Video Amplifier, 1 Channel(s), Bipolar, MBCY8, METAL CAN, TO-99, 10 PIN
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | AMD(超微) |
零件包装代码 | TO-99 |
包装说明 | TO-99, CAN10,.23 |
针数 | 8 |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
标称带宽 | 120000 kHz |
商用集成电路类型 | VIDEO AMPLIFIER |
增益 | 52.04 dB |
JESD-30 代码 | O-MBCY-W8 |
JESD-609代码 | e0 |
信道数量 | 1 |
端子数量 | 8 |
最高工作温度 | 70 °C |
最低工作温度 | |
封装主体材料 | METAL |
封装代码 | TO-99 |
封装等效代码 | CAN10,.23 |
封装形状 | ROUND |
封装形式 | CYLINDRICAL |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | +-6 V |
认证状态 | Not Qualified |
最大压摆率 | 27 mA |
最大供电电压 (Vsup) | 6 V |
最小供电电压 (Vsup) | 6 V |
表面贴装 | NO |
技术 | BIPOLAR |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | WIRE |
端子位置 | BOTTOM |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
733HC | 733FM | AM733DM | AM733FM | 733DM | 733DC | 733HM | 733XC | 733XM | |
---|---|---|---|---|---|---|---|---|---|
描述 | Video Amplifier, 1 Channel(s), Bipolar, MBCY8, METAL CAN, TO-99, 10 PIN | Video Amplifier, 1 Channel(s), Bipolar, CDFP10, HERMETIC SEALED, FP-10 | Video Amplifier, 1 Channel(s), 1 Func, CDIP14, HERMETIC SEALED, DIP-14 | Video Amplifier, 1 Channel(s), 1 Func, CDFP10, HERMETIC SEALED, FP-10 | Video Amplifier, 1 Channel(s), Bipolar, CDIP14, HERMETIC SEALED, DIP-14 | Video Amplifier, 1 Channel(s), Bipolar, CDIP14, HERMETIC SEALED, DIP-14 | Video Amplifier, 1 Channel(s), Bipolar, MBCY8, METAL CAN, TO-99, 10 PIN | Video Amplifier, 1 Channel(s), Bipolar, 0.041 X 0.041 INCH, DIE-10 | Video Amplifier, 1 Channel(s), Bipolar, 0.041 X 0.041 INCH, DIE-10 |
零件包装代码 | TO-99 | DFP | DIP | DFP | DIP | DIP | TO-99 | DIE | DIE |
包装说明 | TO-99, CAN10,.23 | DFP, FL10,.3 | HERMETIC SEALED, DIP-14 | HERMETIC SEALED, FP-10 | DIP, DIP14,.3 | DIP, DIP14,.3 | TO-99, CAN10,.23 | DIE, DIE OR CHIP | DIE, DIE OR CHIP |
针数 | 8 | 10 | 14 | 10 | 14 | 14 | 8 | 10 | 10 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
标称带宽 | 120000 kHz | 120000 kHz | 120000 kHz | 120000 kHz | 120000 kHz | 120000 kHz | 120000 kHz | 120000 kHz | 120000 kHz |
商用集成电路类型 | VIDEO AMPLIFIER | VIDEO AMPLIFIER | VIDEO AMPLIFIER | VIDEO AMPLIFIER | VIDEO AMPLIFIER | VIDEO AMPLIFIER | VIDEO AMPLIFIER | VIDEO AMPLIFIER | VIDEO AMPLIFIER |
增益 | 52.04 dB | 52.04 dB | 52.04 dB | 52.04 dB | 52.04 dB | 52.04 dB | 52.04 dB | 52.04 dB | 52.04 dB |
JESD-30 代码 | O-MBCY-W8 | R-CDFP-F10 | R-CDIP-T14 | R-CDFP-F10 | R-CDIP-T14 | R-CDIP-T14 | O-MBCY-W8 | S-XUUC-N10 | S-XUUC-N10 |
信道数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 8 | 10 | 14 | 10 | 14 | 14 | 8 | 10 | 10 |
最高工作温度 | 70 °C | 125 °C | 125 °C | 125 °C | 125 °C | 70 °C | 125 °C | 70 °C | 125 °C |
最低工作温度 | - | -55 °C | -55 °C | -55 °C | -55 °C | - | -55 °C | - | -55 °C |
封装主体材料 | METAL | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | METAL | UNSPECIFIED | UNSPECIFIED |
封装代码 | TO-99 | DFP | DIP | DFP | DIP | DIP | TO-99 | DIE | DIE |
封装形状 | ROUND | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | ROUND | SQUARE | SQUARE |
封装形式 | CYLINDRICAL | FLATPACK | IN-LINE | FLATPACK | IN-LINE | IN-LINE | CYLINDRICAL | UNCASED CHIP | UNCASED CHIP |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大供电电压 (Vsup) | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V |
最小供电电压 (Vsup) | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V |
表面贴装 | NO | YES | NO | YES | NO | NO | NO | YES | YES |
温度等级 | COMMERCIAL | MILITARY | MILITARY | MILITARY | MILITARY | COMMERCIAL | MILITARY | COMMERCIAL | MILITARY |
端子形式 | WIRE | FLAT | THROUGH-HOLE | FLAT | THROUGH-HOLE | THROUGH-HOLE | WIRE | NO LEAD | NO LEAD |
端子位置 | BOTTOM | DUAL | DUAL | DUAL | DUAL | DUAL | BOTTOM | UPPER | UPPER |
是否Rohs认证 | 不符合 | 不符合 | - | - | 不符合 | 不符合 | 不符合 | - | - |
厂商名称 | AMD(超微) | - | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) |
JESD-609代码 | e0 | e0 | - | - | e0 | e0 | e0 | - | - |
封装等效代码 | CAN10,.23 | FL10,.3 | - | - | DIP14,.3 | DIP14,.3 | CAN10,.23 | DIE OR CHIP | DIE OR CHIP |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - |
电源 | +-6 V | +-6 V | - | - | +-6 V | +-6 V | +-6 V | +-6 V | +-6 V |
最大压摆率 | 27 mA | 27 mA | - | - | 27 mA | 27 mA | 27 mA | 27 mA | 27 mA |
技术 | BIPOLAR | BIPOLAR | - | - | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | - |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - |
长度 | - | 6.477 mm | 19.431 mm | 6.477 mm | 19.431 mm | 19.431 mm | - | - | - |
座面最大高度 | - | 2.032 mm | 5.08 mm | 2.032 mm | 5.08 mm | 5.08 mm | - | - | - |
端子节距 | - | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | - | - | - |
宽度 | - | 6.35 mm | 7.62 mm | 6.35 mm | 7.62 mm | 7.62 mm | - | - | - |
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