OP-AMP, 700 uV OFFSET-MAX, PDSO5
运算放大器, 700 uV 最大补偿, PDSO5
| 参数名称 | 属性值 |
| 功能数量 | 1 |
| 端子数量 | 5 |
| 最大供电/工作电压 | 6 V |
| 最大工作温度 | 125 Cel |
| 最小工作温度 | -40 Cel |
| 额定供电电压 | 3.3 V |
| 额定旋转率 | 1500 V/us |
| 最大输入失调电压 | 700 mV |
| 加工封装描述 | SOT-23, 5 PIN |
| 状态 | ACTIVE |
| 包装形状 | RECTANGULAR |
| 包装尺寸 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 表面贴装 | Yes |
| 端子形式 | GULL WING |
| 端子间距 | 0.9530 mm |
| 端子涂层 | NOT SPECIFIED |
| 端子位置 | DUAL |
| 包装材料 | PLASTIC/EPOXY |
| 温度等级 | AUTOMOTIVE |
| 放大器类型 | OP-AMP |
| 额定共模抑制比 | 87 dB |
| 最大输入偏置电流IIB | -35 uA |
| LMH6629_1011 | LM6629MFX | LMH6629MF | LMH6629 | LMH6629SDE | LMH6629SDX | |
|---|---|---|---|---|---|---|
| 描述 | OP-AMP, 700 uV OFFSET-MAX, PDSO5 | OP-AMP, 700 uV OFFSET-MAX, PDSO5 | OP-AMP, 700 uV OFFSET-MAX, PDSO5 | OP-AMP, 700 uV OFFSET-MAX, PDSO5 | OP-AMP, 700 uV OFFSET-MAX, PDSO8 | OP-AMP, PDSO8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 5 | 5 | 5 | 5 | 8 | 8 |
| 最大输入失调电压 | 700 mV | 700 µV | 700 µV | 700 mV | 700 µV | 700 µV |
| 表面贴装 | Yes | YES | YES | Yes | YES | YES |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | NO LEAD | NO LEAD |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 放大器类型 | OP-AMP | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OP-AMP | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER |
| 厂商名称 | - | National Semiconductor（TI ） | National Semiconductor（TI ） | - | National Semiconductor（TI ） | National Semiconductor（TI ） |
| 包装说明 | - | TSSOP, | TSSOP, TSOP5/6,.11,37 | - | 3 X 3 MM, LLP-8 | 3 X 3 MM, LLP-8 |
| Reach Compliance Code | - | unknow | compliant | - | not_compliant | not_compliant |
| ECCN代码 | - | EAR99 | EAR99 | - | EAR99 | EAR99 |
| 最大平均偏置电流 (IIB) | - | 35 µA | 35 µA | - | 35 µA | 35 µA |
| 标称共模抑制比 | - | 87 dB | 87 dB | - | 87 dB | 87 dB |
| JESD-30 代码 | - | R-PDSO-G5 | R-PDSO-G5 | - | S-PDSO-N8 | S-PDSO-N8 |
| 长度 | - | 2.92 mm | 2.92 mm | - | 3 mm | 3 mm |
| 最高工作温度 | - | 125 °C | 125 °C | - | 125 °C | 125 °C |
| 最低工作温度 | - | -40 °C | -40 °C | - | -40 °C | -40 °C |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | - | TSSOP | TSSOP | - | HVSON | HVSON |
| 封装形状 | - | RECTANGULAR | RECTANGULAR | - | SQUARE | SQUARE |
| 封装形式 | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| 座面最大高度 | - | 1.19 mm | 1.19 mm | - | 0.8 mm | 0.8 mm |
| 标称压摆率 | - | 1500 V/us | 1500 V/us | - | 1500 V/us | 1500 V/us |
| 供电电压上限 | - | 6 V | 6 V | - | 6 V | 6 V |
| 标称供电电压 (Vsup) | - | 3.3 V | 3.3 V | - | 3.3 V | 3.3 V |
| 端子节距 | - | 0.953 mm | 0.953 mm | - | 0.5 mm | 0.5 mm |
| 宽度 | - | 1.6 mm | 1.6 mm | - | 3 mm | 3 mm |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
