TLCS-Z80 MPU : 8-BIT MICROPROCESSOR
| TMPZ84C00A | TMPZ84C00AT-8 | TMPZ84C00AP-8 | TMPZ84C00AP-6 | TMPZ84C00AM-6 | TMPZ84C00AM-8 | |
|---|---|---|---|---|---|---|
| 描述 | TLCS-Z80 MPU : 8-BIT MICROPROCESSOR | TLCS-Z80 MPU : 8-BIT MICROPROCESSOR | TLCS-Z80 MPU : 8-BIT MICROPROCESSOR | TLCS-Z80 MPU : 8-BIT MICROPROCESSOR | TLCS-Z80 MPU : 8-BIT MICROPROCESSOR | TLCS-Z80 MPU : 8-BIT MICROPROCESSOR |
| 是否Rohs认证 | - | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | - | Toshiba(东芝) | Toshiba(东芝) | Toshiba(东芝) | Toshiba(东芝) | Toshiba(东芝) |
| 零件包装代码 | - | LCC | DIP | DIP | SSOP | SSOP |
| 包装说明 | - | QCCJ, | DIP, | DIP, | SSOP, | SSOP, |
| 针数 | - | 44 | 40 | 40 | 40 | 40 |
| Reach Compliance Code | - | unknow | unknow | unknow | unknow | unknow |
| 其他特性 | - | BUILT-IN REFRESH CIRCUIT FOR DYNAMIC MEMORY | BUILT-IN REFRESH CIRCUIT FOR DYNAMIC MEMORY | BUILT-IN REFRESH CIRCUIT FOR DYNAMIC MEMORY | BUILT-IN REFRESH CIRCUIT FOR DYNAMIC MEMORY | BUILT-IN REFRESH CIRCUIT FOR DYNAMIC MEMORY |
| 地址总线宽度 | - | 16 | 16 | 16 | 16 | 16 |
| 位大小 | - | 8 | 8 | 8 | 8 | 8 |
| 边界扫描 | - | NO | NO | NO | NO | NO |
| 最大时钟频率 | - | 8 MHz | 8 MHz | 6 MHz | 6 MHz | 8 MHz |
| 外部数据总线宽度 | - | 8 | 8 | 8 | 8 | 8 |
| 格式 | - | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT |
| 集成缓存 | - | NO | NO | NO | NO | NO |
| JESD-30 代码 | - | S-PQCC-J44 | R-PDIP-T40 | R-PDIP-T40 | R-PDSO-G40 | R-PDSO-G40 |
| JESD-609代码 | - | e0 | e0 | e0 | e0 | e0 |
| 长度 | - | 16.6 mm | 50.7 mm | 50.7 mm | 17.5 mm | 17.5 mm |
| 低功率模式 | - | YES | YES | YES | YES | YES |
| 外部中断装置数量 | - | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | - | 44 | 40 | 40 | 40 | 40 |
| 最高工作温度 | - | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | - | QCCJ | DIP | DIP | SSOP | SSOP |
| 封装形状 | - | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | - | CHIP CARRIER | IN-LINE | IN-LINE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH |
| 峰值回流温度(摄氏度) | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | - | 4.52 mm | 4.8 mm | 4.8 mm | 2.8 mm | 2.8 mm |
| 速度 | - | 8 MHz | 8 MHz | 6 MHz | 6 MHz | 8 MHz |
| 最大压摆率 | - | 25 mA | 25 mA | 22 mA | 22 mA | 25 mA |
| 最大供电电压 | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 | - | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 | - | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | - | YES | NO | NO | YES | YES |
| 技术 | - | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | - | J BEND | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING |
| 端子节距 | - | 1.27 mm | 2.54 mm | 2.54 mm | 0.8 mm | 0.8 mm |
| 端子位置 | - | QUAD | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | - | 16.6 mm | 15.24 mm | 15.24 mm | 8.8 mm | 8.8 mm |
| uPs/uCs/外围集成电路类型 | - | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR |
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