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TMS320C6727ZDH300

产品描述Digital Signal Processors & Controllers - DSP, DSC Floating-Pt Dig Sig Proc
产品类别嵌入式处理器和控制器    微控制器和处理器   
文件大小1MB,共114页
制造商Texas Instruments(德州仪器)
官网地址http://www.ti.com.cn/
标准
敬请期待 详细参数 选型对比

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TMS320C6727ZDH300概述

Digital Signal Processors & Controllers - DSP, DSC Floating-Pt Dig Sig Proc

TMS320C6727ZDH300规格参数

参数名称属性值
是否Rohs认证符合
厂商名称Texas Instruments(德州仪器)
零件包装代码BGA
包装说明BGA, BGA256,16X16,40
针数256
Reach Compliance Codeunknow
Factory Lead Time1 week
其他特性32 BIT FLOATING POINT; ALSO REQUIRES 3.3V SUPPLY
地址总线宽度32
桶式移位器NO
位大小32
边界扫描YES
最大时钟频率25 MHz
外部数据总线宽度32
格式FLOATING POINT
内部总线架构MULTIPLE
JESD-30 代码S-PBGA-B256
JESD-609代码e1
长度17 mm
低功率模式NO
湿度敏感等级3
端子数量256
封装主体材料PLASTIC/EPOXY
封装代码BGA
封装等效代码BGA256,16X16,40
封装形状SQUARE
封装形式GRID ARRAY
峰值回流温度(摄氏度)260
电源1.2,3.3 V
认证状态Not Qualified
RAM(字数)262144
座面最大高度2.02 mm
最大供电电压1.32 V
最小供电电压1.14 V
标称供电电压1.2 V
表面贴装YES
技术CMOS
端子面层Tin/Silver/Copper (Sn/Ag/Cu)
端子形式BALL
端子节距1 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度17 mm
uPs/uCs/外围集成电路类型DIGITAL SIGNAL PROCESSOR, OTHER

TMS320C6727ZDH300相似产品对比

TMS320C6727ZDH300 TMS320C6727GDH300 TMS320C6722RFPA225 TMS320C6726RFPA225 TMS320C6727GDH250 TMS320C6727GDHA250 TMS320C6727ZDH250 TMS320C6727ZDHA250 TMS320C6726RFP250 TMS320C6722RFP250
描述 Digital Signal Processors & Controllers - DSP, DSC Floating-Pt Dig Sig Proc Digital Signal Processors & Controllers - DSP, DSC Floating-Pt Dig Sig Proc IC FLOATING POINT DSP 144-HTQFP IC FLOATING POINT DSP 144-HTQFP IC FLOATING POINT DSP 256-BGA IC FLOATING POINT DSP 256-BGA IC FLOATING POINT DSP 256-BGA IC FLOATING POINT DSP 256-BGA IC FLOATING-POINT DSP 144-HTQFP IC FLOATING-POINT DSP 144-HTQFP
是否Rohs认证 符合 不符合 符合 符合 不符合 不符合 符合 符合 符合 不符合
厂商名称 Texas Instruments(德州仪器) Texas Instruments(德州仪器) Texas Instruments(德州仪器) Texas Instruments(德州仪器) Texas Instruments(德州仪器) Texas Instruments(德州仪器) Texas Instruments(德州仪器) Texas Instruments(德州仪器) Texas Instruments(德州仪器) Texas Instruments(德州仪器)
零件包装代码 BGA BGA QFP QFP BGA BGA BGA BGA QFP QFP
包装说明 BGA, BGA256,16X16,40 BGA, BGA256,16X16,40 HTFQFP, TQFP144,.9SQ HTFQFP, TQFP144,.9SQ BGA, BGA256,16X16,40 BGA, BGA256,16X16,40 BGA, BGA256,16X16,40 BGA, BGA256,16X16,40 HTFQFP, TQFP144,.9SQ HTFQFP, TQFP144,.9SQ
针数 256 256 144 144 256 256 256 256 144 144
Reach Compliance Code unknow _compli unknown unknown not_compliant not_compliant unknown unknown unknown not_compliant
其他特性 32 BIT FLOATING POINT; ALSO REQUIRES 3.3V SUPPLY 32 BIT FLOATING POINT; ALSO REQUIRES 3.3V SUPPLY 32 BIT FLOATING POINT; ALSO REQUIRES 3.3V SUPPLY 32 BIT FLOATING POINT; ALSO REQUIRES 3.3V SUPPLY 32 BIT FLOATING POINT; ALSO REQUIRES 3.3V SUPPLY 32 BIT FLOATING POINT; ALSO REQUIRES 3.3V SUPPLY 32 BIT FLOATING POINT; ALSO REQUIRES 3.3V SUPPLY 32 BIT FLOATING POINT; ALSO REQUIRES 3.3V SUPPLY 32 BIT FLOATING POINT; ALSO REQUIRES 3.3V SUPPLY 32 BIT FLOATING POINT; ALSO REQUIRES 3.3V SUPPLY
地址总线宽度 32 32 32 32 32 32 32 32 32 32
桶式移位器 NO NO NO NO NO NO NO NO NO NO
位大小 32 32 32 32 32 32 32 32 32 32
边界扫描 YES YES YES YES YES YES YES YES YES YES
最大时钟频率 25 MHz 25 MHz 25 MHz 25 MHz 25 MHz 25 MHz 25 MHz 25 MHz 25 MHz 25 MHz
外部数据总线宽度 32 32 32 32 32 32 32 32 32 32
格式 FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT
内部总线架构 MULTIPLE MULTIPLE MULTIPLE MULTIPLE MULTIPLE MULTIPLE MULTIPLE MULTIPLE MULTIPLE MULTIPLE
JESD-30 代码 S-PBGA-B256 S-PBGA-B256 S-PQFP-G144 S-PQFP-G144 S-PBGA-B256 S-PBGA-B256 S-PBGA-B256 S-PBGA-B256 S-PQFP-G144 S-PQFP-G144
长度 17 mm 17 mm 20 mm 20 mm 17 mm 17 mm 17 mm 17 mm 20 mm 20 mm
低功率模式 NO NO NO NO NO NO NO NO NO NO
端子数量 256 256 144 144 256 256 256 256 144 144
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 BGA BGA HTFQFP HTFQFP BGA BGA BGA BGA HTFQFP HTFQFP
封装等效代码 BGA256,16X16,40 BGA256,16X16,40 TQFP144,.9SQ TQFP144,.9SQ BGA256,16X16,40 BGA256,16X16,40 BGA256,16X16,40 BGA256,16X16,40 TQFP144,.9SQ TQFP144,.9SQ
封装形状 SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
封装形式 GRID ARRAY GRID ARRAY FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
峰值回流温度(摄氏度) 260 NOT SPECIFIED 260 260 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED 260 NOT SPECIFIED
电源 1.2,3.3 V 1.2,3.3 V 1.2,3.3 V 1.2,3.3 V 1.2,3.3 V 1.2,3.3 V 1.2,3.3 V 1.2,3.3 V 1.2,3.3 V 1.2,3.3 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
RAM(字数) 262144 262144 262144 262144 262144 262144 262144 262144 262144 262144
座面最大高度 2.02 mm 2.02 mm 1.2 mm 1.2 mm 2.02 mm 2.02 mm 2.02 mm 2.02 mm 1.2 mm 1.2 mm
最大供电电压 1.32 V 1.32 V 1.32 V 1.32 V 1.32 V 1.32 V 1.32 V 1.32 V 1.32 V 1.32 V
最小供电电压 1.14 V 1.14 V 1.14 V 1.14 V 1.14 V 1.14 V 1.14 V 1.14 V 1.14 V 1.14 V
标称供电电压 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V
表面贴装 YES YES YES YES YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
端子形式 BALL BALL GULL WING GULL WING BALL BALL BALL BALL GULL WING GULL WING
端子节距 1 mm 1 mm 0.5 mm 0.5 mm 1 mm 1 mm 1 mm 1 mm 0.5 mm 0.5 mm
端子位置 BOTTOM BOTTOM QUAD QUAD BOTTOM BOTTOM BOTTOM BOTTOM QUAD QUAD
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
宽度 17 mm 17 mm 20 mm 20 mm 17 mm 17 mm 17 mm 17 mm 20 mm 20 mm
uPs/uCs/外围集成电路类型 DIGITAL SIGNAL PROCESSOR, OTHER DIGITAL SIGNAL PROCESSOR, OTHER DIGITAL SIGNAL PROCESSOR, OTHER DIGITAL SIGNAL PROCESSOR, OTHER DIGITAL SIGNAL PROCESSOR, OTHER DIGITAL SIGNAL PROCESSOR, OTHER DIGITAL SIGNAL PROCESSOR, OTHER DIGITAL SIGNAL PROCESSOR, OTHER DIGITAL SIGNAL PROCESSOR, OTHER DIGITAL SIGNAL PROCESSOR, OTHER

 
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