OTP ROM, 32X8, 35ns, TTL, CDIP16
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) |
| 包装说明 | DIP, DIP16,.3 |
| Reach Compliance Code | unknown |
| 最长访问时间 | 35 ns |
| JESD-30 代码 | R-XDIP-T16 |
| JESD-609代码 | e0 |
| 内存集成电路类型 | OTP ROM |
| 内存宽度 | 8 |
| 端子数量 | 16 |
| 字数 | 32 words |
| 字数代码 | 32 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 组织 | 32X8 |
| 封装主体材料 | CERAMIC |
| 封装代码 | DIP |
| 封装等效代码 | DIP16,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-STD-883 Class C |
| 最大压摆率 | 0.11 mA |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | TTL |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| S82S23AF/883C | S82S23F/883B | N82S123AF | N82S123F-B | S82S123W/883B | N82S23NA | N82S123AN-B | N82US123D | N82S23FA | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | OTP ROM, 32X8, 35ns, TTL, CDIP16 | OTP ROM, 32X8, 65ns, TTL, CDIP16 | OTP ROM, 32X8, 25ns, TTL, CDIP16 | OTP ROM, 32X8, 50ns, TTL, CDIP16 | OTP ROM, 32X8, 65ns, TTL, CDFP16 | OTP ROM, 32X8, 50ns, TTL, PDIP16 | OTP ROM, 32X8, 25ns, TTL, PDIP16, | OTP ROM, 32X8, 10ns, TTL, PDSO16 | OTP ROM, 32X8, 50ns, TTL, CDIP16 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 包装说明 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DFP, FL16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | SOP, SOP16,.4 | DIP, DIP16,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| 厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) | - | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) |
| 最长访问时间 | 35 ns | 65 ns | 25 ns | 50 ns | 65 ns | - | 25 ns | 10 ns | 50 ns |
| JESD-30 代码 | R-XDIP-T16 | R-XDIP-T16 | R-XDIP-T16 | R-XDIP-T16 | R-XDFP-F16 | - | R-PDIP-T16 | R-PDSO-G16 | R-XDIP-T16 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | - | e0 | e0 | e0 |
| 内存集成电路类型 | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | - | OTP ROM | OTP ROM | OTP ROM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | - | 8 | 8 | 8 |
| 端子数量 | 16 | 16 | 16 | 16 | 16 | - | 16 | 16 | 16 |
| 字数 | 32 words | 32 words | 32 words | 32 words | 32 words | - | 32 words | 32 words | 32 words |
| 字数代码 | 32 | 32 | 32 | 32 | 32 | - | 32 | 32 | 32 |
| 最高工作温度 | 125 °C | 125 °C | 70 °C | 70 °C | 125 °C | - | 70 °C | 70 °C | 70 °C |
| 组织 | 32X8 | 32X8 | 32X8 | 32X8 | 32X8 | - | 32X8 | 32X8 | 32X8 |
| 封装主体材料 | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | - | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC |
| 封装代码 | DIP | DIP | DIP | DIP | DFP | - | DIP | SOP | DIP |
| 封装等效代码 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | FL16,.3 | - | DIP16,.3 | SOP16,.4 | DIP16,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | FLATPACK | - | IN-LINE | SMALL OUTLINE | IN-LINE |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | - | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | - | - | Not Qualified | Not Qualified |
| 最大压摆率 | 0.11 mA | 0.085 mA | 0.096 mA | 0.096 mA | 0.085 mA | - | 0.096 mA | 0.115 mA | 0.077 mA |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | - | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | NO | NO | YES | - | NO | YES | NO |
| 技术 | TTL | TTL | TTL | TTL | TTL | - | TTL | TTL | TTL |
| 温度等级 | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL | MILITARY | - | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | FLAT | - | THROUGH-HOLE | GULL WING | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | - | 2.54 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | - | DUAL | DUAL | DUAL |
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