TMS320C6726RFP250概述

IC FLOATING-POINT DSP 144-HTQFP

TMS320C6726RFP250规格参数

参数名称	属性值
是否Rohs认证	符合
厂商名称	Texas Instruments(德州仪器)
零件包装代码	QFP
包装说明	HTFQFP, TQFP144,.9SQ
针数	144
Reach Compliance Code	unknown
Factory Lead Time	1 week
其他特性	32 BIT FLOATING POINT; ALSO REQUIRES 3.3V SUPPLY
地址总线宽度	32
桶式移位器	NO
位大小	32
边界扫描	YES
最大时钟频率	25 MHz
外部数据总线宽度	32
格式	FLOATING POINT
内部总线架构	MULTIPLE
JESD-30 代码	S-PQFP-G144
JESD-609代码	e4
长度	20 mm
低功率模式	NO
湿度敏感等级	4
端子数量	144
封装主体材料	PLASTIC/EPOXY
封装代码	HTFQFP
封装等效代码	TQFP144,.9SQ
封装形状	SQUARE
封装形式	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
峰值回流温度（摄氏度）	260
电源	1.2,3.3 V
认证状态	Not Qualified
RAM（字数）	262144
座面最大高度	1.2 mm
最大供电电压	1.32 V
最小供电电压	1.14 V
标称供电电压	1.2 V
表面贴装	YES
技术	CMOS
端子面层	Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式	GULL WING
端子节距	0.5 mm
端子位置	QUAD
处于峰值回流温度下的最长时间	NOT SPECIFIED
宽度	20 mm
uPs/uCs/外围集成电路类型	DIGITAL SIGNAL PROCESSOR, OTHER

TMS320C6726RFP250相似产品对比

	TMS320C6726RFP250	TMS320C6727ZDH300	TMS320C6727GDH300	TMS320C6722RFPA225	TMS320C6726RFPA225	TMS320C6727GDH250	TMS320C6727GDHA250	TMS320C6727ZDH250	TMS320C6727ZDHA250	TMS320C6722RFP250
描述	IC FLOATING-POINT DSP 144-HTQFP	Digital Signal Processors & Controllers - DSP, DSC Floating-Pt Dig Sig Proc	Digital Signal Processors & Controllers - DSP, DSC Floating-Pt Dig Sig Proc	IC FLOATING POINT DSP 144-HTQFP	IC FLOATING POINT DSP 144-HTQFP	IC FLOATING POINT DSP 256-BGA	IC FLOATING POINT DSP 256-BGA	IC FLOATING POINT DSP 256-BGA	IC FLOATING POINT DSP 256-BGA	IC FLOATING-POINT DSP 144-HTQFP
是否Rohs认证	符合	符合	不符合	符合	符合	不符合	不符合	符合	符合	不符合
厂商名称	Texas Instruments(德州仪器)	Texas Instruments(德州仪器)	Texas Instruments(德州仪器)	Texas Instruments(德州仪器)	Texas Instruments(德州仪器)	Texas Instruments(德州仪器)	Texas Instruments(德州仪器)	Texas Instruments(德州仪器)	Texas Instruments(德州仪器)	Texas Instruments(德州仪器)
零件包装代码	QFP	BGA	BGA	QFP	QFP	BGA	BGA	BGA	BGA	QFP
包装说明	HTFQFP, TQFP144,.9SQ	BGA, BGA256,16X16,40	BGA, BGA256,16X16,40	HTFQFP, TQFP144,.9SQ	HTFQFP, TQFP144,.9SQ	BGA, BGA256,16X16,40	BGA, BGA256,16X16,40	BGA, BGA256,16X16,40	BGA, BGA256,16X16,40	HTFQFP, TQFP144,.9SQ
针数	144	256	256	144	144	256	256	256	256	144
Reach Compliance Code	unknown	unknow	_compli	unknown	unknown	not_compliant	not_compliant	unknown	unknown	not_compliant
其他特性	32 BIT FLOATING POINT; ALSO REQUIRES 3.3V SUPPLY	32 BIT FLOATING POINT; ALSO REQUIRES 3.3V SUPPLY	32 BIT FLOATING POINT; ALSO REQUIRES 3.3V SUPPLY	32 BIT FLOATING POINT; ALSO REQUIRES 3.3V SUPPLY	32 BIT FLOATING POINT; ALSO REQUIRES 3.3V SUPPLY	32 BIT FLOATING POINT; ALSO REQUIRES 3.3V SUPPLY	32 BIT FLOATING POINT; ALSO REQUIRES 3.3V SUPPLY	32 BIT FLOATING POINT; ALSO REQUIRES 3.3V SUPPLY	32 BIT FLOATING POINT; ALSO REQUIRES 3.3V SUPPLY	32 BIT FLOATING POINT; ALSO REQUIRES 3.3V SUPPLY
地址总线宽度	32	32	32	32	32	32	32	32	32	32
桶式移位器	NO	NO	NO	NO	NO	NO	NO	NO	NO	NO
位大小	32	32	32	32	32	32	32	32	32	32
边界扫描	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
最大时钟频率	25 MHz	25 MHz	25 MHz	25 MHz	25 MHz	25 MHz	25 MHz	25 MHz	25 MHz	25 MHz
外部数据总线宽度	32	32	32	32	32	32	32	32	32	32
格式	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT
内部总线架构	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE	MULTIPLE
JESD-30 代码	S-PQFP-G144	S-PBGA-B256	S-PBGA-B256	S-PQFP-G144	S-PQFP-G144	S-PBGA-B256	S-PBGA-B256	S-PBGA-B256	S-PBGA-B256	S-PQFP-G144
长度	20 mm	17 mm	17 mm	20 mm	20 mm	17 mm	17 mm	17 mm	17 mm	20 mm
低功率模式	NO	NO	NO	NO	NO	NO	NO	NO	NO	NO
端子数量	144	256	256	144	144	256	256	256	256	144
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	HTFQFP	BGA	BGA	HTFQFP	HTFQFP	BGA	BGA	BGA	BGA	HTFQFP
封装等效代码	TQFP144,.9SQ	BGA256,16X16,40	BGA256,16X16,40	TQFP144,.9SQ	TQFP144,.9SQ	BGA256,16X16,40	BGA256,16X16,40	BGA256,16X16,40	BGA256,16X16,40	TQFP144,.9SQ
封装形状	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
封装形式	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	GRID ARRAY	GRID ARRAY	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
峰值回流温度（摄氏度）	260	260	NOT SPECIFIED	260	260	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
电源	1.2,3.3 V	1.2,3.3 V	1.2,3.3 V	1.2,3.3 V	1.2,3.3 V	1.2,3.3 V	1.2,3.3 V	1.2,3.3 V	1.2,3.3 V	1.2,3.3 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
RAM（字数）	262144	262144	262144	262144	262144	262144	262144	262144	262144	262144
座面最大高度	1.2 mm	2.02 mm	2.02 mm	1.2 mm	1.2 mm	2.02 mm	2.02 mm	2.02 mm	2.02 mm	1.2 mm
最大供电电压	1.32 V	1.32 V	1.32 V	1.32 V	1.32 V	1.32 V	1.32 V	1.32 V	1.32 V	1.32 V
最小供电电压	1.14 V	1.14 V	1.14 V	1.14 V	1.14 V	1.14 V	1.14 V	1.14 V	1.14 V	1.14 V
标称供电电压	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
端子形式	GULL WING	BALL	BALL	GULL WING	GULL WING	BALL	BALL	BALL	BALL	GULL WING
端子节距	0.5 mm	1 mm	1 mm	0.5 mm	0.5 mm	1 mm	1 mm	1 mm	1 mm	0.5 mm
端子位置	QUAD	BOTTOM	BOTTOM	QUAD	QUAD	BOTTOM	BOTTOM	BOTTOM	BOTTOM	QUAD
处于峰值回流温度下的最长时间	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
宽度	20 mm	17 mm	17 mm	20 mm	20 mm	17 mm	17 mm	17 mm	17 mm	20 mm
uPs/uCs/外围集成电路类型	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER

TMS320C6726RFP250

TMS320C6726RFP250概述

TMS320C6726RFP250规格参数

TMS320C6726RFP250相似产品对比

推荐资源