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Datasheet> 器件分类 > 可编程逻辑器件> 可编程逻辑> XC2C32-3PCG44C

XC2C32-3PCG44C: 产品描述Flash PLD, 3ns, 32-Cell, CMOS, PQCC44, 16.50 X 16.50 MM, 1.27 MM PITCH, PLASTIC, LCC-44; 产品类别可编程逻辑器件可编程逻辑; 文件大小260KB，共13页; 制造商XILINX(赛灵思); 官网地址https://www.xilinx.com/; 标准

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XC2C32-3PCG44C概述

Flash PLD, 3ns, 32-Cell, CMOS, PQCC44, 16.50 X 16.50 MM, 1.27 MM PITCH, PLASTIC, LCC-44

XC2C32-3PCG44C规格参数

参数名称	属性值
是否Rohs认证	符合
厂商名称	XILINX(赛灵思)
零件包装代码	LCC
包装说明	16.50 X 16.50 MM, 1.27 MM PITCH, PLASTIC, LCC-44
针数	44
Reach Compliance Code	unknown
其他特性	REAL DIGITAL DESIGN TECHNOLOGY
系统内可编程	YES
JESD-30 代码	S-PQCC-J44
JESD-609代码	e3
JTAG BST	YES
长度	16.5862 mm
湿度敏感等级	3
专用输入次数	1
I/O 线路数量	33
宏单元数	32
端子数量	44
最高工作温度	70 °C
最低工作温度
组织	1 DEDICATED INPUTS, 33 I/O
输出函数	MACROCELL
封装主体材料	PLASTIC/EPOXY
封装代码	QCCJ
封装等效代码	LDCC44,.7SQ
封装形状	SQUARE
封装形式	CHIP CARRIER
峰值回流温度（摄氏度）	245
电源	1.5/3.3,1.8 V
可编程逻辑类型	FLASH PLD
传播延迟	3 ns
认证状态	Not Qualified
座面最大高度	4.572 mm
最大供电电压	1.9 V
最小供电电压	1.7 V
标称供电电压	1.8 V
表面贴装	YES
技术	CMOS
温度等级	COMMERCIAL
端子面层	Matte Tin (Sn)
端子形式	J BEND
端子节距	1.27 mm
端子位置	QUAD
处于峰值回流温度下的最长时间	40
宽度	16.5862 mm

XC2C32-3PCG44C相似产品对比

	XC2C32-3PCG44C	XC2C32-4PCG44C	XC2C32-6PCG44I	XC2C32-3CPG56C	XC2C32-4CPG56C	XC2C32-6CPG56C	XC2C32-6CPG56I	XC2C32-6PCG44C
描述	Flash PLD, 3ns, 32-Cell, CMOS, PQCC44, 16.50 X 16.50 MM, 1.27 MM PITCH, PLASTIC, LCC-44	Flash PLD, 4ns, 32-Cell, CMOS, PQCC44, 16.50 X 16.50 MM, 1.27 MM PITCH, PLASTIC, LCC-44	Flash PLD, 6ns, 32-Cell, CMOS, PQCC44, 16.50 X 16.50 MM, 1.27 MM PITCH, PLASTIC, LCC-44	Flash PLD, 3ns, 32-Cell, CMOS, PBGA56, 6 X 6 MM, 0.50 MM PITCH, CSP-56	Flash PLD, 4ns, 32-Cell, CMOS, PBGA56, 6 X 6 MM, 0.50 MM PITCH, CSP-56	Flash PLD, 6ns, 32-Cell, CMOS, PBGA56, 6 X 6 MM, 0.50 MM PITCH, CSP-56	Flash PLD, 6ns, 32-Cell, CMOS, PBGA56, 6 X 6 MM, 0.50 MM PITCH, CSP-56	Flash PLD, 6ns, 32-Cell, CMOS, PQCC44, 16.50 X 16.50 MM, 1.27 MM PITCH, PLASTIC, LCC-44
是否Rohs认证	符合	符合	符合	符合	符合	符合	符合	符合
厂商名称	XILINX(赛灵思)	XILINX(赛灵思)	XILINX(赛灵思)	XILINX(赛灵思)	XILINX(赛灵思)	XILINX(赛灵思)	XILINX(赛灵思)	XILINX(赛灵思)
零件包装代码	LCC	LCC	LCC	BGA	BGA	BGA	BGA	LCC
包装说明	16.50 X 16.50 MM, 1.27 MM PITCH, PLASTIC, LCC-44	16.50 X 16.50 MM, 1.27 MM PITCH, PLASTIC, LCC-44	16.50 X 16.50 MM, 1.27 MM PITCH, PLASTIC, LCC-44	6 X 6 MM, 0.50 MM PITCH, CSP-56	6 X 6 MM, 0.50 MM PITCH, CSP-56	6 X 6 MM, 0.50 MM PITCH, CSP-56	6 X 6 MM, 0.50 MM PITCH, CSP-56	16.50 X 16.50 MM, 1.27 MM PITCH, PLASTIC, LCC-44
针数	44	44	44	56	56	56	56	44
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
其他特性	REAL DIGITAL DESIGN TECHNOLOGY	REAL DIGITAL DESIGN TECHNOLOGY	REAL DIGITAL DESIGN TECHNOLOGY	REAL DIGITAL DESIGN TECHNOLOGY	REAL DIGITAL DESIGN TECHNOLOGY	REAL DIGITAL DESIGN TECHNOLOGY	REAL DIGITAL DESIGN TECHNOLOGY	REAL DIGITAL DESIGN TECHNOLOGY
系统内可编程	YES	YES	YES	YES	YES	YES	YES	YES
JESD-30 代码	S-PQCC-J44	S-PQCC-J44	S-PQCC-J44	S-PBGA-B56	S-PBGA-B56	S-PBGA-B56	S-PBGA-B56	S-PQCC-J44
JESD-609代码	e3	e3	e3	e1	e1	e1	e1	e3
JTAG BST	YES	YES	YES	YES	YES	YES	YES	YES
长度	16.5862 mm	16.5862 mm	16.5862 mm	6 mm	6 mm	6 mm	6 mm	16.5862 mm
湿度敏感等级	3	3	3	3	3	3	3	3
专用输入次数	1	1	1	1	1	1	1	1
I/O 线路数量	33	33	33	33	33	33	33	33
宏单元数	32	32	32	32	32	32	32	32
端子数量	44	44	44	56	56	56	56	44
最高工作温度	70 °C	70 °C	85 °C	70 °C	70 °C	70 °C	85 °C	70 °C
组织	1 DEDICATED INPUTS, 33 I/O	1 DEDICATED INPUTS, 33 I/O	1 DEDICATED INPUTS, 33 I/O	1 DEDICATED INPUTS, 33 I/O	1 DEDICATED INPUTS, 33 I/O	1 DEDICATED INPUTS, 33 I/O	1 DEDICATED INPUTS, 33 I/O	1 DEDICATED INPUTS, 33 I/O
输出函数	MACROCELL	MACROCELL	MACROCELL	MACROCELL	MACROCELL	MACROCELL	MACROCELL	MACROCELL
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	QCCJ	QCCJ	QCCJ	LFBGA	LFBGA	LFBGA	LFBGA	QCCJ
封装等效代码	LDCC44,.7SQ	LDCC44,.7SQ	LDCC44,.7SQ	BGA56,10X10,20	BGA56,10X10,20	BGA56,10X10,20	BGA56,10X10,20	LDCC44,.7SQ
封装形状	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
封装形式	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	CHIP CARRIER
峰值回流温度（摄氏度）	245	245	245	260	260	260	260	245
电源	1.5/3.3,1.8 V	1.5/3.3,1.8 V	1.5/3.3,1.8 V	1.5/3.3,1.8 V	1.5/3.3,1.8 V	1.5/3.3,1.8 V	1.5/3.3,1.8 V	1.5/3.3,1.8 V
可编程逻辑类型	FLASH PLD	FLASH PLD	FLASH PLD	FLASH PLD	FLASH PLD	FLASH PLD	FLASH PLD	FLASH PLD
传播延迟	3 ns	4 ns	6 ns	3 ns	4 ns	6 ns	6 ns	6 ns
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	4.572 mm	4.572 mm	4.572 mm	1.35 mm	1.35 mm	1.35 mm	1.35 mm	4.572 mm
最大供电电压	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V
最小供电电压	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V
标称供电电压	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	COMMERCIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL
端子面层	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Matte Tin (Sn)
端子形式	J BEND	J BEND	J BEND	BALL	BALL	BALL	BALL	J BEND
端子节距	1.27 mm	1.27 mm	1.27 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	1.27 mm
端子位置	QUAD	QUAD	QUAD	BOTTOM	BOTTOM	BOTTOM	BOTTOM	QUAD
处于峰值回流温度下的最长时间	40	40	40	30	30	30	30	40
宽度	16.5862 mm	16.5862 mm	16.5862 mm	6 mm	6 mm	6 mm	6 mm	16.5862 mm

XC2C32-3PCG44C

XC2C32-3PCG44C概述

XC2C32-3PCG44C规格参数

XC2C32-3PCG44C相似产品对比

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