I2C/2-WIRE SERIAL EEPROM
| 参数名称 | 属性值 |
| 厂商名称 | Microchip(微芯科技) |
| 包装说明 | TDFN-8 |
| Reach Compliance Code | compliant |
| 最大时钟频率 (fCLK) | 1 MHz |
| 数据保留时间-最小值 | 200 |
| 耐久性 | 1000000 Write/Erase Cycles |
| I2C控制字节 | 1010DDDR |
| JESD-30 代码 | R-PDSO-N8 |
| 长度 | 3 mm |
| 内存密度 | 262144 bit |
| 内存集成电路类型 | EEPROM |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 字数 | 32768 words |
| 字数代码 | 32000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 组织 | 32KX8 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | HVSON |
| 封装等效代码 | SOLCC8,.11,20 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| 并行/串行 | SERIAL |
| 编程电压 | 5 V |
| 筛选级别 | TS 16949 |
| 座面最大高度 | 0.8 mm |
| 串行总线类型 | I2C |
| 最大待机电流 | 0.000005 A |
| 最大压摆率 | 0.003 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 1.7 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | DUAL |
| 宽度 | 2 mm |
| 最长写入周期时间 (tWC) | 5 ms |
| 写保护 | HARDWARE |
| 24FC256T-E/MNY | 24LC256-E/SMRVA | 24LC256T-E/SMRVA | 24LC256T-E/STRVE | 24LC256T-E/SNRVE | 24AA256-E/MNY | 24LC256-E/MNY | 24FC256-E/MNY | |
|---|---|---|---|---|---|---|---|---|
| 描述 | I2C/2-WIRE SERIAL EEPROM | 32K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 5.28 MM, ROHS COMPLIANT, PLASTIC, SOIJ-8 | 32K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 5.28 MM, ROHS COMPLIANT, PLASTIC, SOIJ-8 | EEPROM, 32KX8, Serial, CMOS, PDSO8 | EEPROM, 32KX8, Serial, CMOS, PDSO8 | I2C/2-WIRE SERIAL EEPROM | I2C/2-WIRE SERIAL EEPROM | I2C/2-WIRE SERIAL EEPROM |
| 包装说明 | TDFN-8 | SOP, | SOP, | TSSOP, | SOP, | TDFN-8 | TDFN-8 | TDFN-8 |
| Reach Compliance Code | compliant | compli | compli | compliant | compliant | compliant | compliant | compli |
| 最大时钟频率 (fCLK) | 1 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz | 1 MHz |
| JESD-30 代码 | R-PDSO-N8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-N8 | R-PDSO-N8 | R-PDSO-N8 |
| 长度 | 3 mm | 5.26 mm | 5.26 mm | 4.4 mm | 4.9 mm | 3 mm | 3 mm | 3 mm |
| 内存密度 | 262144 bit | 262144 bi | 262144 bi | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bi |
| 内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 字数 | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words |
| 字数代码 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 组织 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | HVSON | SOP | SOP | TSSOP | SOP | HVSON | HVSON | HVSON |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| 并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| 座面最大高度 | 0.8 mm | 2.03 mm | 2.03 mm | 1.2 mm | 1.75 mm | 0.8 mm | 0.8 mm | 0.8 mm |
| 串行总线类型 | I2C | I2C | I2C | I2C | I2C | I2C | I2C | I2C |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 1.7 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 1.7 V | 2.5 V | 1.7 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子形式 | NO LEAD | GULL WING | GULL WING | GULL WING | GULL WING | NO LEAD | NO LEAD | NO LEAD |
| 端子节距 | 0.5 mm | 1.27 mm | 1.27 mm | 0.65 mm | 1.27 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 2 mm | 5.25 mm | 5.25 mm | 3 mm | 3.9 mm | 2 mm | 2 mm | 2 mm |
| 最长写入周期时间 (tWC) | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms |
| 厂商名称 | Microchip(微芯科技) | - | - | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) |
| 数据保留时间-最小值 | 200 | 200 | 200 | 200 | 200 | 200 | 200 | - |
| 筛选级别 | TS 16949 | - | - | TS 16949 | TS 16949 | AEC-Q100 | AEC-Q100 | TS 16949 |
| 标称供电电压 (Vsup) | 5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | - | - | 2.5 V |
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