/O | 1 DEDICATED INPUTS, 33 I/O | 1 DEDICATED INPUTS, 33 I/O | 1 DEDICATED INPUTS, 33 I/O | 1 DEDICATED INPUTS, 33 I/O | 1 DEDICATED INPUTS, 33 I/O | 1 DEDICATED INPUTS, 33 I/O | 1 DEDICATED INPUTS, 33 I/O |
输出函数 | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | QCCJ | QCCJ | QCCJ | QCCJ | LFBGA | LFBGA | LFBGA | LFBGA |
封装等效代码 | LDCC44,.7SQ | LDCC44,.7SQ | LDCC44,.7SQ | LDCC44,.7SQ | BGA56,10X10,20 | BGA56,10X10,20 | BGA56,10X10,20 | BGA56,10X10,20 |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH |
峰值回流温度(摄氏度) | 245 | 245 | 245 | 245 | 260 | 260 | 260 | 260 |
电源 | 1.5/3.3,1.8 V | 1.5/3.3,1.8 V | 1.5/3.3,1.8 V | 1.5/3.3,1.8 V | 1.5/3.3,1.8 V | 1.5/3.3,1.8 V | 1.5/3.3,1.8 V | 1.5/3.3,1.8 V |
可编程逻辑类型 | FLASH PLD | FLASH PLD | FLASH PLD | FLASH PLD | FLASH PLD | FLASH PLD | FLASH PLD | FLASH PLD |
传播延迟 | 6 ns | 3 ns | 4 ns | 6 ns | 3 ns | 4 ns | 6 ns | 6 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 4.572 mm | 4.572 mm | 4.572 mm | 4.572 mm | 1.35 mm | 1.35 mm | 1.35 mm | 1.35 mm |
最大供电电压 | 1.9 V | 1.9 V | 1.9 V | 1.9 V | 1.9 V | 1.9 V | 1.9 V | 1.9 V |
最小供电电压 | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V |
标称供电电压 | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL |
端子面层 | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) |
端子形式 | J BEND | J BEND | J BEND | J BEND | BALL | BALL | BALL | BALL |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
端子位置 | QUAD | QUAD | QUAD | QUAD | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
处于峰值回流温度下的最长时间 | 40 | 40 | 40 | 40 | 30 | 30 | 30 | 30 |
宽度 | 16.5862 mm | 16.5862 mm | 16.5862 mm | 16.5862 mm | 6 mm | 6 mm | 6 mm | 6 mm |
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