Digital Signal Processors & Controllers - DSP, DSC DSP for Embedded V90 Modem Solution
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 零件包装代码 | BGA |
| 包装说明 | LFBGA, BGA144,13X13,32 |
| 针数 | 144 |
| Reach Compliance Code | _compli |
| Factory Lead Time | 1 week |
| Is Samacsys | N |
| 其他特性 | ALSO REQUIRES 3.3V SUPPLY |
| 地址总线宽度 | 23 |
| 桶式移位器 | NO |
| 位大小 | 16 |
| 边界扫描 | YES |
| 最大时钟频率 | 14.7456 MHz |
| 外部数据总线宽度 | 16 |
| 格式 | FIXED POINT |
| 内部总线架构 | MULTIPLE |
| JESD-30 代码 | S-PBGA-B144 |
| 长度 | 12 mm |
| 低功率模式 | YES |
| 端子数量 | 144 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | LFBGA |
| 封装等效代码 | BGA144,13X13,32 |
| 封装形状 | SQUARE |
| 封装形式 | GRID ARRAY, LOW PROFILE, FINE PITCH |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 1.5,3/3.3,5 V |
| 认证状态 | Not Qualified |
| RAM（字数） | 40960 |
| 座面最大高度 | 1.4 mm |
| 最大供电电压 | 1.65 V |
| 最小供电电压 | 1.42 V |
| 标称供电电压 | 1.5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | OTHER |
| 端子形式 | BALL |
| 端子节距 | 0.8 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 12 mm |
| uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, OTHER |
| Base Number Matches | 1 |
| TMS320C54V90GGU | SI3016-KSR | TMS320C54V90APGE | TMS320C54V90AGGU | TMS320C54V90BGGU | TMS320C54V90PGE | TMS320C54V90BPGE | |
|---|---|---|---|---|---|---|---|
| 描述 | Digital Signal Processors & Controllers - DSP, DSC DSP for Embedded V90 Modem Solution | Digital Signal Processors & Controllers - DSP, DSC DSP for Embedded V90 Modem Solution | Digital Signal Processors & Controllers - DSP, DSC DSP for Embedded V90 Modem Solution | Digital Signal Processors & Controllers - DSP, DSC DSP for Embedded V90 Modem Solution | Digital Signal Processors & Controllers - DSP, DSC DSP for Embedded V90 Modem Solution | Digital Signal Processors & Controllers - DSP, DSC DSP for Embedded V90 Modem Solution | DSP (DSP Only) for Embedded V90 Modem Solution [Not Recommended For New Designs (NRND)] 144-LQFP |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 不含铅 |
| 零件包装代码 | BGA | SOIC | QFP | BGA | BGA | QFP | QFP |
| 包装说明 | LFBGA, BGA144,13X13,32 | SOP, | LFQFP, QFP144,.87SQ,20 | LFBGA, BGA144,13X13,32 | LFBGA, BGA144,13X13,32 | LFQFP, QFP144,.87SQ,20 | LFQFP, QFP144,.87SQ,20 |
| 针数 | 144 | 16 | 144 | 144 | 144 | 144 | 144 |
| Reach Compliance Code | _compli | unknow | unknow | _compli | _compli | compli | compli |
| 其他特性 | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY |
| 地址总线宽度 | 23 | 23 | 23 | 23 | 23 | 23 | 23 |
| 桶式移位器 | NO | NO | NO | NO | NO | NO | NO |
| 边界扫描 | YES | YES | YES | YES | YES | YES | YES |
| 最大时钟频率 | 14.7456 MHz | 14.7456 MHz | 14.7456 MHz | 14.7456 MHz | 14.7456 MHz | 14.7456 MHz | 14.7456 MHz |
| 外部数据总线宽度 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 格式 | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT |
| 内部总线架构 | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE |
| JESD-30 代码 | S-PBGA-B144 | R-PDSO-G16 | S-PQFP-G144 | S-PBGA-B144 | S-PBGA-B144 | S-PQFP-G144 | S-PQFP-G144 |
| 长度 | 12 mm | 9.905 mm | 20 mm | 12 mm | 12 mm | 20 mm | 20 mm |
| 低功率模式 | YES | YES | YES | YES | YES | YES | YES |
| 端子数量 | 144 | 16 | 144 | 144 | 144 | 144 | 144 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LFBGA | SOP | LFQFP | LFBGA | LFBGA | LFQFP | LFQFP |
| 封装形状 | SQUARE | RECTANGULAR | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | GRID ARRAY, LOW PROFILE, FINE PITCH | SMALL OUTLINE | FLATPACK, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.4 mm | 1.75 mm | 1.6 mm | 1.4 mm | 1.4 mm | 1.6 mm | 1.6 mm |
| 最大供电电压 | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V |
| 最小供电电压 | 1.42 V | 1.42 V | 1.42 V | 1.42 V | 1.42 V | 1.42 V | 1.42 V |
| 标称供电电压 | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 端子形式 | BALL | GULL WING | GULL WING | BALL | BALL | GULL WING | GULL WING |
| 端子节距 | 0.8 mm | 1.27 mm | 0.5 mm | 0.8 mm | 0.8 mm | 0.5 mm | 0.5 mm |
| 端子位置 | BOTTOM | DUAL | QUAD | BOTTOM | BOTTOM | QUAD | QUAD |
| 宽度 | 12 mm | 3.9 mm | 20 mm | 12 mm | 12 mm | 20 mm | 20 mm |
| uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER |
| 是否Rohs认证 | 不符合 | - | 符合 | 不符合 | 不符合 | 符合 | 符合 |
| Factory Lead Time | 1 week | - | 1 week | 1 week | 1 week | 1 week | 6 weeks |
| 位大小 | 16 | - | 16 | 16 | 16 | 16 | 16 |
| 封装等效代码 | BGA144,13X13,32 | - | QFP144,.87SQ,20 | BGA144,13X13,32 | BGA144,13X13,32 | QFP144,.87SQ,20 | QFP144,.87SQ,20 |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | - | 260 | NOT SPECIFIED | 220 | 260 | 260 |
| 电源 | 1.5,3/3.3,5 V | - | 1.5,3/3.3,5 V | 1.5,3/3.3,5 V | 1.5,3/3.3,5 V | 1.5,3/3.3,5 V | 1.5,3/3.3,5 V |
| RAM（字数） | 40960 | - | 40960 | 40960 | 40960 | 40960 | 40960 |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 厂商名称 | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | - |
| JESD-609代码 | - | - | e4 | - | e0 | e4 | e4 |
| 湿度敏感等级 | - | - | 1 | - | 3 | 1 | 1 |
| 端子面层 | - | - | Nickel/Palladium/Gold (Ni/Pd/Au) | - | Tin/Lead (Sn/Pb) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
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