OP-AMP, PDSO8
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | National Semiconductor(TI ) |
零件包装代码 | SOIC |
包装说明 | 3 X 3 MM, LLP-8 |
针数 | 8 |
Reach Compliance Code | not_compliant |
ECCN代码 | EAR99 |
放大器类型 | OPERATIONAL AMPLIFIER |
最大平均偏置电流 (IIB) | 35 µA |
标称共模抑制比 | 87 dB |
最大输入失调电压 | 700 µV |
JESD-30 代码 | S-PDSO-N8 |
JESD-609代码 | e0 |
长度 | 3 mm |
湿度敏感等级 | 1 |
功能数量 | 1 |
端子数量 | 8 |
最高工作温度 | 125 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | HVSON |
封装形状 | SQUARE |
封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
认证状态 | Not Qualified |
座面最大高度 | 0.8 mm |
标称压摆率 | 1500 V/us |
供电电压上限 | 6 V |
标称供电电压 (Vsup) | 3.3 V |
表面贴装 | YES |
温度等级 | AUTOMOTIVE |
端子面层 | Tin/Lead (Sn85Pb15) |
端子形式 | NO LEAD |
端子节距 | 0.5 mm |
端子位置 | DUAL |
宽度 | 3 mm |
LMH6629SDX | LM6629MFX | LMH6629MF | LMH6629_1011 | LMH6629 | LMH6629SDE | |
---|---|---|---|---|---|---|
描述 | OP-AMP, PDSO8 | OP-AMP, 700 uV OFFSET-MAX, PDSO5 | OP-AMP, 700 uV OFFSET-MAX, PDSO5 | OP-AMP, 700 uV OFFSET-MAX, PDSO5 | OP-AMP, 700 uV OFFSET-MAX, PDSO5 | OP-AMP, 700 uV OFFSET-MAX, PDSO8 |
放大器类型 | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OP-AMP | OP-AMP | OPERATIONAL AMPLIFIER |
最大输入失调电压 | 700 µV | 700 µV | 700 µV | 700 mV | 700 mV | 700 µV |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 8 | 5 | 5 | 5 | 5 | 8 |
表面贴装 | YES | YES | YES | Yes | Yes | YES |
温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
端子形式 | NO LEAD | GULL WING | GULL WING | GULL WING | GULL WING | NO LEAD |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
厂商名称 | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) | - | - | National Semiconductor(TI ) |
包装说明 | 3 X 3 MM, LLP-8 | TSSOP, | TSSOP, TSOP5/6,.11,37 | - | - | 3 X 3 MM, LLP-8 |
Reach Compliance Code | not_compliant | unknow | compliant | - | - | not_compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 | - | - | EAR99 |
最大平均偏置电流 (IIB) | 35 µA | 35 µA | 35 µA | - | - | 35 µA |
标称共模抑制比 | 87 dB | 87 dB | 87 dB | - | - | 87 dB |
JESD-30 代码 | S-PDSO-N8 | R-PDSO-G5 | R-PDSO-G5 | - | - | S-PDSO-N8 |
长度 | 3 mm | 2.92 mm | 2.92 mm | - | - | 3 mm |
最高工作温度 | 125 °C | 125 °C | 125 °C | - | - | 125 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | - | - | -40 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | - | PLASTIC/EPOXY |
封装代码 | HVSON | TSSOP | TSSOP | - | - | HVSON |
封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | - | - | SQUARE |
封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - | - | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
座面最大高度 | 0.8 mm | 1.19 mm | 1.19 mm | - | - | 0.8 mm |
标称压摆率 | 1500 V/us | 1500 V/us | 1500 V/us | - | - | 1500 V/us |
供电电压上限 | 6 V | 6 V | 6 V | - | - | 6 V |
标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | - | - | 3.3 V |
端子节距 | 0.5 mm | 0.953 mm | 0.953 mm | - | - | 0.5 mm |
宽度 | 3 mm | 1.6 mm | 1.6 mm | - | - | 3 mm |
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